552AD000226DG

Manufacturer Part Number552AD000226DG
ManufacturerSilicon Laboratories Inc
552AD000226DG datasheets

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Specifications of 552AD000226DG

Lead Free Status / Rohs StatusCompliant  
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Si 552
Table 7. CLK± Output Phase Noise (Typical)
Offset Frequency
74.25 MHz
90 ppm/V
LVPECL
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
10 MHz
100 MHz
Table 8. Absolute Maximum Ratings
Parameter
Maximum Operating Temperature
Supply Voltage
Input Voltage (any input pin)
Storage Temperature
ESD Sensitivity (HBM, per JESD22-A114)
Soldering Temperature (Pb-free profile)
Soldering Temperature Time @ T
PEAK
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download from
www.silabs.com/VCXO
for further information, including soldering profiles.
Table 9. Environmental Compliance
The Si552 meets the following qualification test requirements.
Parameter
Mechanical Shock
Mechanical Vibration
Solderability
Gross & Fine Leak
Resistance to Solvents
6
491.52 MHz
45 ppm/V
LVPECL
–87
–75
–114
–100
–132
–116
–142
–124
–148
–135
–150
–146
n/a
–147
1
Symbol
T
AMAX
V
DD
V
I
T
S
ESD
2
T
PEAK
2
(Pb-free profile)
t
P
MIL-STD-883F, Method 2002.3 B
MIL-STD-883F, Method 2007.3 A
MIL-STD-883F, Method 1014.7
Rev. 0.6
622.08 MHz
Units
135 ppm/V
LVPECL
–65
–90
–109
–121
dBc/Hz
–134
–146
–147
Rating
Units
85
ºC
–0.5 to +3.8
Volts
–0.5 to V
+ 0.3
Volts
DD
–55 to +125
ºC
2500
Volts
260
ºC
20–40
seconds
Conditions/Test Method
MIL-STD-883F, Method 203.8
MIL-STD-883F, Method 2016