TDA8552TS NXP Semiconductors, TDA8552TS Datasheet
TDA8552TS
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TDA8552TS Summary of contents
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... DATA SHEET TDA8552T; TDA8552TS 2 1.4 W BTL audio amplifiers with digital volume control and headphone sensing Preliminary specification Supersedes data of 1998 Feb 26 File under Integrated Circuits, IC01 INTEGRATED CIRCUITS 1998 Jun 02 ...
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... BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient and across the DD temperature ...
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... mode 3 THD = 10 low gain; maximum volume low gain; minimum volume high gain; maximum volume high gain; minimum volume Preliminary specification TDA8552T; TDA8552TS MIN. TYP. MAX. UNIT 2 ...
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... DD 0.5V DD TDA8552T 15 k MASTER 1.6 k down 0. 0. GAIN SELECTION 14 GAINSEL Fig.1 Block diagram. 4 Preliminary specification TDA8552T; TDA8552TS V DD2 V DD3 V DD4 OUT1 OUT1 SLAVE 2 OUT2 OUT2 SLAVE 1, 10, 11, 20 ...
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... For the SO20 (SOT163-1) package only: the ground pins 1, 10, 11 and 20 are mechanically connected to the leadframe and electrically to the substrate of the die. On the PCB the ground pins can be connected to a copper area to decrease the thermal resistance. 1998 Jun 02 TDA8552T; TDA8552TS handbook, halfpage GND1 1 OUT2 2 ...
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... The current consumption is very low, approximately 1 A (typ.). In battery fed applications the volume setting can be maintained during battery exchange if there is a supply capacitor available. 6 Preliminary specification TDA8552T; TDA8552TS 1.25 dB (typical value double push-button. When the supply (repeat function). pin does not fall below the ...
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... One of the benefits of this system is that the loudspeaker current does not flow through the jack connector switch, which could give some output power loss. The other benefit is that the quiescent current is reduced when the headphone jack is inserted. 7 Preliminary specification TDA8552T; TDA8552TS The device then DD ...
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... P maximum power dissipation tot THERMAL CHARACTERISTICS See Section “Thermal design considerations” in Chapter “Test and application information”. SYMBOL PARAMETER R thermal resistance from junction to ambient th(j-a) for the TDA8552T (SO20) for the TDA8552TS (SSOP20) Table 1 Power rating; note 3 ...
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... SE mode 3 MODE DD note 2 GAINSEL = 0 V GAINSEL = V DD standby mute operating 0 < V < V MODE DD note 3 low gain (20 dB) high gain (30 dB) SE mode; headphone detected 9 Preliminary specification TDA8552T; TDA8552TS MIN. TYP. MAX. 2 ...
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... DC output offset voltage to 2 --------------------------------------------------------------- - The DC output voltage with respect to ground is approximately 0.5V 3. Output voltage in mute position is measured with an input (RMS bandwidth of 20 kHz, so including noise, gain select pin is LOW (0 V). 1998 Jun 02 TDA8552T; TDA8552TS CONDITIONS MIN. 50 100 4.1 1 < V < V ...
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... LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of R frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set (RMS). 1998 Jun 02 TDA8552T; TDA8552TS = 0 V; gain select pin MODE CONDITIONS MIN. THD = 10% ...
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... LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of R frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set (RMS). 1998 Jun 02 TDA8552T; TDA8552TS = 0 V; Gain select pin MODE CONDITIONS MIN. THD = 10% ...
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... THD = 0.5 5 note 1 note 2 50 THD = 1 rep t w increasing volume floating decreasing volume Fig.3 Timing UP/DOWN pin. 13 Preliminary specification TDA8552T; TDA8552TS MIN. TYP. MAX. UNIT 0. 100 1. the input. ...
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... DD INTERFACE 15 k 0. GAIN STANDBY/MUTE AND OPERATING SELECTION 14 GAINSEL V DD Fig.4 Test and application diagram. 14 Preliminary specification TDA8552T; TDA8552TS 100 V DD1 DD3 220 13 OUT1 MASTER 220 ...
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... When for the balance control only a single contact is used, the balance steps are 1.25 dB. If double contacts are used for the balance buttons and the dashed connection is made, then the balance steps are 2.5 dB. 15 Preliminary specification TDA8552T; TDA8552TS = dB, audio band-pass L v ...
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... This maximum gain setting is maintained until the supply voltage drops below the minimum value. balance left handbook, full pagewidth volume V DD balance right 1998 Jun 02 2 UP/DOWN1 100 nF 2.2 k UP/DOWN2 100 nF down Fig.5 Volume and balance control using buttons. 16 Preliminary specification TDA8552T; TDA8552TS 6 TDA8552T 7 MGM612 ...
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... Preliminary specification TDA8552T; TDA8552TS MGR006 (1) ( volume steps = (max.). = 20 dB (max.). MGR008 (1) (2) ( kHz (max.). ...
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... MGR011 10 handbook, halfpage THD (%) ( Preliminary specification TDA8552T; TDA8552TS (1) ( (max.). L v Fig.11 THD as a function of P (1) (2) ( ...
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... ( dB dB. v Fig.17 Channel separation as a function of 19 Preliminary specification TDA8552T; TDA8552TS MGR014 (1) ( (dB kHz; THD = 1%. L MGL435 (1) ( (Hz frequency ...
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... CIC – Nijmegen 1998 Jun 02 GND Vdd 220 F 100 nF MODE 100 k 330 150 nF 330 nF 220 F TDA8552/53TS 20 dB 220 220 F OUT1 OUT2 Fig.18 Printed-circuit board layout. 20 Preliminary specification TDA8552T; TDA8552TS 77 bottom view 1 820 k 1.5 k DOWN MGR015 79 ...
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... 0.32 13.0 7.6 10.65 1.27 0.23 12.6 7.4 10.00 0.013 0.51 0.30 0.419 0.050 0.055 0.009 0.49 0.29 0.394 REFERENCES JEDEC EIAJ MS-013AC 21 Preliminary specification TDA8552T; TDA8552TS detail 1.1 1.1 1.4 0.25 0.25 0.1 0.4 1.0 0.043 0.043 0.01 0.01 0.004 0.016 ...
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... SOT266-1 1998 Jun 2.5 scale (1) ( 0.20 6.6 4.5 6.6 0.65 0.13 6.4 4.3 6.2 REFERENCES JEDEC EIAJ 22 Preliminary specification TDA8552T; TDA8552TS detail 0.75 0.65 1.0 0.2 0.13 0.1 0.45 0.45 EUROPEAN ISSUE DATE PROJECTION SOT266-1 ...
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... The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. 1998 Jun 02 TDA8552T; TDA8552TS SSOP Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jun 02 TDA8552T; TDA8552TS 24 Preliminary specification ...
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... Philips Semiconductors 2 1.4 W BTL audio amplifiers with digital volume control and headphone sensing 1998 Jun 02 TDA8552T; TDA8552TS NOTES 25 Preliminary specification ...
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... Philips Semiconductors 2 1.4 W BTL audio amplifiers with digital volume control and headphone sensing 1998 Jun 02 TDA8552T; TDA8552TS NOTES 26 Preliminary specification ...
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... Philips Semiconductors 2 1.4 W BTL audio amplifiers with digital volume control and headphone sensing 1998 Jun 02 TDA8552T; TDA8552TS NOTES 27 Preliminary specification ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, ...