CL21B103KCANNNC SAMSUNG, CL21B103KCANNNC Datasheet - Page 18

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CL21B103KCANNNC

Manufacturer Part Number
CL21B103KCANNNC
Description
MLCC 0805 X5R 10NF 10% 100V
Manufacturer
SAMSUNG
Series
CLr
Datasheets

Specifications of CL21B103KCANNNC

Size
0905
Dielectric
X7R
Tolerance
+/- 10%
Voltage
100V
Thickness
0.65
Electrode/termination/platin
Ni/Cu/Sn 100%
Products
Normal
● ADHESIVES
▶ Requirements for Adhesives
▶ Application Method
▶ Adhesive hardening Characteristics
● MOUNTING
▶ Mounting Head Pressure
mounting.
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during
or less
To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes
circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly. They should not corrode the circuit board or chip material.
They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be
harmful when touched.
adhesion and overflow into the land, respectively.
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
They must have enough adhesion, so that, the chips will not fall off or move during the handling of the
It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor
PCB
.
Land
c
a
a
Solder Resist
c
b
Type
a
b
c
70~100 ㎛
0.2 min
> 0
21
70~100 ㎛
0.2 min
unit : mm
> 0
31

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