93C46A Microchip Technology Inc., 93C46A Datasheet

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93C46A

Manufacturer Part Number
93C46A
Description
Manufacturer
Microchip Technology Inc.
Datasheet

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Device Selection Table
Features:
• Low-power CMOS technology
• ORG pin to select word size for ‘46C’ version
• 128 x 8-bit organization ‘A’ version devices
• 64 x 16-bit organization ‘B’ version devices
• Self-timed erase/write cycles (including
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device Status signal (Ready/Busy)
• Sequential read function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Temperature ranges supported:
Pin Function Table
© 2005 Microchip Technology Inc.
93AA46A
93AA46B
93LC46A
93LC46B
93C46A
93C46B
93AA46C
93LC46C
93C46C
CS
CLK
DI
DO
V
NC
ORG
V
(no ORG)
(no ORG)
auto-erase)
SS
CC
Part Number
- Industrial (I)
- Automotive (E)
Name
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
No internal connection
Memory Configuration
Power Supply
1K Microwire Compatible Serial EEPROM
V
CC
1.8-5-5
1.8-5.5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
Range
-40°C to +85°C
-40°C to +125°C
Function
ORG Pin
Yes
Yes
Yes
No
No
No
No
No
No
93AA46A/B/C, 93LC46A/B/C,
Word Size
8 or 16-bit
8 or 16-bit
8 or 16-bit
16-bit
16-bit
16-bit
8-bit
8-bit
8-bit
Description:
The Microchip Technology Inc. 93XX46A/B/C devices
are 1K bit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93AA46C, 93LC46C or 93C46C are dependent
upon external logic levels driving the ORG pin to set
word size. For dedicated 8-bit communication, the
93AA46A, 93LC46A or 93C46A devices are available,
while the 93AA46B, 93LC46B and 93C46B devices
provide dedicated 16-bit communication. Advanced
CMOS technology makes these devices ideal for low
power, nonvolatile memory applications. The entire
93XX Series is available in standard packages includ-
ing 8-lead PDIP and SOIC, and advanced packaging
including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3
DFN and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish
is also available.
Temp Ranges
I, E
I, E
I, E
I, E
I, E
I, E
I
I
I
93C46A/B/C
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, MC
P, SN, ST, MS, MC
P, SN, ST, MS, MC
Packages
DS21749F-page 1

Related parts for 93C46A

93C46A Summary of contents

Page 1

... ORG pin to set word size. For dedicated 8-bit communication, the 93AA46A, 93LC46A or 93C46A devices are available, while the 93AA46B, 93LC46B and 93C46B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low power, nonvolatile memory applications ...

Page 2

... Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX ORG CLK CLK TSSOP/MSOP SOT-23 (ST, MS) (OT CLK ORG DFN ...

Page 3

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................7.0V CC All inputs and outputs w.r.t. V ..........................................................................................................-0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C ESD protection on all pins † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 4

... TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol Parameter No Clock frequency CLK A2 T Clock high time CKH A3 T Clock low time CKL A4 T Chip Select setup time CSS A5 T Chip Select hold time ...

Page 5

... FIGURE 1-1: SYNCHRONOUS DATA TIMING CSS CLK DIS (Read (Program Note relative to CS. SV TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX46B OR 93XX46C WITH ORG = 1) Instruction SB Opcode ...

Page 6

... FUNCTIONAL DESCRIPTION When the ORG pin (93XX46C) is connected to V the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instruc- tions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is ...

Page 7

... Erase The ERASE instruction forces all data bits of the specified address to the logical ‘1’ state brought low following the loading of the last address bit. This falling edge of the CS pin initiates the self-timed programming cycle, except on ‘93C’ devices where the rising edge of CLK before the last address bit initiates the write cycle ...

Page 8

... Erase All (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the erase cycle, except for the different opcode. The ERAL cycle is completely self-timed and commences at the falling edge of the CS, except on ‘ ...

Page 9

... Erase/Write Disable and Enable (EWDS/EWEN) The 93XX46A/B/C powers up in the Erase/Write Disable (EWDS) state. All Programming modes must be preceded by an Erase/Write Enable (EWEN) instruction. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or Vcc is removed from the device. ...

Page 10

... For 93AA46A/B/C and 93LC46A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle. For 93C46A/B/C devices, the self- timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. ...

Page 11

... For 93AA46A/B/C and 93LC46A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle. For 93C46A/B/C devices, the self-timed auto- erase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle ...

Page 12

... PIN DESCRIPTIONS TABLE 3-1: PIN DESCRIPTIONS SOIC/PDIP/ Name MSOP/ TSSOP/DFN CS 1 CLK Vss 5 ORG/ 3.1 Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal ...

Page 13

... PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN 6-Lead SOT-23 XXNN 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN © 2005 Microchip Technology Inc. ...

Page 14

... Part Number TSSOP 93AA46A A46A 93AA46B A46B 93AA46C A46C 93LC46A L46A 93LC46B L46B 93LC46C L46C 93C46A C46A 93C46B C46B 93C46C C46C Note Temperature grade ( Alphanumeric traceability code Legend: XX...X Part number or part number code T Temperature ( Year code (last digit of calendar year) ...

Page 15

... Plastic Micro Small Outline Package (MS) (MSOP (F) Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width ...

Page 16

... Plastic Small Outline Transistor (OT) (SOT-23 Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width ...

Page 17

... Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 18

... Plastic Small Outline (SN) – Narrow, 150 mil (SOIC Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness ...

Page 19

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width ...

Page 20

... Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated D PIN 1 ID INDEX AREA (NOTE 2) TOP VIEW A3 Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width ...

Page 21

... APPENDIX A: REVISION HISTORY Revision D Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision E Added DFN package. Revision F Added notes throughout. © 2005 Microchip Technology Inc. DS21749F-page 21 ...

Page 22

... NOTES: DS21749F-page 22 © 2005 Microchip Technology Inc. ...

Page 23

... THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’ ...

Page 24

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 25

... Serial EEPROM, MSOP package, 2.5V 93LC46BT-I/OT: 1K, 64x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93LC46B-I/MS: 1K, 64x16 Serial EEPROM, MSOP package, 2.5V 93C46B-I/MS: 1K, 64x16 Serial EEPROM, MSOP package, 5.0V 93C46C-I/MS: 1K, 128x8 or 16x16 Serial EEPROM, MSOP package, 5.0V 93C46AT-I/OT: 1K, 128x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V DS21749F-page 25 ...

Page 26

... NOTES: DS21749F-page 26 © 2005 Microchip Technology Inc. ...

Page 27

... Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. © 2005 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC ...

Page 28

... Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 © 2005 Microchip Technology Inc. EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy ...

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