X28C010D-15 Xicor, X28C010D-15 Datasheet

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... Xicor, Inc. 1991, 1995, 1996 Patents Pending 3858-3.1 4/3/97 T1/C0/D0 SH X28C010 DESCRIPTION The Xicor X28C010 is a 128K with Xicor's proprietary, high performance, floating gate CMOS technology. Like all Xicor programmable non- Control Circuits volatile memories the X28C010 only device. The ...

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X28C010 PIN DESCRIPTIONS Addresses (A – The Address inputs select an 8-bit memory location during a read or write operation. Chip Enable (CE) The Chip Enable input must be LOW to enable all read/ write operations. When ...

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X28C010 DEVICE OPERATION Read Read operations are initiated by both OE and CE LOW. The read operation is terminated by either returning HIGH. This two line control architecture elimi- nates bus contention in a system environment. The ...

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X28C010 DATA Polling I/O 7 Figure 2. DATA Polling Bus Sequence LAST WRITE I – Figure 3. DATA Polling Software Flow WRITE DATA WRITES COMPLETE? YES SAVE LAST DATA ...

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X28C010 The Toggle Bit I/O 6 Figure 4. Toggle Bit Bus Sequence LAST WRITE I Beginning and ending state of I/O 6 will vary. Figure 5. Toggle Bit Software Flow LAST WRITE LOAD ACCUM ...

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... SOFTWARE DATA PROTECTION The X28C010 offers a software controlled data protec- tion feature. The X28C010 is shipped from Xicor with the software data protection NOT ENABLED: that is the device will be in the standard operating mode. In this mode data should be protected during power-up/-down operations through the use of external circuits ...

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X28C010 Software Data Protection Figure 6. Timing Sequence—Byte or Page Write DATA AA ADDR 5555 CE WE Figure 7. Write Sequence for Software Data Protection WRITE DATA AA TO ADDRESS 5555 WRITE DATA 55 TO ADDRESS 2AAA ...

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X28C010 Resetting Software Data Protection Figure 8. Reset Software Data Protection Timing Sequence V CC DATA AA 55 ADDR 5555 2AAA CE WE Figure 9. Software Sequence to Deactivate Software Data Protection WRITE DATA AA TO ADDRESS 5555 WRITE DATA ...

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X28C010 SYSTEM CONSIDERATIONS Because the X28C010 is frequently used in large memory arrays it is provided with a two line control architecture for both read and write operations. Proper usage can provide the lowest possible power dissipation and elimi- nate ...

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X28C010 ABSOLUTE MAXIMUM RATINGS* Temperature under Bias X28C010 ...................................... – +85 C X28C010I ................................... – +135 C X28C010M ................................. – +135 C Storage Temperature ....................... – +150 C Voltage on any Pin ...

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X28C010 POWER-UP TIMING Symbol PUR (2) t Power-up to Read Operation t PUW (2) Power-up to Write Operation CAPACITANCE 1MHz Symbol I/O (2) C Input/Output Capacitance (2) C Input Capacitance IN ENDURANCE ...

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X28C010 A.C. CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.) Read Cycle Limits Symbol Parameter t Read Cycle Time RC t Chip Enable Access Time CE t Address Access Time AA t Output Enable Access Time OE CE LOW ...

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X28C010 Write Cycle Limits Symbol (4) t Write Cycle Time WC t Address Setup Time AS t Address Hold Time AH t Write Setup Time CS t Write Hold Time CH CE Pulse Width HIGH Setup Time ...

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X28C010 CE Controlled Write Cycle ADDRESS OES DATA IN DATA OUT Page Write Cycle ( (6) ADDRESS * I/O BYTE 0 *For each successive write within the ...

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X28C010 DATA Polling Timing Diagram (7) ADDRESS I/O 7 Toggle Bit Timing Diagram OEH OE HIGH Z I I/O 6 beginning and ending state will vary. ...

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X28C010 NOTES 16 ...

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X28C010 PACKAGING INFORMATION 32-LEAD HERMETIC DUAL IN-LINE PACKAGE TYPE D PIN 1 SEATING PLANE 0.150 (3.8) MIN. 0.200 (5.08) 0.150 (3.18) TYP. 0.018 (0.46) 0.015 (0.33) 0.008 (0.20) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 1.690 (42.95) MAX. ...

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X28C010 PACKAGING INFORMATION 32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E PIN 1 0.200 (5.08) BSC 0.028 (0.71) 0.022 (0.56) (32) PLCS. 0.458 (11.63) 0.442 (11.22) 0.458 (11.63) 0.300 (7.62) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) ...

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X28C010 PACKAGING INFORMATION 0.828 (21.04) 0.812 (20.64) 0.0065 (0.17) 0.004 (0.10) 0.370 (9.40) 0.300 (7.62) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 32-LEAD CERAMIC FLAT PACK PIN 1 INDEX 1 32 0.440 (11.18) 0.430 (10.93) 0.347 (8.82) 0.333 ...

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X28C010 PACKAGING INFORMATION 32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J 0.420 (10.67) 0.045 (1.14 0.495 (12.57) 0.485 (12.32) TYP. 0.490 (12.45) 0.453 (11.51) 0.447 (11.35) TYP. 0.450 (11.43) 0.300 (7.62) REF. PIN 1 NOTES: 1. ALL DIMENSIONS ...

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X28C010 PACKAGING INFORMATION 36-LEAD CERAMIC PIN GRID ARRAY PACKAGE TYPE TYP. 0.180 (.010) (4.57 .25 CORNERS TYP. 0.180 (.010) (4.57 4 CORNERS PIN 1 INDEX 0.770 ...

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X28C010 PACKAGING INFORMATION 32-LEAD CERAMIC SMALL OUTLINE GULL WING PACKAGE TYPE R 0.340 0.007 0.0192 0.0138 0.840 MAX. 0.050 0.440 MAX. 0.560 NOM. NOTES: 1. ALL DIMENSIONS IN INCHES 2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER ...

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X28C010 PACKAGING INFORMATION 32-PAD STRETCHED CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE N PIN 1 0.400 BSC 0.700 0.010 NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NLT 0.005 (0.127) 0.300 BSC 0.035 x 45 REF. ...

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X28C010 PACKAGING INFORMATION 12.522 (0.493) 12.268 (0.483) 1.143 (0.045) 0.965 0.889 (0.035) PIN #1 IDENT. (0.038) O 1.016 (0.040) O 0.762 (0.030) 1 10.058 (0.396) 9.957 (0.392) A 14.148 (0.557) 13.894 (0.547) 14.80 0.05 (0.583 0.002) 0.30 (0.012 SOLDER PADS ...

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... LIMITED WARRANTY Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. ...