X25097 Intersil Corporation, X25097 Datasheet

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X25097

Manufacturer Part Number
X25097
Description
Manufacturer
Intersil Corporation
Datasheet

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Part Number:
X25097
Manufacturer:
XILINX
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Part Number:
X25097
Manufacturer:
XICOR
Quantity:
20 000
Part Number:
X25097E
Manufacturer:
XICOR
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20 000
Part Number:
X25097G
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XICOR
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20 000
Part Number:
X25097M-2.7T1
Manufacturer:
XICOR
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20 000
Part Number:
X25097M1-2.7
Manufacturer:
XICOR
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20 000
Part Number:
X25097S8
Manufacturer:
XILINX
0
Part Number:
X25097S8-2.7A
Manufacturer:
XILINX
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Part Number:
X25097S8I
Manufacturer:
XILINX
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Part Number:
X25097S8I-2.7
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XILINX
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FUNCTIONAL DIAGRAM
8K
FEATURES
• 5MHz Clock Rate
• IDLock™ Memory
• Low Power CMOS
• 1.8V to 3.6V, 2.7V-5.5V or 4.5V to 5.5V Operation
• Built-in Inadvertent Write Protection
• SPI Modes (0,0 & 1,1)
• 1024 x 8 Bits
• Self-Timed Write Cycle
• High Reliability
• 8-Lead TSSOP Package
• 8-Lead SOIC Package
• 8-Lead PDIP Package
7034-1.1 5/8/97 T1/C0/D0 SH
Xicor, Inc. 1994, 1995, 1996 Patents Pending
—IDLock First or Last Page, any 1/4 or Lower 1/2
—<1 A Standby Current
—<3mA Active Current during Write
—<400 A Active Current during Read
—Power-Up/Power-Down Protection Circuitry
—Write Enable Latch
—Write Protect Pin
—16 Byte Page Mode
—5ms Write Cycle Time (Typical)
—Endurance: 100,000 Cycles/Byte
—Data Retention: 100 Years
—ESD: 2000V on all pins
of E
2
PROM Array
SCK
5MHz Low Power SPI Serial E
WP
SO
CS
SI
COMMAND
CONTROL
DECODE
LOGIC
AND
WRITE CONTROL LOGIC
DECODE
X25097
LOGIC
X
2
1
PROM with IDLock
DESCRIPTION
The X25097 is a CMOS 8K-bit serial E
organized as 1024 x 8. The X25097 features a Serial
Peripheral Interface (SPI) and software protocol
allowing operation on a simple four-wire bus. The bus
signals are a clock input (SCK) plus separate data in (SI)
and data out (SO) lines. Access to the device is
controlled through a chip select (CS) input, allowing any
number of devices to share the same bus.
IDLock is a programmble locking mechanism which
allows the user to lock system ID and parametric data in
different portions of the E
ranging from as little as one page to as much as 1/2 of
the total array. The X25097 also features a WP pin that
can be used for hardwire protection of the part, disabling
all write attempts, as well as a Write Enable Latch that
must be set before a write operation can be initiated.
The X25097 utilizes Xicor’s proprietary Direct Write
cell, providing a minimum endurance of 100,000 cycles
per byte and a minimum data retention of 100 years.
64
16
Y DECODE LOGIC
DATA REGISTER
HIGH VOLTAGE
8K E
CONTROL
(1024 x 8)
ARRAY
2
PROM
8
TM
Characteristics subject to change without notice
2
Memory
PROM memory space,
7038 FRM F01
1024 x 8 Bit
2
PROM, internally
TM

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X25097 Summary of contents

Page 1

... ID and parametric data in different portions of the E ranging from as little as one page to as much as 1/2 of the total array. The X25097 also features a WP pin that can be used for hardwire protection of the part, disabling all write attempts, as well as a Write Enable Latch that must be set before a write operation can be initiated. The X25097 utilizes Xicor’ ...

Page 2

... SO pin change after the falling edge of the clock input. Chip Select (CS) When CS is HIGH, the X25097 is deselected and the SO output pin is at high impedance and unless an internal write operation is underway, the X25097 will be in the standby power mode. CS LOW enables the X25097, placing it in the active power mode ...

Page 3

... LOW and remain LOW for the duration of the operation. The host may continue to write bytes of data to the X25097. The only restriction is the 16 bytes must reside on the same page. If the address counter reaches the end of the page and the clock continues, the counter will “ ...

Page 4

... READ: Read operation followed by address *Instructions are shown with MSB in leftmost position. Instructions are transferred MSB first. Operational Notes The X25097 powers up in the following state: • The device is in the low power, standby state. • A HIGH to LOW transition required to enter an active state and receive an instruction. • ...

Page 5

... X25097 Figure 2. Read Operation Sequence SCK READ INSTRUCTION (1 BYTE) SI HIGH IMPEDANCE SO Figure 3. Read Status Operation Sequence SCK READ STATUS INSTRUCTION SI NONVOLATILE WRITE IN PROGRESS BYTE ADDRESS (2 BYTE ...

Page 6

... X25097 Figure 4. WREN/WRDI Sequence CS SCK SI SO Figure 5. Byte Write Operation Sequence SCK WRITE INSTRUCTION (1 BYTE) SI HIGH IMPEDANCE INSTRUCTION (1 BYTE) HIGH IMPEDANCE BYTE ADDRESS (2 BYTE 7038 FRM F05 ...

Page 7

... X25097 Figure 6. Page Write Operation Sequence SCK PROGRAM INSTRUCTION SCK DATA BYTE Figure 7. IDLock Operation Sequence CS 0 SCK SI HIGH IMPEDANCE BYTE ADDRESS ...

Page 8

... Exposure to absolute maximum rating con- ditions for extended periods may affect device reliability. Supply Voltage Max. X25097 X25097-2.7 +70 C X25097-1.8 +85 C 7038 FRM T04 Limits Min. Max. Units 3 mA ...

Page 9

... X25097 CAPACITANCE 1MHz Symbol (3) C Output Capacitance (SO) OUT (3) C Input Capacitance (SCK, SI, CS, WP) IN Notes: (3) This parameter is periodically sampled and not 100% tested. EQUIVALENT A.C. LOAD CIRCUIT 5V 2061 2696 OUTPUT OUTPUT 3025 5288 30pF A.C. CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.) ...

Page 10

... X25097 Data Output Timing Symbol Parameter f Clock Frequency SCK t Output Disable Time DIS t Output Valid from Clock LOW V t Output Hold Time HO (5) t Output Rise Time RO (5) t Output Fall Time FO Notes: ( the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile WC write cycle ...

Page 11

... X25097 Figure 9. Serial Input Timing CS t LEAD SCK MSB IN HIGH IMPEDANCE LAG t FI LSB IN 7005 FRM F11 ...

Page 12

... X25097 PACKAGING INFORMATION 0 – 8 See Detail “A” NOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS) 8-LEAD PLASTIC, TSSOP , PACKAGE TYPE V .025 (.65) BSC .169 (4.3) .252 (6.4) BSC .177 (4.5) .114 (2.9) .122 (3.1) .047 (1.20) .0075 (.19) .002 (.05) .006 (.15) .0118 (.30) .019 (.50) .029 (.75) Detail A (20X) 12 .010 (.25) Gage Plane Seating Plane ...

Page 13

... X25097 PACKAGING INFORMATION 8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S PIN 1 INDEX 0.010 (0.25) 0.020 (0.50) 0 – 8 0.016 (0.410) 0.037 (0.937) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) PIN 1 0.014 (0.35) 0.019 (0.49) 0.188 (4.78) 0.197 (5.00) (4X) 7 0.050 (1.27 0.0075 (0.19) 0.250" 0.010 (0.25) FOOTPRINT 13 0.150 (3.80) 0.228 (5.80) 0.158 (4.00) ...

Page 14

... X25097 PACKAGING INFORMATION HALF SHOULDER WIDTH ON ALL END PINS OPTIONAL NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P 0.430 (10.92) 0.360 (9.14) PIN 1 INDEX PIN 1 0.300 (7.62) REF. SEATING PLANE 0.150 (3.81) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) 0.325 (8.25) ...

Page 15

... Temperature Range Blank = Commercial = + Industrial = – +85 C Package V = 8-Lead TSSOP S = 8-Lead SOIC P = 8-Lead PDIP 8-Lead SOIC/PDIP X25097 1.8 to 3.6V + 1.8 to 3.6V, - 2.7 to 5.5V + 2.7 to 5.5V, -40 to +85 C Blank = 4.5 to 5.5V + 4.5 to 5.5V, - ...

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