FM5818-L FORMOSA MICROSEMI CO. LTD, FM5818-L Datasheet

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FM5818-L

Manufacturer Part Number
FM5818-L
Description
Manufacturer
FORMOSA MICROSEMI CO. LTD
Datasheet
Chip Schottky Barrier Rectifier
FM5817-L THRU FM5819-L
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
DS-121617
Formosa MS
Issued Date
2008/02/10
Revised Date
-
Revision
A
Page.
7
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FM5818-L Summary of contents

Page 1

Chip Schottky Barrier Rectifier FM5817-L THRU FM5819-L List List................................................................................................. Package outline............................................................................... Features.......................................................................................... Mechanical data............................................................................... Maximum ratings ............................................................................. Rating and characteristic curves........................................................ Pinning information........................................................................... Marking........................................................................................... Suggested solder pad layout............................................................. Packing information.......................................................................... Reel packing.................................................................................... Suggested thermal profiles for soldering processes............................. High reliability ...

Page 2

... Reverse current Thermal resistance Junction to ambient Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature * SYMBOLS RRM RMS (V) (V) FM5817 FM5818 FM5819 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Package outline 0.040(1.0) Typ. o CONDITIONS RRM 125 C R RRM ...

Page 3

Rating and characteristic curves (FM5817-L THRU FM5819-L) FIG.1-TYPICAL FORWARD CHARACTERISTICS 50 10 3.0 1 Pulse Width 300us 1% Duty Cycle 0.1 . 1.1 1.3 FORWARD VOLT AGE,(V) FIG.3 - TYPICAL REVERSE ...

Page 4

... Chip Schottky Barrier Rectifier FM5817-L THRU FM5819-L Pinning information Pin Pin1 cathode Pin2 anode Marking Type number FM5817-L FM5818-L FM5819-L Suggested solder pad layout PACKAGE SMA-L http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Simplified outline 1 Marking code SK12 SK13 SK14 Dimensions in inches and (millimeters) ...

Page 5

Chip Schottky Barrier Rectifier FM5817-L THRU FM5819-L Packing information Item Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed ...

Page 6

Chip Schottky Barrier Rectifier FM5817-L THRU FM5819-L Reel packing COMPONENT PACKAGE REEL SIZE REEL SPACING (pcs) 2000 SMA-L 7" SMA-L 13" 7500 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 C~35 C Humidity=65%±15% 2.Reflow soldering of surface-mount devices T ...

Page 7

Chip Schottky Barrier Rectifier FM5817-L THRU FM5819-L High reliability test capabilities Item Test 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock ...

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