UPC2748TB-E3 Renesas Electronics Corporation., UPC2748TB-E3 Datasheet

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UPC2748TB-E3

Manufacturer Part Number
UPC2748TB-E3
Description
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Document No. PU10201EJ01V0DS (1st edition)
(Previous No. P13444EJ3V0DS00)
Date Published December 2002 CP(K)
Printed in Japan
DESCRIPTION
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
• Supply voltage
• Noise figure
• Power gain
• Operating frequency
• Isolation
• High-density surface mounting : 6-pin super minimold package (2.0
APPLICATION
• Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)
ORDERING INFORMATION
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
PC2747TB-E3
PC2748TB-E3
Remark To order evaluation samples, contact your nearby sales office.
The
These ICs are manufactured using our 20 GHz f
Part Number
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PC2747TB,
Part number for sample order: PC2747TB, PC2748TB
6-pin super minimold
PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile
AMPLIFIER FOR MOBILE COMMUNICATIONS
3 V, SUPER MINIMOLD SILICON MMIC
Package
: V
:
:
:
:
CC
PC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz
PC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz
PC2747TB ; G
PC2748TB ; G
PC2747TB ; DC to 1.8 GHz
PC2748TB ; 0.2 to 1.5 GHz
PC2747TB ; ISL = 40 dB TYP. @ f = 900 MHz
PC2748TB ; ISL = 40 dB TYP. @ f = 900 MHz
PC2747TB, PC2748TB
The mark • • • • shows major revised points.
= 2.7 to 3.3 V
BIPOLAR ANALOG INTEGRATED CIRCUITS
DATA SHEET
P
P
Marking
T
= 12 dB TYP. @ f = 900 MHz
= 19 dB TYP. @ f = 900 MHz
C1S
C1T
NESAT lll silicon bipolar process. This process uses silicon
Embossed tape 8 mm wide
1, 2, 3 pins face the perforation side of the tape
Qty 3 kpcs/reel
1.25
0.9 mm)
Supplying Form
NEC Compound Semiconductor Devices 1998, 2002

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UPC2748TB-E3 Summary of contents

Page 1

V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The PC2747TB, PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. These ...

Page 2

PIN CONNECTIONS (Top View Marking is an example of PC2747TB PRODUCT LINE- + Part No (sat) (GHz) (dBm) PC2745T 2.7 1.0 PC2745TB PC2746T 1.5 0 ...

Page 3

PIN EXPLANATION Pin Pin Applied Pin No. Name Voltage Voltage Note (V) (V) 1 INPUT 0.80 0.80 2 GND OUTPUT 2.79 2. 2.7 to 3.3 CC Note Pin voltage is measured ...

Page 4

ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V CC Circuit Current I CC Power Dissipation P D Operating Ambient Temperature T A Storage Temperature T stg Input Power P in Note Mounted on double-sided copper-clad 50 RECOMMENDED OPERATING RENGE Parameter ...

Page 5

STANDARD CHARACTERISTICS FOR REFERENCE (T Parameter Symbol Circuit Current I CC Power Gain G P Noise Figure NF Upper Limit Operating Frequency f u Lower Limit Operating Frequency f L Isolation ISL Input Return Loss RL in Output Return Loss ...

Page 6

TEST CIRCUIT 000 pF EXAMPLE OF APPLICATION CIRCUIT 000 000 The application circuits and their parameters are for reference only ...

Page 7

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD (Top View) IN Mounting Direction (Marking is an example for PC2747TB) Notes COMPONENT LIST 1. 30 Value 2. Back side: GND pattern C 1 000 pF 3. Solder plated on pattern ...

Page 8

TYPICAL CHARACTERISTICS (T A PC2747TB CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal Supply Voltage V (V) CC POWER GAIN vs. FREQUENCY 3 2 ...

Page 9

PC2747TB ISOLATION vs. FREQUENCY 0 –10 – 1 –30 –40 3.0 V –50 0.1 0.3 1.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 900 MHz 3.3 V –5 3.0 V –10 V ...

Page 10

SMITH CHART ( PC2747TB S -FREQUENCY 11 S -FREQUENCY 22 10 PC2747TB, PC2748TB 1.0 G 3.0 G 2.0 G 0.1 G 0.1 G 1.0 G 2.0 G 3.0 G Data Sheet ...

Page 11

S-PARAMETERS PC2747TB S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] [Device Parameters] ...

Page 12

TYPICAL CHARACTERISTICS (T A PC2748TB CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal Supply Voltage V (V) CC POWER GAIN vs. FREQUENCY 3 2.7 V ...

Page 13

PC2748TB ISOLATION vs. FREQUENCY 0 –10 –20 – 1 –40 3.0 V –50 0.1 0.3 1.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 3 –5 3.0 V –10 2.7 V ...

Page 14

SMITH CHART ( PC2748TB S -FREQUENCY 11 S -FREQUENCY 22 14 PC2747TB, PC2748TB 1.0 G 2.0 G 0.1 G 0.1 G 1.0 G 3.0 G Data Sheet PU10201EJ01V0DS ...

Page 15

S-PARAMETERS PC2748TB S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] [Device Parameters] ...

Page 16

PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 16 PC2747TB, PC2748TB 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet PU10201EJ01V0DS ...

Page 17

NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with ...

Page 18

The information in this document is current as of December, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications ...

Page 19

Business issue NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office TEL: +852-3107-7303 Taipei Branch Office TEL: +886-2-8712-0478 Korea Branch Office TEL: ...

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