LPC2420FBD208-S NXP Semiconductors, LPC2420FBD208-S Datasheet - Page 52

• Manufacturer Part Number: LPC2420FBD208-S
• Description: MCU 16-Bit/32-Bit LPC2000 ARM7TDMI-S RISC ROMLess 3.3V 208-Pin LQFP Tray
• Manufacturer: NXP Semiconductors

Specifications of LPC2420FBD208-S

• Package: 208LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Ram Size: 82 KB
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16|32 Bit
• Program Memory Type: ROMLess
• Number Of Programmable I/os: 160
• Interface Type: I2C/I2S/SPI/SSP/UART/USB
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 1-chx10-bit
• Operating Temperature: -40 to 85 °C
• Number Of Timers: 4

NXP Semiconductors
LPC2420_60_5
Preliminary data sheet
9.2 Deep power-down mode
Fig 7.
Fig 8.
I
DD(DCDC)pd(3v3)
I
DD(IO)
(μA)
300
200
100
800
600
400
200
(μA)
V
Total DC-to-DC converter supply current I
in Power-down mode
I/O maximum supply current I
mode
V
0
0
DD(3V3)
−40
−40
DD(3V3)
= V
= V
i(VBAT)
DD(DCDC)(3V3)
Rev. 05 — 24 February 2010
V
V
−15
−15
= 3.3 V; T
DD(DCDC)(3V3)
DD(DCDC)(3V3)
V
V
DD(3V3)
DD(3V3)
= 3.3 V; T
amb
= 3.3 V
= 3.0 V
= 3.3 V
= 3.0 V
= 25 °C.
10
10
amb
DD(IO)
= 25 °C.
versus temperature in Deep power-down
Flashless 16-bit/32-bit microcontroller
DD(DCDC)pd(3V3)
35
35
LPC2420/2460
at different temperatures
60
60
temperature (°C)
temperature (°C)
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© NXP B.V. 2010. All rights reserved.
002aae051
85
85
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