IC AMP AUDIO PWR 37W D 56TSSOP

TAS5122DCA

Manufacturer Part NumberTAS5122DCA
DescriptionIC AMP AUDIO PWR 37W D 56TSSOP
ManufacturerTexas Instruments
SeriesPurePath Digital™
TypeClass D
TAS5122DCA datasheet
 


Specifications of TAS5122DCA

Output Type2-Channel (Stereo)Max Output Power X Channels @ Load37W x 2 @ 6 Ohm
Voltage - Supply16 V ~ 25.5 VFeaturesDepop, Digital Inputs, Mute, Short-Circuit and Thermal Protection, Shutdown
Mounting TypeSurface MountPackage / Case56-TSSOP Exposed Pad, 56-eTSSOP, 56-HTSSOP
For Use WithTAS5508-5122C6EVM - EVAL MODULE FOR TAS5508B/TAS5122TAS5028-5122C6EVM - EVAL MODULE FOR TAS5028A/TAS5122TAS5010-5112F2EVM - EVAL MODULE FOR TAS5010/TAS5112TAS5001-5122C2EVM - EVAL MODULE FOR TAS5001/TAS5122Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other names296-18835-5  
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TAS5122
SLES088E – AUGUST 2003 – REVISED DECEMBER 2004
achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is
formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to
the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipater,
high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Thermal Methodology for the DCA 56-Pin,
2y15-W, 8-W Package
The thermal design for the DCA part (e.g., thermal pad
Figure 15. Recommended Land Pattern
The lower via pad area, slightly larger than the IC pad itself,
is exposed with a window in the solder resist on the bottom
surface of the board. It is not coated with solder during the
board construction to maintain a flat surface. In production,
this can be accomplished with a peelable solder mask.
An aluminum bar is used to keep the through-hole leads
16
soldered to the board) should be similar to the design in the
following figures. The cooling approach is to conduct the
dissipated heat into the via pads on the board, through the
vias in the board, and into a heatsink (aluminum bar) (if
necessary).
Figure 15 shows a recommended land pattern on the
PCB.
Copper Layer − Component Side
Solder
PowerPAD
TAS5122DCA
5y11 Vias (f 0.3 mm)
8 mm
from shorting to the chassis. The thermal compound
shown has a pad-to-aluminum bar thermal resistance of
about 3.2°C/W.
The chassis provides the only heatsink to air and is chosen
as representative of a typical production cooling approach.
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