LPC2420FBD208-S NXP Semiconductors, LPC2420FBD208-S Datasheet - Page 73

• Manufacturer Part Number: LPC2420FBD208-S
• Description: MCU 16-Bit/32-Bit LPC2000 ARM7TDMI-S RISC ROMLess 3.3V 208-Pin LQFP Tray
• Manufacturer: NXP Semiconductors

Specifications of LPC2420FBD208-S

• Package: 208LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Ram Size: 82 KB
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16|32 Bit
• Program Memory Type: ROMLess
• Number Of Programmable I/os: 160
• Interface Type: I2C/I2S/SPI/SSP/UART/USB
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 1-chx10-bit
• Operating Temperature: -40 to 85 °C
• Number Of Timers: 4

NXP Semiconductors
Fig 29. Package outline SOT950-1 (TFBGA208)
LPC2420_60_5
Preliminary data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT950-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
G
U
R
N
L
J
E
C
A
0.8
0.6
A
2
1
IEC
2
0.5
0.4
3
b
4
5
15.1
14.9
6
D
e
7
8
15.1
14.9
e
D
9
JEDEC
E
1
10
- - -
11
REFERENCES
12
0.8
e
13
Rev. 05 — 24 February 2010
0
14
12.8
15
e
b
1
16
17
12.8
JEITA
e
2
scale
5
B
e
0.15
∅ v
∅ w
v
e
A
E
M
M
2
0.08
C
C
w
A
10 mm
B
0.12
y
A
Flashless 16-bit/32-bit microcontroller
0.1
y
A
1
2
A
1
y
1
PROJECTION
EUROPEAN
C
LPC2420/2460
detail X
C
X
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
06-06-01
06-06-14
SOT950-1
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