TDA8559T/N1,518 NXP Semiconductors, TDA8559T/N1,518 Datasheet

IC AMP AUDIO .14W MONO AB 16SOIC

TDA8559T/N1,518

Manufacturer Part Number
TDA8559T/N1,518
Description
IC AMP AUDIO .14W MONO AB 16SOIC
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8559T/N1,518

Package / Case
16-SOIC (3.9mm Width)
Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power X Channels @ Load
140mW x 1 @ 25 Ohm; 35mW x 2 @ 32 Ohm
Voltage - Supply
1.9 V ~ 30 V
Features
Depop, Differential Inputs, Mute, Short-Circuit Protection, Standby
Mounting Type
Surface Mount
Product
General Purpose Audio Amplifiers
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935168790518
TDA8559TD-T
TDA8559TD-T
1. General description
2. Features
3. Applications
The TDA8559T is a stereo amplifier that operates over a wide supply voltage range from
1.9 V to 30 V and consumes a very low quiescent current. This makes it suitable for
battery fed applications (2
can be used with or without a capacitor connected in series with the load. It can be
applied as a headphone amplifier, but also as a mono amplifier with a small speaker
(25 ), or as a line driver in mains applications.
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TDA8559T
Low-voltage stereo headphone amplifier
Rev. 03 — 15 May 2006
Operating voltage from 1.9 V to 30 V
Very low quiescent current
Low distortion
Few external components
Differential inputs
Usable as a mono amplifier in Bridge-Tied Load (BTL) or stereo Single-Ended (SE)
Single-ended mode without loudspeaker capacitor
Mute and Standby mode
Short-circuit proof to ground, to supply voltage (< 10 V) and across load
No switch on or switch off clicks
ESD protected on all pins
Portable telephones
MP3 players
Portable audio
Mains fed equipment
1.5 V cells). Because of an internal voltage buffer, this device
Product data sheets

Related parts for TDA8559T/N1,518

TDA8559T/N1,518 Summary of contents

Page 1

TDA8559T Low-voltage stereo headphone amplifier Rev. 03 — 15 May 2006 1. General description The TDA8559T is a stereo amplifier that operates over a wide supply voltage range from 1 and consumes a very low quiescent ...

Page 2

Philips Semiconductors 4. Quick reference data Table 1. Symbol Supplies q(tot) I stb Stereo application P o THD BTL application P o THD G v [1] Measured with low-pass filter 30 kHz. 5. ...

Page 3

Philips Semiconductors 6. Block diagram Fig 1. Block diagram TDA8559_3 Product data sheets 1 REFERENCE STANDBY 2 IN1 V/I 3 IN1 MUTE INPUT 8 LOGIC MODE 5 IN2 V/I 6 IN2 ...

Page 4

Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3. Symbol STANDBY +IN1 IN1 SVRR +IN2 IN2 MUTE MODE n.c. n.c. OUT2 BUFFER GND OUT1 TDA8559_3 Product data sheets STANDBY ...

Page 5

Philips Semiconductors 8. Functional description The TDA8559T contains two amplifiers with differential inputs, a 0.5V high supply voltage stabilizer. Each amplifier consists of a voltage-to-current converter (V/I), an output amplifier and a common dynamic quiescent current controller. The gain of ...

Page 6

Philips Semiconductors 8.4 Dynamic quiescent controller The Dynamic Quiescent Current controller (DQC) gives the advantage of low quiescent current and low distortion. When there are high frequencies in the output signal, the DQC will increase the quiescent current of the ...

Page 7

Philips Semiconductors 9. Internal circuitry Table 4. Symbol STANDBY +IN1, IN1, +IN2 and IN2 SVRR TDA8559_3 Product data sheets Internal circuits Pin Equivalent circuit and 6 4 Rev. 03 — 15 May 2006 TDA8559T Low-voltage stereo ...

Page 8

Philips Semiconductors Table 4. Symbol MUTE MODE TDA8559_3 Product data sheets Internal circuits …continued Pin Equivalent circuit 7 8 Rev. 03 — 15 May 2006 TDA8559T Low-voltage stereo headphone amplifi mgd112 V P1 250 ...

Page 9

Philips Semiconductors Table 4. Symbol OUT2 and OUT1 BUFFER V and V P2 TDA8559_3 Product data sheets Internal circuits …continued Pin Equivalent circuit 11 and and 16 P1 Rev. 03 — 15 May 2006 TDA8559T Low-voltage stereo ...

Page 10

Philips Semiconductors 10. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V maximum supply voltage (pin 15) P2(max) V maximum supply voltage (pin 16) P1(max) V maximum input voltage i(max) ...

Page 11

Philips Semiconductors Table 7. Characteristics …continued kHz; unless otherwise specified. P amb i Symbol Parameter V noise output voltage no V noise output voltage in no(mute) mute V output ...

Page 12

Philips Semiconductors The capacitor Cb is recommended for stability improvement. The value may vary between 10 nF and 100 nF. This capacitor should be placed close to the IC between pin 12 and pin 13. 13.2 Heatsink design The standard ...

Page 13

Philips Semiconductors 13.4 Input configurations The IC can be applied in two ways, ‘input mode low’ and ‘input mode high’. This can be selected by the input mode at pin 8: 1. Input mode low: pin 8 floating: The DC ...

Page 14

Philips Semiconductors 13.5 Standby/mute 1. The Standby mode (V quiescent current is < avoid ‘pop-noise’ during switch-on or switch-off the IC can be muted (V This can be achieved by a ‘soft-mute’ circuit or by direct ...

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Philips Semiconductors 13.12 Application 7: Line driver application With the supply voltage connected to pin possible to use the head amplifier above the maximum pin 16. The internal supply voltage will be reduced ...

Page 16

Philips Semiconductors Fig 9. Application 2; single-ended to buffer (without loudspeaker capacitor) TDA8559_3 Product data sheets STANDBY 1 REFERENCE 2 V/I IN1 MUTE 7 INPUT 8 LOGIC MODE 5 V/I IN2 ...

Page 17

Philips Semiconductors Fig 10. Application 3; improved single-ended to buffer (without loudspeaker capacitor) TDA8559_3 Product data sheets STANDBY 1 REFERENCE 2 V/I IN1 MUTE 7 INPUT 8 LOGIC MODE 5 IN2 V ...

Page 18

Philips Semiconductors Fig 11. Application 4; BTL mono amplifier TDA8559_3 Product data sheets Low-voltage stereo headphone amplifier STANDBY 1 REFERENCE 2 IN1 V MUTE 7 INPUT 8 LOGIC MODE 5 IN2 V ...

Page 19

Philips Semiconductors Fig 12. Application 5; line driver application TDA8559_3 Product data sheets STANDBY 1 REFERENCE 2 IN1 MUTE 7 INPUT 8 LOGIC MODE 5 IN2 100 k ...

Page 20

Philips Semiconductors 220 Fig 13. Application 6; line driver application TDA8559_3 Product data sheets STANDBY 1 REFERENCE 100 nF 2 IN1 MUTE 8 MODE 100 nF 5 IN2 ...

Page 21

Philips Semiconductors STANDBY 220 nF Fig 14. Application 7; line driver application TDA8559_3 Product data sheets 1 REFERENCE 100 nF 2 IN1 V INPUT MUTE 8 LOGIC MODE 100 nF 5 IN2 V/I 6 ...

Page 22

Philips Semiconductors 13.14 Printed-circuit board layout Fig 15. Printed-circuit board layout The Printed-Circuit Board (PCB) layout supports all applications as illustrated in to Figure Figure 3, and output and supply configuration as shown in voltage 13.15 Response ...

Page 23

Philips Semiconductors 2 10 THD (%) 10 ( kHz ...

Page 24

Philips Semiconductors 0 cs (dB mV Fig 22. Channel separation as a function of frequency (stereo headphone) 0 SVRR (dB ...

Page 25

Philips Semiconductors 1.5 P (W) 1 (1) ( Fig 26. Total worst case power dissipation as a function of supply voltage (SE) (stereo headphone) ...

Page 26

Philips Semiconductors (W) 0.75 (1) 0.5 0. (1) THD = (2) THD = 0 Fig 30 function of supply ...

Page 27

Philips Semiconductors 2 10 THD (%) kHz Fig 34. THD as a function ...

Page 28

Philips Semiconductors 2 10 THD (%) ( ( ...

Page 29

Philips Semiconductors (1) THD = (2) THD = 0 Fig 42. V 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TDA8559_3 Product data sheets ...

Page 30

Philips Semiconductors 15. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 31

Philips Semiconductors 16. Soldering 16.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not ...

Page 32

Philips Semiconductors – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to ...

Page 33

Philips Semiconductors [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C body ...

Page 34

Philips Semiconductors 17. Revision history Table 11. Revision history Document ID Release date TDA8559_3 20060515 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • DIP16 ...

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Philips Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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Philips Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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