TDA8932BTW/N2,112 NXP Semiconductors, TDA8932BTW/N2,112 Datasheet - Page 42

IC AMP AUDIO 55W STER D 32TSSOP

TDA8932BTW/N2,112

Manufacturer Part Number
TDA8932BTW/N2,112
Description
IC AMP AUDIO 55W STER D 32TSSOP
Manufacturer
NXP Semiconductors
Type
Class Dr
Datasheet

Specifications of TDA8932BTW/N2,112

Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power X Channels @ Load
55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
Voltage - Supply
10 V ~ 36 V, ±5 V ~ 18 V
Features
Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935283479112
TDA8932BTW
TDA8932BTW
TDA8932BTW/N2
TDA8932BTW/N2
NXP Semiconductors
Fig 41. Package outline SOT549-1 (HTSSOP32)
TDA8932B_4
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
OUTLINE
VERSION
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 04 — 18 December 2008
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
16
17
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
Class-D audio amplifier
L
0.1
p
w
TDA8932B
© NXP B.V. 2008. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
o
42 of 48
A

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