BGY925 NXP Semiconductors, BGY925 Datasheet
BGY925
Specifications of BGY925
Available stocks
Related parts for BGY925
BGY925 Summary of contents
Page 1
... DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage BGY925 UHF amplifier module Product specification Supersedes data of 1999 Dec 01 M3D167 2000 Feb 02 ...
Page 2
... Base station transmitting equipment operating in the 920 to 960 MHz frequency range. DESCRIPTION The BGY925 is a three-stage UHF amplifier module in a SOT365A package. It consists of one NPN silicon planar transistor die and two silicon MOSFET dies mounted on a metallized ceramic AlN substrate, together with matching and bias circuitry ...
Page 3
... 1.6 W; carrier interference 600 kHz 1.6 mW; carrier interference 270 kHz i c corner frequency = 3 dB modulation = 20% carrier VSWR through all phases Product specification BGY925 MIN. TYP. MAX. UNIT 920 960 MHz 50 mA 500 dBc 40 dBc 2:1 60 dBc 80 dBc 55 dBc 8 dBc 2 MHz ...
Page 4
... MHz 960 MHz ( Fig.3 MCD832 handbook, halfpage ( 920 to 960 MHz. Fig 940 MHz (%) Efficiency as a function of load power; typical values ( Supply current as a function of load power; typical values. Product specification BGY925 MCD831 920 MHz 960 MHz (W) MCD833 (W) ...
Page 5
... Small signal in band input return losses as a function of frequency; typical values (dB (5) ( amb amb = amb amb = 100 C. amb amb = 25 C. amb Power gain as a function of load power; typical values Product specification BGY925 MCD835 1100 f (MHz MCD837 (1) (2) (3) ( (W) ...
Page 6
... T amb ( Fig.11 Quiescent current as a function of ambient MCD840 handbook, halfpage G p (dB) 50 100 T amb ( Fig.13 Power gain as a function of ambient 6 Product specification 0.5 0.4 0.3 0.2 0 amb ( temperature; typical values amb ( temperature; typical values. BGY925 MCD839 100 MCD841 100 ...
Page 7
... Philips Semiconductors UHF amplifier module handbook, halfpage 2000 Feb 02 pin numbers input Fig.14 Test circuit. 7 Product specification output MGL161 BGY925 ...
Page 8
Acrobat reader. white to force landscape pages to be ... Dimensions in mm ...
Page 9
... A soldering iron may be used temperature of 250 C for a maximum of 10 seconds at a distance from the plastic cap. ESD precautions must be taken to protect the device from electrostatic damage. 9 Product specification BGY925 VALUE CATALOGUE NO. 4330 030 36300 2322 195 13109 = 4.5); thickness = 1 mm. r ...
Page 10
... IEC SOT365A 2000 Feb scale 3.25 6.5 4.1 4.0 2.54 17.78 3.8 3.15 6.1 3.9 REFERENCES JEDEC EIAJ 40.74 48.0 15.4 7.75 0.3 0.25 40.54 48.4 15.2 7.55 EUROPEAN PROJECTION Product specification BGY925 SOT365A 12.8 0.1 12.6 ISSUE DATE 99-02-06 ...
Page 11
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Feb 02 11 Product specification BGY925 ...
Page 12
Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...