TDA8395T Philips Semiconductors, TDA8395T Datasheet

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TDA8395T

Manufacturer Part Number
TDA8395T
Description
Manufacturer
Philips Semiconductors
Datasheet

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Preliminary specification
File under Integrated Circuits, IC02
DATA SHEET
TDA8395
SECAM decoder
INTEGRATED CIRCUITS
October 1991

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TDA8395T Summary of contents

Page 1

DATA SHEET TDA8395 SECAM decoder Preliminary specification File under Integrated Circuits, IC02 INTEGRATED CIRCUITS October 1991 ...

Page 2

... Philips Semiconductors SECAM decoder FEATURES Fully integrated filters Alignment free For use with baseband delay GENERAL DESCRIPTION The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with the PAL/NTSC decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC incorporates HF and LF filters, a demodulator and an identification circuit (luminance is not processed in this IC) ...

Page 3

... Philips Semiconductors SECAM decoder Fig.2 Pin configuration October 1991 Fig.1 Block diagram. PINNING SYMBOL PIN f IDENT 1 ref/ TEST n.c. 4 n.c. 5 GND 6 CLOCHE 7 ref PLL 8 ref ( n.c. 11 n.c. 12 n.c. 13 n.c. 14 SAND 15 CVBS 16 3 Preliminary specification TDA8395 DESCRIPTION reference frequency input/identification input ...

Page 4

... Philips Semiconductors SECAM decoder FUNCTIONAL DESCRIPTION The TDA8395 is a self-calibrating SECAM decoder designed for use with a baseband delay circuit. During frame retrace a 4.433619 MHz reference frequency is used to calibrate the filters and the demodulator. The reference frequency should be very stable during this period ...

Page 5

... Philips Semiconductors SECAM decoder CHARACTERISTICS unless otherwise specified P amb SYMBOL PARAMETER Supply (pin 3) V positive supply voltage P I supply current P P total power dissipation tot CVBS input (pin 16) V composite video input voltage 16(p-p) (peak-to-peak value) V chrominance input voltage ...

Page 6

... Philips Semiconductors SECAM decoder SYMBOL PARAMETER Sandcastle pulse V blanking detection level bl V burst gate detection level bg t falling edge of burst gate to f start sync Reference/communication f reference frequency ref V reference voltage amplitude ref(p-p) (peak-to-peak value) V SECAM enable detection ed level; pin 1 V SECAM disabled detection dd level ...

Page 7

... Philips Semiconductors SECAM decoder TIMING October 1991 Fig.3 Non-linearity definition. Fig.4 Timing waveforms. 7 Preliminary specification TDA8395 ...

Page 8

... Philips Semiconductors SECAM decoder APPLICATION INFORMATION The leakage current at pin 8 should be well below meet the specification of the black levels (C8 = 220 nF). The leakage current at pin 7 should be well below meet the specification of the Cloche resonance frequency (C7 = 100 nF). The capacitors C7 and C8 should be connected to the ground pin as close as possible to the package. If not, this can result in a black level error for both channels ...

Page 9

... Philips Semiconductors SECAM decoder PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.7 0.51 3.7 inches 0.19 0.020 0.15 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

Page 10

... Philips Semiconductors SECAM decoder SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used ...

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