TDA8922BJ NXP Semiconductors, TDA8922BJ Datasheet
TDA8922BJ
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TDA8922BJ Summary of contents
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TDA8922B 2 Rev. 01 — 1 October 2004 1. General description The TDA8922B is a high efficiency class-D audio power amplifier with very low dissipation. The typical output power is 2 The device is available in the HSOP24 power package ...
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... Stereo single-ended configuration P o Mono bridge-tied load configuration Ordering information Table 2: Type number Package TDA8922BTH HSOP24 TDA8922BJ 9397 750 13357 Preliminary data sheet Quick reference data Conditions = supply voltage total quiescent no load; no filter; no supply current RC-snubber network ...
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... SGND2 mute 5 (22) IN2P INPUT 4 (21) STAGE IN2M 1 (18 SSA2 SSA1 (1) Pin numbers in parenthesis refer to the TDA8922BJ. Fig 1. Block diagram. 9397 750 13357 Preliminary data sheet STABI PROT 18 (12) 13 (7) RELEASE1 PWM SWITCH1 CONTROL MODULATOR ENABLE1 HANDSHAKE STABI ...
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... SSA2 2 SGND2 3 V DDA2 4 IN2M 5 IN2P 6 MODE 7 OSC 8 IN1P 9 IN1M 10 V DDA1 11 SGND1 12 V SSA1 001aab170 Fig 3. Pin configuration TDA8922BJ. Pin description Pin TDA8922BTH TDA8922BJ Rev. 01 — 1 October 2004 TDA8922B class-D power amplifi ...
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... The amplifier channels can be connected in the following configurations: • Mono Bridge-Tied Load (BTL) amplifier • Stereo Single-Ended (SE) amplifiers. 9397 750 13357 Preliminary data sheet Pin description …continued Pin TDA8922BTH TDA8922BJ ...
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Philips Semiconductors The amplifier system can be switched in three operating modes with pin MODE: • Standby mode; with a very low supply current • Mute mode; the amplifiers are operational; but the audio signal at the output is suppressed ...
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Philips Semiconductors Fig 5. Timing on mode selection input. 9397 750 13357 Preliminary data sheet V mode 50 % duty cycle 4.2 V mute 2 mode standby 0 V (SGND) 100 ms V mode 50 % ...
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Philips Semiconductors 8.2 Pulse width modulation frequency The output signal of the amplifi PWM signal with a carrier frequency of approximately 317 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog audio signal ...
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Philips Semiconductors In case of an impedance drop (e.g. due to dynamic behavior of the loudspeaker) the same protection will be activated; the maximum output current is again limited but the amplifier will NOT switch-off completely (thus ...
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Philips Semiconductors Table 4: Protection name OTP OCP WP UVP OVP UBP [1] Hysteresis of 20 degrees will influence restart timing depending on heatsink size. [2] Only complete shut-down of amplifier if short-circuit impedance is below threshold ...
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... Section 13.6. Thermal characteristics Parameter thermal resistance from junction to ambient TDA8922BTH TDA8922BJ thermal resistance from junction to case TDA8922BTH TDA8922BJ Section 13.5. Static characteristics = 317 kHz unless otherwise specified. osc amb Parameter Conditions supply voltage total quiescent supply no load ...
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Philips Semiconductors Table Symbol Audio inputs; pins IN1M, IN1P, IN2P and IN2M V I Amplifier outputs; pins OUT1 and OUT2 V OO(SE)(mute) V OO(SE)(on) V OO(BTL)(mute) V OO(BTL)(on) Stabilizer output; pin STABI V ...
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Philips Semiconductors 12. Dynamic characteristics 12.1 Switching characteristics Table 8: Switching characteristics unless otherwise specified. DD amb Symbol Parameter Internal oscillator f typical internal oscillator osc frequency f internal oscillator osc(int) frequency ...
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Philips Semiconductors Table 9: Stereo and dual SE application characteristics kHz Symbol Parameter Z input impedance i V noise output voltage n(o) channel separation cs ...
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Philips Semiconductors Table 10: Mono BTL application characteristics kHz Symbol Parameter V noise output voltage n(o) V output signal in mute o(mute) CMRR common mode ...
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Philips Semiconductors Maximum current (internally limited peak BTL Maximum current (internally limited peak Variables load impedance oscillator frequency osc t = minimum ...
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Philips Semiconductors 13.5 Heatsink requirements In some applications it may be necessary to connect an external heatsink to the TDA8922B. Limiting factor is the 150 C maximum junction temperature T cannot be exceeded. The expression below shows the relationship between ...
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Philips Semiconductors The TDA8922B amplifier can distinguish between a low-ohmic short circuit condition and other overcurrent conditions like dynamic impedance drops of the used loudspeakers. The impedance threshold (Z Depending on the impedance of the short circuit the amplifier will ...
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Philips Semiconductors 13.8 Application schematic Notes to the application schematic: • A solid ground plane around the switching amplifier is necessary to prevent emission. • 100 nF capacitors must be placed as close as possible to the power supply pins ...
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BEAD CON1 100 nF 47 F/35 V 470 F/ GND 100 nF 47 F/35 V 470 F/ ...
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Philips Semiconductors 13.9 Curves measured in reference design 2 10 (THD N)/S (%) configuration kHz. ...
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Philips Semiconductors 2 10 (THD N)/S (%) (1) ( configuration ...
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Philips Semiconductors 20 P tot ( kHz. ( BTL configuration configuration. P ...
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Philips Semiconductors 45 G (dB 100 BTL configuration ...
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Philips Semiconductors (1) 2 (2) 1 Fig 26. S/N ratio as a function of output power. 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. 9397 750 13357 Preliminary data sheet 120 S/N ...
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Philips Semiconductors 15. Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT ...
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Philips Semiconductors DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 4.6 1.15 ...
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Philips Semiconductors 16. Soldering 16.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 ...
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Philips Semiconductors – for packages with a thickness – for packages with a thickness < 2.5 mm and a volume thick/large packages. • below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < ...
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Philips Semiconductors 16.4 Package related soldering information Table 11: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [4] Through-hole-surface PMFP mount Surface mount BGA, HTSSON..T ...
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Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...