TS4995EIJT STMicroelectronics, TS4995EIJT Datasheet - Page 23

• Manufacturer Part Number: TS4995EIJT
• Description: IC AMP AUDIO PWR 1.2W 9FLIPCHIP
• Manufacturer: STMicroelectronics
• Type: Class ABr

Specifications of TS4995EIJT

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.2W x 1 @ 8 Ohm
• Voltage - Supply: 2.5 V ~ 5.5 V
• Features: Depop, Differential Inputs, Standby, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 9-FlipChip
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6101-2

TS4995
5
Package information
T
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 59. 9-bump flip-chip package mechanical drawing
Figure 60. Tape and reel schematics
o meet environmental requirements, STMicroelectronics offers these devices in
0.5mm
0.5mm
®
packages. These packages have a lead-free second level interconnect. The
0.5mm
0.5mm
1.63 mm
1.63 mm
8
8
All dimensions are in mm
All dimensions are in mm
∅ 0.25mm
∅ 0.25mm
A
A
1.63 mm
1.63 mm
Die size X + 70µm
Die size X + 70µm
600µm
600µm
1
1
4
4
– Die size: 1.63mm x 1.63mm ± 30µm
– Die height (including bumps): 600µm
– Bumps diameter: 315µm ±50µm
– Bump diameter before reflow: 300µm ±10µm
– Bumps height: 250µm ±40µm
– Die height: 350µm ±20µm
– Pitch: 500µm ±50µm
– Coplanarity: 60µm max
User direction of feed
User direction of feed
4
4
A
A
1
1
1.5
1.5
Package information
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