IC AMP AUDIO PWR 1.2W MONO 8MSOP

TS4990IST

Manufacturer Part NumberTS4990IST
DescriptionIC AMP AUDIO PWR 1.2W MONO 8MSOP
ManufacturerSTMicroelectronics
TypeClass AB
TS4990IST datasheet
 


Specifications of TS4990IST

Output Type1-Channel (Mono)Max Output Power X Channels @ Load1.2W x 1 @ 8 Ohm
Voltage - Supply2.2 V ~ 5.5 VFeaturesDepop, Differential Inputs, Standby, Thermal Protection
Mounting TypeSurface MountPackage / Case8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
For Use With497-6383 - BOARD DEMO FOR TS4990Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other names497-4451-2  
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1.2 W audio power amplifier with active low standby mode
Features
Operating range from V
CC
1.2 W output power @ V
CC
F = 1 kHz, with 8Ω load
Ultra-low consumption in standby mode (10 nA)
62 dB PSRR at 217 Hz in grounded mode
Near-zero pop and click
Ultra-low distortion (0.1%)
Unity gain stable
Available in 9-bump flip-chip, miniSO-8 and
DFN8 packages
Applications
Mobile phones (cellular / cordless)
Laptop / notebook computers
PDAs
Portable audio devices
Description
The TS4990 is designed for demanding audio
applications such as mobile phones to reduce the
number of external components.
This audio power amplifier is capable of delivering
1.2 W of continuous RMS output power into an 8Ω
load at 5 V.
An externally controlled standby mode reduces
the supply current to less than 10 nA. It also
includes an internal thermal shutdown protection.
The unity-gain stable amplifier can be configured
by external gain setting resistors.
May 2008
TS4990IJT/TS4990EIJT - Flip-chip 9 bumps
= 2.2 V to 5.5 V
= 5 V, THD = 1%,
STANDBY
STANDBY
BYPASS
BYPASS
Rev 12
TS4990
Vin+
Vin+
VCC
VCC
STBY
STBY
VOUT1
VOUT1
GND
GND
VOUT2
VOUT2
Vin-
Vin-
GND
GND
BYPASS
BYPASS
TS4990IST - MiniSO-8
TS4990IQT - DFN8
8
8
1
1
7
7
BYPASS
BYPASS
2
2
V
V
6
6
3
3
IN+
IN+
V
V
5
5
4
4
IN-
IN-
TS4990ID/TS4990IDT - SO-8
STBY
STBY
1
1
8
8
2
2
7
7
VIN+
VIN+
3
3
6
6
4
4
5
5
VIN-
VIN-
V
V
OUT 2
OUT 2
GND
GND
Vcc
Vcc
V
V
OUT 1
OUT 1
VOUT2
VOUT2
GND
GND
V
V
CC
CC
VOUT1
VOUT1
1/32
www.st.com
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TS4990IST Summary of contents

  • Page 1

    ... May 2008 TS4990IJT/TS4990EIJT - Flip-chip 9 bumps = 2 5 THD = 1%, STANDBY STANDBY BYPASS BYPASS Rev 12 TS4990 Vin+ Vin+ VCC VCC STBY STBY VOUT1 VOUT1 GND GND VOUT2 VOUT2 Vin- Vin- GND GND BYPASS BYPASS TS4990IST - MiniSO-8 TS4990IQT - DFN8 BYPASS BYPASS IN+ IN IN- IN- TS4990ID/TS4990IDT - SO-8 ...

  • Page 2

    Contents Contents 1 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3 2 Typical application schematics . . . . . . . . . . . . . ...

  • Page 3

    TS4990 1 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings (AMR) Symbol (1) V Supply voltage CC (2) V Input voltage in T Operating free-air temperature range oper T Storage temperature stg T Maximum junction temperature j ...

  • Page 4

    Typical application schematics 2 Typical application schematics Figure 1. Typical application schematics Cin Audio In Standby Control Table 3. Component descriptions Component Inverting input resistor that sets the closed loop gain in conjunction with resistor also forms ...

  • Page 5

    TS4990 3 Electrical characteristics Table 4. Electrical characteristics when V (unless otherwise specified) Symbol Supply current input signal, no load Standby current I STBY No input signal, V Output offset voltage input signal, R ...

  • Page 6

    Electrical characteristics Table 5. Electrical characteristics when V (unless otherwise specified) Symbol Supply current input signal, no load Standby current I STBY No input signal, V Output offset voltage input signal, R Output power ...

  • Page 7

    TS4990 Table 6. Electrical characteristics when V otherwise specified) Symbol Supply current input signal, no load Standby current I STBY No input signal, V Output offset voltage input signal, R Output power P out ...

  • Page 8

    Electrical characteristics Figure 2. Open loop frequency response 60 Gain 40 Phase 20 0 -20 Vcc = 5V - Ω Tamb = 25 ° C -60 0 100 Frequency (kHz) Figure 4. Open loop frequency ...

  • Page 9

    TS4990 Figure 8. PSRR vs. power supply 0 Vripple = 200mVpp - Input = Grounded - Cin = 1 μ F Vcc : RL >= 4 Ω 2.2V -30 Tamb = 25 ° C 2.6V ...

  • Page 10

    Electrical characteristics Figure 14. PSRR vs. DC output voltage 0 Vcc = 5V -10 Vripple = 200mVpp Ω μ Tamb = 25 ° C -30 -40 -50 -60 -70 ...

  • Page 11

    TS4990 Figure 20. PSRR vs. DC output voltage 0 Vcc = 2.6V Vripple = 200mVpp - Ω μ Tamb = 25 ° C -30 -40 -50 -60 -70 -2.5 ...

  • Page 12

    Electrical characteristics Figure 26. Output power vs. power supply voltage 1 Ω 1kHz 1.0 BW < 125kHz Tamb = 25 ° C 0.8 THD+N=10% 0.6 0.4 0.2 0.0 2.5 3.0 3.5 4.0 Vcc (V) Figure ...

  • Page 13

    TS4990 Figure 32. Power dissipation vs. P 0.6 Vcc=3.3V F=1kHz 0.5 THD+N<1% 0.4 0.3 0.2 0.1 RL=16 Ω 0.0 0.0 0.1 0.2 0.3 0.4 Output Power (W) Figure 34. Clipping voltage vs. power supply voltage and load resistor 0.7 Tamb ...

  • Page 14

    Electrical characteristics Figure 38. Current consumption vs. standby voltage @ 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Standby Voltage (V) Figure 40. THD + N vs. output power ...

  • Page 15

    TS4990 Figure 44. THD + N vs. output power Ω 20kHz μ F Vcc=2. < 125kHz Tamb = 25 ° C Vcc=2.6V 0.1 Vcc=3.3V 0.01 1E-3 ...

  • Page 16

    Electrical characteristics Figure 50. THD + N vs. output power Ω 20kHz μ F Vcc=2. < 125kHz Tamb = 25 ° C Vcc=2.6V 0.1 Vcc=3.3V 0.01 ...

  • Page 17

    TS4990 Figure 56. Signal to noise ratio vs. power supply with a weighted filter 110 RL=16 Ω 105 100 RL=4 Ω μ THD+N < 0.7% Tamb = 25 ° C ...

  • Page 18

    Application information 4 Application information 4.1 BTL configuration principle The TS4990 is a monolithic power amplifier with a BTL output type. BTL (bridge tied load) means that each end of the load is connected to two single-ended output amplifiers. Thus, ...

  • Page 19

    TS4990 The graph in Figure 60 Figure 60. Frequency response gain vs. C 4.4 Power dissipation and efficiency Hypotheses: ● Load voltage and current are sinusoidal (V ● Supply voltage is a pure DC source (V The load can be ...

  • Page 20

    Application information Therefore, the power dissipated by each amplifier is diss supply and the maximum value is obtained when: and its value is: Note: This maximum value is only dependent on power supply voltage and load values. ...

  • Page 21

    TS4990 4.6 Wake-up time (t When the standby is released to put the device ON, the bypass capacitor C immediately. Because C properly until the and specified in the electrical characteristics tables with ...

  • Page 22

    Application information 4.8 Pop performance Pop performance is intimately linked with the size of the input capacitor C voltage bypass capacitor C The size dependent on the lower cut-off frequency and PSRR values requested. in The size ...

  • Page 23

    TS4990 Figure 64. Differential input amplifier configuration Cin Neg. Input Cin Pos. Input Standby Control The input capacitor C frequency required. (F Note: This formula is true only if times lower than F Example bill ...

  • Page 24

    ... These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 5.1 Flip-chip package information Figure 65 ...

  • Page 25

    TS4990 Figure 67. Package mechanical data for 9-bump flip-chip package 1.60 mm 1.60 mm 0.5mm 0.5mm 0.5mm 0.5mm Figure 68. Daisy chain mechanical data The daisy chain sample features two-by-two pin connections. The schematics in illustrate the way pins connect ...

  • Page 26

    Package information Figure 69. TS4990 footprint recommendations Φ=400μm typ. Φ=400μm typ. Φ=340μm min. Φ=340μm min. Non Solder mask opening Non Solder mask opening Figure 70. Tape and reel specification (top view Device orientation The devices are oriented in ...

  • Page 27

    TS4990 5.2 MiniSO-8 package information Figure 71. MiniSO-8 package mechanical drawing Table 8. MiniSO-8 package mechanical data Ref ccc Dimensions Millimeters Min. Typ. Max. 1.1 0 0.15 ...

  • Page 28

    Package information 5.3 DFN8 package information Note: DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal performance, the exposed pad must be soldered to a copper area on the PCB, acting as a heatsink. ...

  • Page 29

    TS4990 5.4 SO-8 package information Figure 73. SO-8 package mechanical drawing Table 10. SO-8 package mechanical data Ref ccc Dimensions Millimeters Min. Typ. Max. 1.75 0.10 0.25 1.25 ...

  • Page 30

    ... Ordering information 6 Ordering information Table 11. Order codes Order code TS4990IJT (1) TS4990EIJT TSDC05IJT (2) TSDC05EIJT TS4990IST TS4990IQT TS4990EKIJT TS4990ID TS4990IDT 1. Lead-free Flip chip part number. 2. Lead free daisy chain part number. 30/32 Temperature Package range Flip chip, 9 bumps Flip chip, 9 bumps MiniSO-8 -40°C, +85°C ...

  • Page 31

    TS4990 7 Revision history Table 12. Document revision history Date 1-Jul-2002 4-Sep-2003 1-Oct-2004 2-Apr-2005 May-2005 1-Jul-2005 28-Sep-2005 14-Mar-2006 21-Jul-2006 11-May-2007 17-Jan-2008 21-May-2008 Revision 1 First release. 2 Update mechanical data. 3 Order code for back coating on flip-chip. 4 Typography ...

  • Page 32

    ... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...