TDA8932BTW/N2,112 NXP Semiconductors, TDA8932BTW/N2,112 Datasheet - Page 48

• Manufacturer Part Number: TDA8932BTW/N2,112
• Description: IC AMP AUDIO 55W STER D 32TSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932BTW/N2,112

• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935283479112; TDA8932BTW; TDA8932BTW; TDA8932BTW/N2; TDA8932BTW/N2

NXP Semiconductors
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.5
8.6
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10
14.11
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
Thermal characteristics. . . . . . . . . . . . . . . . . . 16
Static characteristics. . . . . . . . . . . . . . . . . . . . 17
Dynamic characteristics . . . . . . . . . . . . . . . . . 19
Application information. . . . . . . . . . . . . . . . . . 22
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 41
Soldering of SMD packages . . . . . . . . . . . . . . 43
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection and interfacing . . . . . . . . . . . . . 6
Pulse width modulation frequency . . . . . . . . . . 7
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . . 9
Supply voltage protection . . . . . . . . . . . . . . . . 10
Diagnostic input and output . . . . . . . . . . . . . . 11
Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
Output voltage buffers. . . . . . . . . . . . . . . . . . . 11
Output power estimation. . . . . . . . . . . . . . . . . 22
Output current limiting. . . . . . . . . . . . . . . . . . . 24
Speaker configuration and impedance . . . . . . 24
Single-ended capacitor . . . . . . . . . . . . . . . . . . 24
Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 25
Device synchronization. . . . . . . . . . . . . . . . . . 26
Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 26
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 27
SE curves measured in reference design. . . . 29
BTL curves measured in reference design . . . 33
Typical application schematics (simplified) . . . 37
Introduction to soldering . . . . . . . . . . . . . . . . . 43
Wave and reflow soldering . . . . . . . . . . . . . . . 43
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 43
16.4
17
18
19
19.1
19.2
19.3
19.4
20
21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 45
Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
Legal information . . . . . . . . . . . . . . . . . . . . . . 47
Contact information . . . . . . . . . . . . . . . . . . . . 47
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 44
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Class-D audio amplifier
TDA8932B
Date of release: 18 December 2008
Document identifier: TDA8932B_4
All rights reserved.