SI3225-G-GQ Silicon Laboratories Inc, SI3225-G-GQ Datasheet - Page 4

IC PROSLIC/CODEC DUAL 64TQFP

SI3225-G-GQ

Manufacturer Part Number
SI3225-G-GQ
Description
IC PROSLIC/CODEC DUAL 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
ProSLIC®r
Datasheet

Specifications of SI3225-G-GQ

Function
Subscriber Line Interface Concept (SLIC), CODEC
Interface
GCI, PCM, SPI
Number Of Circuits
2
Voltage - Supply
3.3V, 5V
Current - Supply
65mA
Power (watts)
941mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TQFP, 64-VQFP
Includes
Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI3225-G-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
SI3225-G-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Table 1. Absolute Maximum Ratings and Thermal Information
Si3220/25 Si3200/02
1. Electrical Specifications
4
Si3220/Si3225
Supply Voltage
STIPAC, STIPDC, SRINGAC, SRINGDC Current
Input Current, Digital Pins
Input Voltage, Digital Pins
Analog Ground Differential Voltage
(GND1 to ePad, GND2 to ePad or GND1 to GND2)
Digital Ground Differential Voltage
(GND3 to GND4)
Si3200
Supply Voltage
High Battery Supply Voltage
Low Battery Supply Voltage
TIP or RING Voltage
TIP or RING Current
Si3202
Supply Voltage
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded, and exposure to absolute
2. The PCB pad placed under the device package must be connected with multiple vias to the PCB ground layer and to
3. On Si3200 revision E, the dv/dt of the voltage applied to the V
4. Operation of the Si3220/Si3225 above 125 °C junction temperature may degrade device reliability. The Si3200/Si3202
5. The thermal resistance of an exposed pad package is assured when the recommended printed circuit board layout
maximum rating conditions for extended periods may affect device reliability. Functional operation should be restricted
to the conditions as specified in the operational sections of this data sheet.
the GND1-GND4 pins via short traces. The TQFP-64 e-Pad must be properly soldered to the PCB pad during PCB
assembly. This type of low-impedance grounding arrangement is necessary to ensure that maximum differentials are
not exceeded under any operating condition in addition to providing thermal dissipation.
should be operated at a junction temperature below 140 °C for optimal reliability.
guidelines are followed correctly. The specified performance requires that the exposed pad be soldered to an exposed
copper surface of equal size and that multiple vias are added to enable heat transfer between the top-side copper
surface and a large internal copper ground plane. Refer to “AN55: Dual ProSLIC
evaluation board data sheet for specific layout examples.
2
Parameter
3
2
Rev. 1.3
I
Symbol
TIP
V
V
V
V
V
V
V
V
V
V
BATH
RING
, I
BATL
DD1-
I
BAT
DD4
IND
TIP
IN
DD
DD
RING
,
,
BAT
, V
Test Condition
Pulse < 10 us
BATH
Pulse < 4 us
Continuous
Continuous
Continuous
∆V
∆V
10 ms
1
, and V
GNDA
GNDD
BATL
®
User Guide” or to the Si3220/3225
pins must be limited to 10 V/µs.
V
V
BATH
BATH
V
–104
–109
–104
–100
–0.5
–0.3
–0.5
–0.5
Min
–20
–10
–50
–50
BATH
–15
–35
V
DDD
+100
Max
+20
+10
+50
+50
6.0
6.0
0.4
0.4
0.4
0.4
0.4
0.4
6.0
+0.3
Unit
mA
mA
mV
mV
mA
V
V
V
V
V
V
V
V
V
V

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