BS62LV256SC-70 Brilliance Semiconductor, Inc., BS62LV256SC-70 Datasheet

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BS62LV256SC-70

Manufacturer Part Number
BS62LV256SC-70
Description
Manufacturer
Brilliance Semiconductor, Inc.
Datasheet

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n FEATURES
Ÿ Wide V
Ÿ Very low power consumption :
Ÿ High speed access time :
Ÿ Automatic power down when chip is deselected
Ÿ Easy expansion with CE and OE options
Ÿ Three state outputs and TTL compatible
Ÿ Fully static operation
Ÿ Data retention supply voltage as low as 1.5V
n POWER CONSUMPTION
n PIN CONFIGURATIONS
R0201-BS62LV256
BS62LV256DC
BS62LV256PC
BS62LV256SC
BS62LV256TC
BS62LV256PI
BS62LV256SI
BS62LV256TI
Brilliance Semiconductor, Inc.
V
V
-55
-70
CC
CC
PRODUCT
FAMILY
= 3.0V
= 5.0V
CC
operation voltage : 2.4V ~ 5.5V
VCC
A13
A14
A12
A11
WE
OE
A9
A8
A7
A6
A5
A4
A3
GND
DQ0
DQ1
DQ2
A14
A12
Operation current : 25mA (Max.) at 70ns
Standby current :
Operation current : 40mA (Max.) at 55ns
Standby current :
55ns(Max.) at V
70ns(Max.) at V
A7
A6
A5
A4
A3
A2
A1
A0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TEMPERATURE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
-40
OPERATING
+0
BS62LV256TC
BS62LV256TI
Commercial
O
BS62LV256PC
BS62LV256PI
BS62LV256SC
BS62LV256SI
Industrial
O
C to +70
C to +85
CC
CC
Pb-Free and Green package materials are compliant to RoHS
Very Low Power CMOS SRAM
32K X 8 bit
: 4.5~5.5V
: 3.0~5.5V
0.01uA(Typ.) at 25
0.4uA (Typ.) at 25
O
O
1mA (Max.) at 1MHz
2mA (Max.) at 1MHz
C
C
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A13
A8
A9
A11
OE
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
CC
4.0uA
5.0uA
=5.0V
STANDBY
(I
A10
CE
DQ7
DQ6
DQ5
DQ4
DQ3
GND
DQ2
DQ1
DQ0
A0
A1
A2
CCSB1
, Max)
reserves the right to change products and specifications without notice.
V
0.4uA
0.7uA
CC
O
O
C
C
=3.0V
1.5mA
1MHz
2mA
1
POWER DISSIPATION
n DESCRIPTION
The BS62LV256 is a high performance, very low power CMOS Static
Random Access Memory organized as 32,768 by 8 bits and
operates form a wide range of 2.4V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both
high speed and low power features with typical CMOS standby
current of 0.01uA and maximum access time of 70ns in 3.0V
operation.
Easy memory expansion is provided by an active LOW chip enable
(CE), and active LOW output enable (OE) and three-state output
drivers.
The BS62LV256 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS62LV256 is available in DICE form, JEDEC standard 28 pin
330mil Plastic SOP, 600mil Plastic DIP, 8mmx13.4mm TSOP
(normal type).
n BLOCK DIAGRAM
V
10MHz
18mA
20mA
CC
=5.0V
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
A12
A14
A13
A11
GND
A5
A6
A7
A8
A9
WE
OE
V
CE
CC
35mA
40mA
f
Max.
Address
Operating
Buffer
Input
(I
CC
Control
, Max)
8
8
0.8mA
1MHz
1mA
9
Output
Buffer
Buffer
Input
Data
Data
Decoder
V
Row
10MHz
12mA
15mA
CC
=3.0V
8
8
BS62LV256
512
20mA
25mA
f
Max.
A4
Address Input Buffer
Column Decoder
A3 A2 A1 A0 A10
Memory Array
Write Driver
Column I/O
Sense Amp
Revision
Sep.
512X512
DICE
PDIP-28
SOP-28
TSOP-28
PDIP-28
SOP-28
TSOP-28
PKG TYPE
512
64
6
2006
2.6

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BS62LV256SC-70 Summary of contents

Page 1

... Industrial BS62LV256SI +85 C BS62LV256TI n PIN CONFIGURATIONS • A14 1 28 A12 BS62LV256PC BS62LV256PI BS62LV256SC BS62LV256SI DQ0 11 18 DQ1 12 17 DQ2 13 16 GND A11 A13 5 ...

Page 2

PIN DESCRIPTIONS Name A0-A14 Address Input CE Chip Enable Input WE Write Enable Input OE Output Enable Input DQ0-DQ7 Data Input/Output Ports V CC GND n TRUTH TABLE MODE CE Not selected H (Power Down) Output Disabled L Read ...

Page 3

DC ELECTRICAL CHARACTERISTICS (T PARAMETER PARAMETER NAME V Power Supply CC V Input Low Voltage IL V Input High Voltage IH I Input Leakage Current IL I Output Leakage Current LO V Output Low Voltage OL V Output High ...

Page 4

AC TEST CONDITIONS (Test Load and Input/Output Reference) Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level CLZ OLZ CHZ OHZ WHZ Output Load Others ...

Page 5

SWITCHING WAVEFORMS (READ CYCLE) (1,2,4) READ CYCLE 1 ADDRESS D OUT (1,3,4) READ CYCLE OUT (1, 4) READ CYCLE 3 ADDRESS OUT NOTES high in read Cycle. 2. Device is ...

Page 6

AC ELECTRICAL CHARACTERISTICS (T WRITE CYCLE JEDEC PARANETER PARAMETER NAME NAME t t AVAX AVWH E1LWH WLWH AVWL WHAX WLQZ WHZ ...

Page 7

WRITE CYCLE 2 ADDRESS OUT D IN NOTES must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals ...

Page 8

ORDERING INFORMATION BS62LV256 Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which ...

Page 9

PACKAGE DIMENSIONS (continued TSOP - 28 PDIP - 28 R0201-BS62LV256 12°(2x) 12°(2x Seating Plane 12°(2x) 15 ° "A" SEATING PLANE 15 ...

Page 10

Revision History Revision No. History 2.4 Add Icc1 characteristic parameter 2.5 Change I-grade operation temperature range - from –25 O 2.6 Revised I CCSB1 - from 1.0uA to 4.0uA for 5V C-grade - from 2.0uA to 5.0uA for 5V ...

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