TDA8946J/N1,112 NXP Semiconductors, TDA8946J/N1,112 Datasheet

IC AMP AUDIO PWR 15W STER 17SIL

TDA8946J/N1,112

Manufacturer Part Number
TDA8946J/N1,112
Description
IC AMP AUDIO PWR 15W STER 17SIL
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8946J/N1,112

Output Type
2-Channel (Stereo)
Max Output Power X Channels @ Load
15W x 2 @ 8 Ohm
Voltage - Supply
6 V ~ 25 V
Features
Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Through Hole
Package / Case
17-SIL (Bent and Staggered Leads)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3457-5
935262857112
TDA8946JU
1. General description
2. Features
3. Applications
4. Quick reference data
c
c
The TDA8946J is a dual-channel audio power amplifier with an output power of
2
(BTL) amplifiers with an all-NPN output stage and standby/mute logic. The TDA8946J
comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8946J is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
Table 1:
Symbol Parameter
V
I
I
q
stb
CC
TDA8946J
2 x 15 W stereo Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 14 March 2000
Few external components
Fixed gain
Standby and mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
Thermally protected
Printed-circuit board compatible.
Mains fed applications (e.g. TV sound)
PC audio
Portable audio.
15 W at an 8
supply voltage
quiescent supply current
standby supply current
Quick reference data
load and a 18 V supply. The circuit contains two Bridge Tied Load
Conditions
V
CC
= 18 V; R
L
=
Min
6
-
-
Product specification
Typ
18
28
-
Max
25
42
10
Unit
V
mA
A

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TDA8946J/N1,112 Summary of contents

Page 1

TDA8946J stereo Bridge Tied Load (BTL) audio amplifier Rev. 02 — 14 March 2000 1. General description The TDA8946J is a dual-channel audio power amplifier with an output power ...

Page 2

Philips Semiconductors Table 1: Symbol Parameter P o THD G v SVRR 5. Ordering information Table 2: Type number Package TDA8946J 6. Block diagram idth Fig 1. Block diagram. 9397 750 06863 Product specification Quick reference data …continued Conditions output ...

Page 3

Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration. 7.2 Pin description Table 3: Symbol OUT1 GND1 V CC1 OUT1 n.c. IN1 n.c. IN1 IN2 MODE SVR IN2 9397 750 06863 Product specification handbook, halfpage OUT1 1 GND1 ...

Page 4

Philips Semiconductors Table 3: Symbol n.c. OUT2 GND2 V CC2 OUT2+ 8. Functional description The TDA8946J is a stereo BTL audio power amplifier capable of delivering 2 output power external heatsink. The voltage gain is fixed at ...

Page 5

Philips Semiconductors 8.2 Power amplifier The power amplifi Bridge Tied Load (BTL) amplifier with an all-NPN output stage, capable of delivering a peak output current The BTL principle offers the following advantages: • Lower peak ...

Page 6

Philips Semiconductors Mute — In this mode the amplifier is DC-biased but not operational (no audio output); the DC level of the input and output pins remain on half the supply voltage. This allows the input coupling and Supply Voltage ...

Page 7

Philips Semiconductors 9. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I repetitive peak output current ORM T storage temperature stg T ...

Page 8

Philips Semiconductors 50 handbook, halfpage I q (mA Fig 3. Quiescent supply current as function of supply voltage. 12. Dynamic characteristics Table 8: Dynamic characteristics ...

Page 9

Philips Semiconductors 10 handbook, full pagewidth Fig 5. Output voltage as function of mode voltage. handbook, halfpage Fig 6. Total harmonic distortion as function ...

Page 10

Philips Semiconductors 10 handbook, full pagewidth THD (%) bandpass filter applied. Fig 7. Total harmonic distortion as function of frequency. 20 handbook, halfpage ...

Page 11

Philips Semiconductors 100 handbook, halfpage (%) Fig 10. Efficiency as function of output power. handbook, halfpage No bandpass filter applied. Fig 12. ...

Page 12

Philips Semiconductors 0 handbook, full pagewidth SVRR (dB 700 mV (RMS); no bandpass filter applied ripple Curves A: inputs short-circuited ...

Page 13

Philips Semiconductors 13. Internal circuitry Table 9: Pin 6 and 8 12 and 9 1 and 4 14 and 9397 750 06863 Product specification Internal circuitry Symbol Equivalent circuit IN1+ and IN1 IN2+ and IN2 8, 9 ...

Page 14

Philips Semiconductors 14. Application information 220 Symmetrical C i input 220 nF 220 Asymmetrical C i input 220 nF signal GND MICROCONTROLLER C2 MODE C1 C2 Standby 0 0 Mute 0 ...

Page 15

Philips Semiconductors idth Fig 15. Printed-circuit board layout (single-sided); components view. 14.1.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to ...

Page 16

Philips Semiconductors 14.2 Thermal behaviour and heatsink calculation The measured maximum thermal resistance of the IC package calculation for the heatsink can be made, with the following parameters: T amb(max j(max) R th(tot) including the ...

Page 17

Philips Semiconductors 16. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 17.0 4.6 ...

Page 18

Philips Semiconductors 17. Soldering 17.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit ...

Page 19

Philips Semiconductors 18. Revision history Table 11: Revision history Rev Date CPCN Description 02 20000314 - Product specification; second version; supersedes initial version TDA8946J- April 1999 (9397 750 04882). Modifications: • Table 1 on page • Ordering options ...

Page 20

Philips Semiconductors Table 11: Revision history …continued Rev Date CPCN Description 02 20000314 - Modifications: • Section 14.1 “Printed-circuit board (PCB)” on page • Figure • Section 14.2 “Thermal behaviour and heatsink calculation” on page • Section 15 “Test information” ...

Page 21

Philips Semiconductors 19. Data sheet status Datasheet status Product status Definition Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data ...

Page 22

Philips Semiconductors Philips Semiconductors - a worldwide company Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 ...

Page 23

Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...

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