CXA1315P Sony, CXA1315P Datasheet
CXA1315P
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CXA1315P Summary of contents
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... Sony cannot assume responsibility for any problems arising out of the use of these circuits. CXA1315M/P CXA1315M 16 pin SOP (Plastic bus bus, can support 12 V 960 mW 8 Patent Rights to use these components Standard Specifications as defind by Philips. – 1 – Bus CXA1315P 16 pin DIP (Plastic) E88Z45E26-PS ...
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Pin Configuration (Top View I/O Block Diagram BUS SDA Level Conversion SCL Power On Reset REG GND bus Slave address select pin ...
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Pin Description No. Symbol 1 SW1 2 SW0 9 SW2 10 SW3 14 SDA 3 DAC4 4 DAC3 5 DAC2 6 DAC1 7 DAC0 8 GND 11 SAD0 12 SAD1 13 SAD2 15 SCL Electrical Characteristics No. ...
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SW, SAD Pins No. Symbol Item Low level input voItage High level input voltage Low level input current High level input current Low level input ...
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Electrical Characteristics Measurement Circuit Measurement Circuit BUS 0.022µ +9V 10µ CXA1315M 100p 100p 100p Measurement Circuit 3 100Hz, 1Vp BUS 0.022µ +9V 10µ ...
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Definition Bus Register <SIave address> MSB SAD2 SAD1 SAD0 <Register table> • With the lC reset all registers are reset to "0" • : Not defined • x: Don't care • Sub ...
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In brackets ( ) number of bits REF (1) : Switches D/A converter reference voltage 0: Standardizes the inner regulator 1: Standardizes voltage resistance divided from Vcc SW0 to 3 (1) : Selects ON/OFF of Pins ...
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I C data write (Write from I C controller to IC) MSB SDA SCL MSB LSB 1 8 DATA (n) ACK Hi DATA ACK 2 • data read (Read from ...
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... General-purpose input port Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. Characteristics Diagram ...
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... SOP (PLASTIC) + 0.4 9.9 – 0 0.45 0.1 1.27 0.24 M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE SOP-16P-L01 LEAD TREATMENT SOP016-P-0300 EIAJ CODE LEAD MATERIAL JEDEC CODE PACKAGE MASS LEAD PLATING SPECIFICATIONS ITEM SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% ...
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... Package Outline Unit: mm CXA1315P 16PIN DIP (PLASTIC) + 0.4 19.2 – 0 2.54 Two kinds of package surface: 1.All mat surface type. 0.5 0.1 2.All mirror surface type. 1.2 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT SONY CODE DIP-16P-01 EIAJ CODE DIP016-P-0300 LEAD MATERIAL ...
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... Package Outline Unit: mm CXA1315P SONY CODE EIAJ CODE JEDEC CODE 16PIN DIP (PLASTIC) 300mil 19.35 0 2.54 0.254 1.016 0.457 0.076 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT DIP-16P-191 DIP016-P-0300-AU LEAD MATERIAL MS-001-AA PACKAGE MASS – 12 – CXA1315M/P 0˚ to 10˚ EPOXY RESIN ...