TDA1554Q/N2,112 NXP Semiconductors, TDA1554Q/N2,112 Datasheet
TDA1554Q/N2,112
Specifications of TDA1554Q/N2,112
935011160112
TDA1554QU
Related parts for TDA1554Q/N2,112
TDA1554Q/N2,112 Summary of contents
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DATA SHEET TDA1554Q single-ended power amplifier Product specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS May 1992 ...
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Philips Semiconductors single-ended power amplifier GENERAL DESCRIPTION The TDA1554Q is an integrated class-B output amplifier in a 17-lead single-in-line (SIL) plastic power package. The circuit contains single-ended ...
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Philips Semiconductors single-ended power amplifier May 1992 Fig.1 Block diagram. 3 Product specification TDA1554Q ...
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Philips Semiconductors single-ended power amplifier PINNING 1 NINV1 non-inverting input 1 2 INV1 inverting input 1 3 GND ground (signal supply voltage ripple rejection 5 V positive supply voltage ...
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Philips Semiconductors single-ended power amplifier DC CHARACTERISTICS measurements taken using Fig.4; unless otherwise specified P amb PARAMETER Supply Supply voltage range Total quiescent ...
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Philips Semiconductors single-ended power amplifier AC CHARACTERISTICS kHz quad single-ended application unless otherwise specified PARAMETER Stereo BTL ...
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Philips Semiconductors single-ended power amplifier PARAMETER Quad single-ended application Output power Output power Total harmonic distortion Low frequency roll-off High frequency roll-off Closed loop voltage ...
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Philips Semiconductors single-ended power amplifier APPLICATION INFORMATION May 1992 Fig.3 Stereo BTL application circuit diagram. 8 Product specification TDA1554Q ...
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Philips Semiconductors single-ended power amplifier May 1992 Fig.4 Quad single-ended application circuit diagram. 9 Product specification TDA1554Q ...
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Philips Semiconductors single-ended power amplifier PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm DIMENSIONS (mm are the original dimensions) UNIT ...
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Philips Semiconductors single-ended power amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are ...