TJA1042T NXP Semiconductors, TJA1042T Datasheet
TJA1042T
Specifications of TJA1042T
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TJA1042T Summary of contents
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... Dark green product (halogen free and Restriction of Hazardous Substances (RoHS) compliant) 2.2 Low-power management Very low-current Standby mode with host and bus wake-up capability Functional behavior predictable under all supply conditions input on TJA1042T/3 and TJA1042TK/3 allows for direct interfacing with Product data sheet ...
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... Type number Package Name TJA1042T SO8 TJA1042T/3 SO8 TJA1042TK/3 HVSON8 [1] TJA1042T with SPLIT pin; TJA1042T/3 and TJA1042TK/3 with V TJA1042 Product data sheet High-speed CAN transceiver with Standby mode and V CC Conditions Standby mode Normal mode; bus recessive Normal mode; bus dominant IEC 61000-4-2 at pins CANH and CANL no time limit ...
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... NXP Semiconductors 5. Block diagram TXD STB RXD ( transceiver with a SPLIT pin, the V Fig 1. TJA1042 Product data sheet High-speed CAN transceiver with Standby mode TEMPERATURE PROTECTION ( TIME-OUT ( MODE CONTROL 8 4 MUX AND DRIVER Block diagram All information provided in this document is subject to legal disclaimers. ...
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... TJA1042T version only 5 supply voltage for I/O level adapter; in TJA1042T/3 and TJA1042TK/3 versions only 6 LOW-level CAN bus line 7 HIGH-level CAN bus line 8 Standby mode control input All information provided in this document is subject to legal disclaimers. Rev. 6 — ...
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... DC handling capability on the bus pins provide additional application flexibility. The TJA1042 is available in two versions, distinguished only by the function of pin 5: • The TJA1042T is 100 % backwards compatible with the TJA1040, and also covers existing PCA82C250 and PCA82C251 applications • The TJA1042T/3 and TJA1042TK/3 allow for direct interfacing to microcontrollers with supply voltages down ...
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... Two versions of the TJA1042 are available, only differing in the function of a single pin. Pin 5 is either a SPLIT output pin 7.3.1 SPLIT pin Using the SPLIT pin on the TJA1042T in conjunction with a split termination network (see Figure 3 will reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with poor bus leakage performance) ...
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... V = 0.5 V SPLIT CC in normal mode; otherwise floating Stabilization circuitry and application for version with SPLIT pin on the TTJA1042T/3 and TJA1042TK/3 should be connected to the Figure Conditions no time limit; DC value on pins CANH, CANL and SPLIT on any other pin on pins CANH and CANL All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V electrostatic discharge voltage ESD T virtual junction temperature vj T storage temperature stg [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. IEC 61000-4-2 (150 pF, 330 ...
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... O(dom) V transmitter dominant voltage dom(TX)sym symmetry TJA1042 Product data sheet High-speed CAN transceiver with Standby mode …continued [ [2] Conditions Standby mode TJA1042T; includes I TJA1042T/3 or TJA1042TK/3 Normal mode recessive TXD IO dominant TXD [1] IO Standby mode TXD Normal mode recessive; V ...
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... R differential input resistance i(dif) C common-mode input i(cm) capacitance differential input capacitance C i(dif) Common mode stabilization output; pin SPLIT; only for TJA1042T V output voltage O I leakage current L Temperature detection T shutdown junction j(sd) temperature [1] Only TJA1042T/3 and TJA1042TK/3 have a V [2] All parameters are guaranteed over the virtual junction temperature range by design ...
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... Only TJA1042T/3 and TJA1042TK/3 have a V [2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. (1) For versions with a V Fig 4 ...
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... High-speed CAN transceiver with Standby mode 0. d(busdom-RXD) t PD(TXD-RXD) CAN transceiver timing diagram 5 V BAT CANH CANH SPLIT TJA1042T CANL CANL Typical application with TJA1042T and microcontroller. All information provided in this document is subject to legal disclaimers. Rev. 6 — 23 March 2011 0 d(TXD-busrec) t PD(TXD-RXD STB DD Pxx Pyy ...
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... INH CANH CANH TJA1042T/3 TJA1042TK/3 CANL CANL Switching off the 5 V supply in Standby mode (dotted line) is optional. Typical application with TJA1042T/3 or TJA1042TK/3 and microcontroller. All information provided in this document is subject to legal disclaimers. Rev. 6 — 23 March 2011 STB DD Pxx MICRO- CONTROLLER TXD ...
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... NXP Semiconductors 14. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area Dimensions (1) Unit max 1.00 0.05 0.35 mm nom 0.85 0.03 0.30 0.2 min 0.80 0.00 0.25 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • ...
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... NXP Semiconductors 18. Revision history Table 11. Revision history Document ID Release date TJA1042 v.6 20110323 • Modifications Section • Section • Table 5: parameter T • Table 7: measuring conditions for parameters I TJA1042 v.5 20110118 TJA1042 v.4 20091006 TJA1042 v.3 20090825 TJA1042 v.2 20090708 TJA1042 v.1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 Normal mode ...