LM567CMX/NOPB National Semiconductor, LM567CMX/NOPB Datasheet - Page 9

• Manufacturer Part Number: LM567CMX/NOPB
• Description: IC TONE DECODR PHAS LOC LP 8SOIC
• Manufacturer: National Semiconductor

Specifications of LM567CMX/NOPB

• Function: Tone Decoder
• Number Of Circuits: 1
• Voltage - Supply: 4.75 V ~ 9 V
• Current - Supply: 12mA
• Power (watts): 1.10W
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Frequency (max): 500kHz
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 9V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Package Type: SOIC N
• Mounting: Surface Mount
• Pin Count: 8
• Supply Current: 12mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Compliant
• Other names: LM567CMX/NOPBTR

LM567C MDC MWC
TONE DECODER
DIE/WAFER CHARACTERISTICS
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
SIGNAL NAME
OUTPUT
FILTER
LOOP FILTER
INPUT
V+
TIMING RES
TIMING CAP
GND
OUTPUT
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
1
2
3
4
5
6
7
8
Die Bond Pad Coordinate Locations (C - Step)
-673
-673
-673
-356
-318
673
673
178
LM567C
C
150mm
1600µm x 1626µm
63.0mils x 64.0mils
406µm Nominal
198µm Nominal
X/Y COORDINATES
X
Die Layout (C - Step)
9
-419
-686
-686
-122
686
686
679
76
Y
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
00697523
117
117
General Die Information
91
91
91
91
91
91
X
PAD SIZE
x
x
x
x
x
x
x
x
91µm x 91µm
0.5% COPPER_BAL.
ALUMINUM
VOM NITRIDE
BARE BACK
Floating
www.national.com
104
91
91
91
91
91
91
91
Y