MT29F8G08AAAWP-ET:ATR Micron Technology Inc, MT29F8G08AAAWP-ET:ATR Datasheet - Page 20

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MT29F8G08AAAWP-ET:ATR

Manufacturer Part Number
MT29F8G08AAAWP-ET:ATR
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT29F8G08AAAWP-ET:ATR

Cell Type
NAND
Density
8Gb
Access Time (max)
18ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
30b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP-I
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
1G
Supply Current
30mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
Table 6:
PDF: 09005aef818a56a7 / Source: 09005aef81590bdd
2gb_nand_m29b__2.fm - Rev. I 1/06 EN
CLE
H
H
X
X
X
X
L
L
L
L
L
ALE
Mode Selection
H
H
X
X
X
X
L
L
L
L
L
Notes: 1. WP# should be biased to CMOS HIGH or LOW for standby.
CE#
X
X
X
H
L
L
L
L
L
L
L
2. PRE should be tied to V
3. Mode selection settings for this table: H = Logic level HIGH; L = Logic level LOW;
The PRE function is not supported on extended-temperature devices.
X = V
WE#
H
H
X
X
X
X
IH
or V
IL
RE#
.
H
H
H
H
H
H
X
X
X
X
2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory
0V/V
WP#
CC
X
X
H
H
H
X
X
H
H
L
CC
or ground. Do not transition PRE during device operations.
1
20
0V/V
PRE
X
X
X
X
X
X
X
X
X
X
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CC
2
Mode
Read mode
Write mode
Data input
Sequential read and data output
During read (busy)
During program (busy)
During erase (busy)
Write protect
Standby
©2004 Micron Technology, Inc. All rights reserved.
Command input
Address input
Command input
Address input
Bus Operation

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