TD62501P TOSHIBA Semiconductor CORPORATION, TD62501P Datasheet
TD62501P
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TD62501P Summary of contents
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... TD62501, 502, 503, 504P / F : COMMON EMITTER TD62505, 506P / F : COMMON COLLECTOR TD62507P / F : ISOLATED The TD62501P / F Series are comprised of seven or five NPN Transistor Arrays. For proper operation, the substrate (SUB) must be connected to the most negative voltage. Applications include relay, hammer, Lamp and display (LED) drivers ...
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... PIN CONNECTION (Top view) TD62501P / F, TD62502P / F TD62503P / F, TD62504P / F TD62507P / F SCHEMATICS (Each driver) TD62501P / F TD62502P / F TD62503P / F TD62504P / F TD62503P / 2.7 kΩ, TD62504P / 10.5 kΩ *: Parasitic Diodes TD62501~507P/F TD62505P / F, TD62506P / F 2 2006-06-14 ...
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... Collector Current Input Voltage Input Current Isolation Voltage P Power Dissipation F Operating Temperature Storage Temperature Note 1: TD62506P / F Note 2: TD62502P / F, TD62503P / F, TD62504P / F Note 3: TD62501P / F, TD62505P / F, TD62507P / F Note 4: On Glass Epoxy PCB (30 × 30 × 1.6 mm, Cu 50%) (Ta = 25°C Unless otherwise noted) SYMBOL RATING UNIT CEO V ...
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... Collector−Emitter Saturation Voltage (Note 2) DCCurrent Transfer Ratio (Note 3) TD62502P / F Input Voltage TD62503P / F TD62504P / F Turn−On Delay Turn−Off Delay Note 1: Except TD62502P / F Only Note 2: Only TD62501P / F, TD62505P / F, TD62506P / F, TD62507P / F Note 3: Only TD62502P / F, TD62503P / F, TD62504P / F (Ta = −40~85°C) SYMBOL CONDITION V CEO V CBO ...
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... ON OFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, t ≤ Note 2: See below INPUT CONDITION TYPE NUMBER R I TD62501P / F 2.7 kΩ TD62502P / F 0 Ω TD62503P / F 0 Ω TD62504P / F 0 Ω TD62505P / F 2.7 kΩ TD62506P / F 0 Ω TD62507P / F 2.7 kΩ ...
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TD62501~507P/F 6 2006-06-14 ...
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TD62501~507P/F 7 2006-06-14 ...
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PACKAGE DIMENSIONS DIP16−P−300−2.54A Weight: 1.11 g (typ.) TD62501~507P/F 8 Unit: mm 2006-06-14 ...
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PACKAGE DIMENSIONS SOP16−P−225−1.27 Weight: 0.16 g (typ.) TD62501~507P/F 9 Unit: mm 2006-06-14 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to ...