TDA8944AJ/N2,112 NXP Semiconductors, TDA8944AJ/N2,112 Datasheet - Page 18

IC AMP AUDIO PWR 7W STER 17SIL

TDA8944AJ/N2,112

Manufacturer Part Number
TDA8944AJ/N2,112
Description
IC AMP AUDIO PWR 7W STER 17SIL
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8944AJ/N2,112

Output Type
2-Channel (Stereo)
Max Output Power X Channels @ Load
7W x 2 @ 8 Ohm
Voltage - Supply
4.5 V ~ 18 V
Features
Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
Mounting Type
Through Hole
Package / Case
17-SIL (Bent and Staggered Leads)
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Output Power (typ)
7x2@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.07@8Ohm@1W%
Single Supply Voltage (typ)
12V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Power Dissipation
18W
Rail/rail I/o Type
No
Single Supply Voltage (min)
4.5V
Single Supply Voltage (max)
18V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
17
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3461-5
935270284112
TDA8944AJU
Philips Semiconductors
17. Soldering
18. Revision history
Table 11:
9397 750 09433
Product data
Rev Date
01
20020301
Revision history
CPCN
-
17.1 Introduction to soldering through-hole mount packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
The maximum permissible temperature of the solder is 260 C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 C, contact may be up to 5 seconds.
Table 10:
[1]
Package
DBS, DIP, HDIP, SDIP, SIL
Description
Product data (9397 750 09433)
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Rev. 01 — 01 March 2002
2 x 7 W BTL audio amplifier with DC gain control
Soldering method
Dipping
suitable
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
TDA8944AJ
Wave
suitable
[1]
stg(max)
18 of 20
).

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