BUK9608-55A NXP Semiconductors, BUK9608-55A Datasheet

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology

BUK9608-55A

Manufacturer Part Number
BUK9608-55A
Description
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BUK9608-55A
Manufacturer:
NXP
Quantity:
42 000
Part Number:
BUK9608-55A
Manufacturer:
NXP
Quantity:
12 500
Part Number:
BUK9608-55A118
Manufacturer:
NXP Semiconductors
Quantity:
135
1. Description
2. Features
3. Applications
4. Pinning information
Table 1:
[1]
Pin
1
2
3
mb
It is not possible to make connection to pin 2 of the SOT404 package.
Description
gate (g)
drain (d)
source (s)
mounting base;
connected to drain (d)
Pinning - SOT78 and SOT404, simplified outline and symbol
N-channel enhancement mode field-effect power transistor in a plastic package using
TrenchMOS™ technology, featuring very low on-state resistance.
Product availability:
BUK9508-55A in SOT78 (TO-220AB)
BUK9608-55A in SOT404 (D
[1]
BUK95/9608-55A
TrenchMOS™ logic level FET
Rev. 03 — 6 May 2002
TrenchMOS™ technology
Q101 compliant
175 C rated
Logic level compatible.
Automotive and general purpose power switching:
12 V and 24 V loads
Motors, lamps and solenoids.
Simplified outline
SOT78 (TO-220AB)
1 2
mb
3
MBK106
2
-PAK).
SOT404 (D
1
mb
2
2
-PAK)
3
MBK116
Symbol
MBB076
g
Product data
d
s

Related parts for BUK9608-55A

BUK9608-55A Summary of contents

Page 1

... Rev. 03 — 6 May 2002 1. Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring very low on-state resistance. Product availability: BUK9508-55A in SOT78 (TO-220AB) BUK9608-55A in SOT404 (D 2. Features TrenchMOS™ technology Q101 compliant 175 C rated Logic level compatible. ...

Page 2

Philips Semiconductors 5. Quick reference data Table 2: Quick reference data Symbol Parameter V drain-source voltage (DC drain current (DC total power dissipation tot T junction temperature j R drain-source on-state resistance DSon 6. Limiting values ...

Page 3

Philips Semiconductors 120 P der (%) 100 P tot P = ---------------------- - 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of mounting base temperature ...

Page 4

Philips Semiconductors 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base R thermal resistance from junction to ambient th(j-a) SOT78 SOT404 7.1 Transient thermal impedance 1 Z th(j-mb) = 0.5 (K/W) ...

Page 5

Philips Semiconductors 8. Characteristics Table 5: Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage I GS(th) I drain-source leakage current DSS I gate-source leakage current GSS ...

Page 6

Philips Semiconductors Table 5: Characteristics …continued unless otherwise specified. j Symbol Parameter Source-drain diode V source-drain (diode forward) SD voltage t reverse recovery time rr Q recovered charge r 400 ...

Page 7

Philips Semiconductors 2.5 V GS(th) (V) 2 max 1.5 typ min 1 0 Fig 9. Gate-source threshold voltage as a function of junction temperature. 120 g ...

Page 8

Philips Semiconductors 100 175 º Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values ...

Page 9

Philips Semiconductors 9. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB ( DIMENSIONS (mm are the original dimensions UNIT A 1 4.5 1.39 0.9 1.3 mm ...

Page 10

Philips Semiconductors Plastic single-ended surface mounted package (Philips version of D (one lead cropped DIMENSIONS (mm are the original dimensions UNIT c 4.50 1.40 0.85 0.64 mm 4.10 1.27 0.60 0.46 ...

Page 11

Philips Semiconductors 10. Soldering handbook, full pagewidth 2.25 8.35 8.15 4.60 4.85 7.95 solder lands solder resist occupied area solder paste Dimensions in mm. Fig 18. Reflow soldering footprint for SOT404. 9397 750 09573 Product data 10.85 10.60 10.50 1.50 ...

Page 12

Philips Semiconductors 11. Revision history Table 6: Revision history Rev Date CPCN Description 03 20020506 - Product data (9397 750 09573); supersedes Product data of BUK9508_9608-55A_2 September 2000. Modifications: • The format of this specification has been ...

Page 13

Philips Semiconductors Philips Semiconductors 12. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] ...

Page 14

Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...

Related keywords