IRF7314TR International Rectifier Corp., IRF7314TR Datasheet

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IRF7314TR

Manufacturer Part Number
IRF7314TR
Description
Manufacturer
International Rectifier Corp.
Datasheet

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Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Absolute Maximum Ratings ( T
Description
Thermal Resistance Ratings
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Surface Mount
Fully Avalanche Rated
Parameter
A
= 25°C Unless Otherwise Noted)
T
T
T
T
PRELIMINARY
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
G 2
G 1
S2
S 1
Symbol
T
dv/dt
J,
V
V
E
E
I
I
DM
AR
T
I
GS
DS
S
AS
AR
1
2
3
4
STG
T op V iew
Symbol
R
HEXFET
JA
8
6
5
7
-55 to + 150
Maximum
D 1
D 1
D 2
D 2
± 12
0.20
S O -8
-2.5
-2.9
-5.0
150
-20
-21
-5.3
-4.3
2.0
1.3
®
R
IRF7314
Limit
Power MOSFET
DS(on)
62.5
V
DSS
PD - 9.1436B
= 0.058
= -20V
Units
Units
°C/W
V/ ns
mJ
mJ
°C
W
A
A
11/18/97

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IRF7314TR Summary of contents

Page 1

Generation V Technology Ultra Low On-Resistance Dual P-Channel MOSFET Surface Mount Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching ...

Page 2

IRF7314 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP -7.50V -4.50V -4.00V -3.50V -3.00V -2.70V -2.00V BOTTOM -1.50V 10 -1.50V 1 20µs PULSE WIDTH 0.1 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ° T ...

Page 4

IRF7314 2 -2.9A D 1.5 1.0 0.5 0.0 -60 -40 - Junction T em perature (° Fig 5. Normalized On-Resistance Vs. Temperature 0.08 0.07 0.06 0.05 0.04 0.03 0.0 ...

Page 5

1200 oss ds gd 1000 ...

Page 6

IRF7314 Package Outline SO8 Outline 0.25 (.010 ...

Page 7

Tape & Reel Information SO8 Dimensions are shown in millimeters (inches) 8.1 ( .318 ) 7.9 ( .312 ) ...

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