TDA8932BTW/N2,118 NXP Semiconductors, TDA8932BTW/N2,118 Datasheet - Page 38

• Manufacturer Part Number: TDA8932BTW/N2,118
• Description: IC AMP AUDIO CLASS D 32HTSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932BTW/N2,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 55 W
• Available Set Gain: 36 dB
• Common Mode Rejection Ratio (min): 75 dB
• Thd Plus Noise: 0.007 %
• Operating Supply Voltage: 22 V
• Supply Current: 0.145 mA
• Maximum Power Dissipation: 5000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Dual Supply Voltage: +/- 11 V
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single or Dual
• Supply Voltage (max): 36 V
• Supply Voltage (min): 10 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935283479118

NXP Semiconductors
12. Package outline
Fig 16. Package outline SOT549-1 (HTSSOP32)
UJA1079_2
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 02 — 27 May 2010
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
LIN core system basis chip
0.2
v
L
L
p
0.1
w
UJA1079
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
38 of 45
A