TDA8932BTW/N2,112 NXP Semiconductors, TDA8932BTW/N2,112 Datasheet - Page 45

• Manufacturer Part Number: TDA8932BTW/N2,112
• Description: IC AMP AUDIO 55W STER D 32TSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932BTW/N2,112

• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935283479112; TDA8932BTW; TDA8932BTW; TDA8932BTW/N2; TDA8932BTW/N2

NXP Semiconductors
17. Abbreviations
TDA8932B_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 18.
Acronym
BTL
DMOS
ESD
OCP
OTP
OVP
PWM
SE
TF
UBP
UVP
WP
Fig 42. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Bridge Tied Load
Double diffused Metal Oxide Semiconductor
ElectroStatic Discharge
OverCurrent Protection
OverTemperature Protection
OverVoltage Protection
Pulse Width Modulation
Single-Ended
Thermal Foldback
UnBalance Protection
UnderVoltage Protection
Window Protection
Rev. 04 — 18 December 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
Class-D audio amplifier
peak
TDA8932B
© NXP B.V. 2008. All rights reserved.
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