UPD75216ACW

Manufacturer Part NumberUPD75216ACW
Description4-BIT SINGLE-CHIP MICROCOMPUTER
ManufacturerNEC
UPD75216ACW datasheet
 


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Page 66/72:

RECOMMENDED SOLDERING CONDITIONS

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15. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
“Semiconductor Device Mount Technology” (IEI-1207).
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 15-1 Surface Mounting Type Conditions
PD75216AGF-
-3BE : 64-pin plastic QFP (14
Soldering Method
Wave soldering
Solder bath temperature: 260 C or less, Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Preheating temperature : 120 C max. (package surface temperature)
Infrared reflow
Package peak temperature: 230 C, Duration: 30 sec. max. (at 210 C or above),
Number of times: Once, Time limit: 7 days*(thereafter 10 hours prebaking required
at 125 C)
VPS
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C or above),
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Pin part temperature: 300 C or below , Duration: 3 sec. max. (per device side)
Pin part heating
* For the storage period after dry-pack decompression storage conditions are max. 25 C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Notice
A Version of this product with improved recommended soldering condition is available. For details
(improvements such as infrared reflow peak temperature extension (235 C), number of times: twice,
relaxation of time limit, etc.), contact NEC sales personnel.
Table 15-2 Insertion Type Soldering Conditions
PD75216ACW-
: 64-pin plastic shrink DIP (750 mil)
Soldering Method
Wave soldering
Solder bath temperature: 260 C or below , Duration: 10 sec. max.
(lead part only)
Pin part heating
Pin part temperature: 260 C or below , Duration: 10 sec. max.
Note
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
66
20 mm)
Soldering Conditions
Soldering Conditions
PD75216A
Recommended
Condition Symbol
WS60-107-1
IR-30-107-1
VP15-107-1
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