X25C02 Intersil Corporation, X25C02 Datasheet

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X25C02

Manufacturer Part Number
X25C02
Description
Manufacturer
Intersil Corporation
Datasheet

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X25C02
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X25C02
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X25C02P
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X25C02
2K
FEATURES
Direct Write
©Xicor, Inc. 1994, 1995, 1996 Patents Pending
3843-1.6 6/10/96 T5/C1/D1 NS
FUNCTIONAL DIAGRAM
1MHz Clock Rate
256 X 8 Bits
—4 Byte Page Mode
Low Power CMOS
—150 A Standby Current
—2mA Active Current
5V Power Supply
Built-in Inadvertent Write Protection
—Power-Up/Power-Down protection circuitry
—Write Latch
—Write Protect Pin
Self-Timed Write Cycle
—5ms Write Cycle Time (Typical)
High Reliability
—Endurance: 100,000 cycles per byte
—Data Retention: 100 Years
—ESD protection: 2000V on all pins
Available Packages
—8-Lead MSOP
—8-Lead PDlP
—8-Lead SOIC
AN9 • AN18 • AN31 • AN37 • AN40
HOLD
A V A I L A B L E
SCK
is a trademark of Xicor, Inc.
SO
WP
CS
SI
A
PPLICATION
COMMAND
N
CONTROL
CONTROL
DECODE
TIMING
OTES
LOGIC
WRITE
LOGIC
AND
AND
SPI Serial E
X25C02
1
DECODE
LOGIC
DESCRIPTION
The X25C02 is a CMOS 2048-bit serial E
nally organized as 256 x 8. The X25C02 features a serial
interface and software protocol allowing operation on a
simple three-wire bus. The bus signals are a clock input
(SCK) plus separate data in (SI) and data out (SO) lines.
Access to the device is controlled through a chip select
(CS) input, allowing any number of devices to share the
same bus.
The X25C02 also features two additional inputs that
provide the end user with added flexibility. By asserting
the HOLD input, the X25C02 will ignore transitions on its
inputs, thus allowing the host to service higher priority
interrupts. The WP input can be used as a hardwire input
to the X25C02 disabling all write attempts, thus provid-
ing a mechanism for limiting end user capability of
altering the memory.
The X25C02 utilizes Xicor’s proprietary Direct Write™
cell, providing a minimum endurance of 100,000 cycles
per byte and a minimum data retention of 100 years.
2
X
PROM
64
4
256 BYTE ARRAY
DATA REGISTER
Y DECODE
(64 X 32)
Characteristics subject to change without notice
8
256 x 8 Bit
2
PROM, inter-
3843 FHD F01

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X25C02 Summary of contents

Page 1

... PROM DESCRIPTION The X25C02 is a CMOS 2048-bit serial E nally organized as 256 x 8. The X25C02 features a serial interface and software protocol allowing operation on a simple three-wire bus. The bus signals are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. ...

Page 2

... the standby power mode. CS LOW enables the X25C02, placing it in the active power mode. It should be noted that after power-up, a HIGH to LOW transition required prior to the start of any operation. Write Protect (WP) When WP is LOW, nonvolatile writes to the X25C02 are disabled, but the part otherwise functions normally ...

Page 3

... If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input to place the X25C02 into a “PAUSE” condition. After releasing HOLD, the X25C02 will resume operation from the point when HOLD was first asserted ...

Page 4

... CS HIGH. Refer to the read operation sequence illustrated in Figure 1. Write Sequence Prior to any attempt to write data into the X25C02, the “write enable” latch must first be set by issuing the WREN instruction (See Fig. 2 first taken LOW, then the instruction is clocked into the X25C02. After all eight bits of the instruction are transmitted, CS must then be taken HIGH ...

Page 5

... X25C02 Operational Notes The X25C02 powers-up in the following state: • The device is in the low power standby state. • A HIGH to LOW transition required to enter an active state and receive an instruction. • SO pin is high impedance. • The “write enable” latch is reset. ...

Page 6

... X25C02 Figure 3. Byte Write Operation Sequence SCK INSTRUCTION SI HIGH IMPEDANCE SO Figure 4. Page Write Operation Sequence SCK INSTRUCTION SCK DATA BYTE ...

Page 7

... PGM T03.1 Limits Min. Max. Units 2 mA 150 10 10 – 0.4 V –0 5V. CC Test 7 Supply Voltage Limits X25C02 5V 10% Test Conditions SCK = V x 0.1/V x 0.9 @ 1MHz Open OUT ...

Page 8

... X25C02 EQUIVALENT A.C. LOAD CIRCUIT 5V 2.16K OUTPUT 3.07K A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Data Input Timing Symbol Parameter f Clock Frequency SCK t Cycle Time CYC CS Lead Time t LEAD CS Lag Time t LAG t Clock HIGH Time WH t Clock LOW Time WL t Data Setup Time ...

Page 9

... X25C02 Serial Output Timing CS SCK MSB OUT ADDR SI LSB IN Serial Input Timing CS t LEAD SCK MSB IN HIGH IMPEDANCE CYC MSB–1 OUT LAG DIS LSB OUT 3843 FHD F09 LAG t FI LSB IN ...

Page 10

... X25C02 Hold Timing CS SCK SO SI HOLD SYMBOL TABLE WAVEFORM INPUTS Must be steady May change from LOW to HIGH May change from HIGH to LOW Don’t Care: Changes Allowed N/A 10 3843 FHD F11 OUTPUTS Will be steady Will change ...

Page 11

... X25C02 PACKAGING INFORMATION 8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M 0.040 (1.02 0.007 (0.18) 0.005 (0.13) NOTE: 1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS) 0.118 0.002 (3.00 0.05) 0.012 + 0.006 / -0.002 (0.30 + 0.15 / -0.05) 0.118 0.002 (3.00 0.05) 0.030 (0.76) 0.0216 (0.55) 7 TYP 0.036 (0.91) 0.032 (0.81) 0.002 0.008 (0.20) 0.05) 0.004 (0.10) 0.150 (3.81) REF. 0.193 (4.90) REF. 11 0.0256 (0.65) TYP R 0 ...

Page 12

... X25C02 PACKAGING INFORMATION HALF SHOULDER WIDTH ON ALL END PINS OPTIONAL 0.015 (0.38) TYP. 0.010 (0.25) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P 0.430 (10.92) 0.360 (9.14) PIN 1 INDEX PIN 1 0.300 (7.62) REF. SEATING PLANE 0.150 (3.81) 0.125 (3.18) ...

Page 13

... X25C02 PACKAGING INFORMATION 8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S PIN 1 INDEX 0.010 (0.25) 0.020 (0.50) 0 – 8 0.016 (0.410) 0.037 (0.937) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 0.150 (3.80) 0.158 (4.00) PIN 1 0.014 (0.35) 0.019 (0.49) 0.188 (4.78) 0.197 (5.00) (4X) 7 0.004 (0.19) 0.050 (1.27) 0.010 (0.25 0.0075 (0.19) 0.250" 0.010 (0.25) ...

Page 14

... Blank = Commercial = + Industrial = – + Military = – +125 C Package M = 8-Lead MSOP P = 8-Lead Plastic DIP S = 8-Lead SOIC X25C02 X Blank = 8-Lead SOIC P = 8-Lead Plastic DIP X Blank = 10%, – + 10%, – +125 C ...

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