K4S643232F-TC70 Samsung, K4S643232F-TC70 Datasheet

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K4S643232F-TC70

Manufacturer Part Number
K4S643232F-TC70
Description
512K x 32bit x 4 banks synchronous DRAM LVTTL, 3.3V, 143MHz
Manufacturer
Samsung
Datasheet

Specifications of K4S643232F-TC70

Case
TSOP

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Part Number:
K4S643232F-TC70
Manufacturer:
SAMSUNG
Quantity:
8 000
K4S643232F
CMOS SDRAM
2M x 32 SDRAM
512K x 32bit x 4 Banks
Synchronous DRAM
LVTTL
Revision 1.0
January 2002
Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.0 (Jan. 2002)
- 1 -

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K4S643232F-TC70 Summary of contents

Page 1

... K4S643232F SDRAM 512K x 32bit x 4 Banks Samsung Electronics reserves the right to change products or specification without notice. Synchronous DRAM LVTTL Revision 1.0 January 2002 - 1 - CMOS SDRAM Rev. 1.0 (Jan. 2002) ...

Page 2

... K4S643232F Revision History Revision 1.0 (January 16, 2002) • Defined DC spec. Revision 0.1 (September 03, 2001) - • Added K4S643232F-TC/L55 Revision 0.0 (September 03, 2001) - • Initial draft Preliminary Target Spec - 2 - CMOS SDRAM Rev. 1.0 (Jan. 2002) ...

Page 3

... LCBR CLK CKE GENERAL DESCRIPTION The K4S643232F is 67,108,864 bits synchronous high data rate Dynamic RAM organized 524,288 words by 32 bits, fabricated with SAMSUNG s high performance CMOS technol- ogy. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle ...

Page 4

... K4S643232F PIN CONFIGURATION (Top view DQM0 A10/AP DQM2 DQ16 V DQ17 DQ18 V DQ19 DQ20 V DQ21 DQ22 V DQ23 DQ0 DDQ DQ1 4 83 DQ2 SSQ DQ3 7 80 DQ4 DDQ DQ5 10 77 DQ6 ...

Page 5

... K4S643232F PIN FUNCTION DESCRIPTION Pin Name CLK System clock CS Chip select CKE Clock enable Address 0 10 BA0,1 Bank select address RAS Row address strobe CAS Column address strobe WE Write enable DQM0 ~ 3 Data input/output mask DQ ~ Data input/output Power supply/ground ...

Page 6

... AC.The overshoot voltage duration (min) = -2.0V AC. The undershoot voltage duration Any input DDQ Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. 4. The V condition of K4S643232F-45/50/55/60 is 3.135V ~ 3.6V DD CAPACITANCE (V = 3.3V Pin Clock RAS, CAS, WE, CS, CKE, DQM Address ...

Page 7

... Operating Current I CC4 (Burst Mode) Refresh Current I CC5 Self Refresh Current I CC6 Notes : 1. Unless otherwise notes, Input level is CMOS(V 2. Measured with outputs open. 3. Refresh period is 64ms. 4. K4S643232F-TC** 5. K4S643232F-TL Test Condition Burst Length = (min (min 0mA ...

Page 8

... Input rise and fall time Output timing measurement reference level Output load condition 3.3V 1200 Output 870 (Fig output load circuit 1. The V condition of K4S643232F-45/50/55/60 is 3.135V ~ 3.6V Notes : DD OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) Parameter CAS Latency CLK cycle time Row active to row active delay ...

Page 9

... K4S643232F Parameter Row active to row active delay t RAS to CAS delay Row precharge time Row active time Row cycle time 2. Minimum delay is required to complete write. 3. All parts allow every cycle column address change case of row precharge interrupt, auto precharge and read burst stop. ...

Page 10

... K4S643232F SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Entry Refresh Self refresh Bank active & row addr. Read & Auto precharge disable column address Auto precharge enable Write & Auto precharge disable column address Auto precharge enable Burst Stop ...

Page 11

... K4S643232F MODE REGISTER FIELD TABLE TO PROGRAM MODES Register Programmed with MRS Address / Function RFU RFU Test Mode A A Type Mode Register Set 0 1 Reserved 1 0 Reserved 1 1 Reserved Write Burst Length Length Burst 1 Single Bit POWER UP SEQUENCE SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations ...

Page 12

... K4S643232F BURST SEQUENCE (BURST LENGTH = 4) Initial Address BURST SEQUENCE (BURST LENGTH = 8) Initial Address Sequential ...

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