MC68HC705C8ACS

Manufacturer Part NumberMC68HC705C8ACS
ManufacturerFreescale Semiconductor, Inc
MC68HC705C8ACS datasheet
 


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Page 196/222:

DETAIL A

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Freescale Semiconductor, Inc.
Mechanical Specifications
14.7 44-Pin Quad Flat Pack (QFP)
33
34
-A-
44
1
-D-
0.20 (0.008)
0.05 (0.002) A-B
0.20 (0.008)
E
C
-C-
H
SEATING
PLANE
G
DATUM
-H-
PLANE
W
DETAIL C
Figure 14-5. MC68HC705C8AFB Package Dimensions (Case #824A)
Technical Data
196
L
23
22
-B-

DETAIL A

12
11
A
C
A-B
D
M
S
S
S
H
A-B
D
M
S
S
M
DETAIL C
DATUM
-H-
PLANE
0.01 (0.004)
M
MILLIMETERS
DIM
MIN
MAX
MIN
A
9.90
10.10
0.390
M
B
9.90
10.10
0.390
C
2.10
2.45
0.083
D
0.30
0.45
0.012
T
E
2.00
2.10
0.079
F
0.30
0.40
0.012
G
0.80 BSC
0.031 BSC
H
---
0.25
R
J
0.013
0.23
0.005
K
0.65
0.95
0.026
L
8.00 REF
0.315 REF
M
5
10
K
Q
N
0.13
0.17
0.005
Q
0
7
X
R
0.13
0.30
0.005
S
12.95
13.45
0.510
T
0.13
---
0.005
U
0
---
V
12.95
13.45
0.510
W
0.40
---
0.016
X
1.6 REF
0.063 REF
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
B
B
-A-, -B-, -D-

DETAIL A

F
BASE METAL
J
N
D
0.20 (0.008)
C
A-B
D
M
S
SECTION B-B
NOTES:
1.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
2. CONTROLLING DIMENSION: MILLIMETER.
3.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4.
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT.
INCHES
MAX
0.398
0.398
0.096
0.018
0.083
0.016
---
0.010
0.009
0.037
5
10
0.007
0
7
0.012
0.530
---
0
---
0.530
---
MC68HC705C8A — Rev. 3
S