LM4835MT/NOPB National Semiconductor, LM4835MT/NOPB Datasheet

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LM4835MT/NOPB

Manufacturer Part Number
LM4835MT/NOPB
Description
IC AMP AUDIO PWR 2.2W AB 28TSSOP
Manufacturer
National Semiconductor
Series
Boomer®r
Type
Class ABr
Datasheet

Specifications of LM4835MT/NOPB

Output Type
2-Channel (Stereo) with Stereo Headphones
Max Output Power X Channels @ Load
2.2W x 2 @ 3 Ohm; 95mW x 2 @ 32 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Depop, Mute, Shutdown, Thermal Protection, Volume Control
Mounting Type
Surface Mount
Package / Case
28-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*LM4835MT/NOPB
© 2003 National Semiconductor Corporation
LM4835
Stereo 2W Audio Power Amplifiers
with DC Volume Control and Selectable Gain
General Description
The LM4835 is a monolithic integrated circuit that provides
DC volume control, and stereo bridged audio power amplifi-
ers capable of producing 2W into 4Ω (Note 1) with less than
1.0% THD or 2.2W into 3Ω (Note 2) with less than 1.0%
THD.
Boomer
to provide high quality audio while requiring a minimum
amount of external components. The LM4835 incorporates a
DC volume control, stereo bridged audio power amplifiers
and a selectable gain or bass boost, making it optimally
suited for multimedia monitors, portable radios, desktop, and
portable computer applications.
The LM4835 features an externally controlled, low-power
consumption shutdown mode, and both a power amplifier
and headphone mute for maximum system flexibility and
performance.
Note 1: When properly mounted to the circuit board, the LM4835LQ and
LM4835MTE will deliver 2W into 4Ω. The LM4835MT will deliver 1.1W into
8Ω. See the Application Information section LM4835LQ and for LM4835MTE
usage information.
Note 2: An LM4835LQ and LM4835MTE that have been properly mounted
to the circuit board and forced-air cooled will deliver 2.2W into 3Ω.
Connection Diagrams
Boomer
See NS Package LQA028AA for Exposed-DAP LLP
®
is a registered trademark of NationalSemiconductor Corporation.
®
audio integrated circuits were designed specifically
Order Number LM4835LQ
LLP Package
Top View
DS100139
10013935
Key Specifications
n P
n
n
n
n Single-ended mode - THD+N at 85mW into 32Ω
n Shutdown current
Features
n PC98 Compliant
n DC Volume Control Interface
n System Beep Detect
n Stereo switchable bridged/single-ended power amplifiers
n Selectable internal/external gain and bass boost
n “Click and pop” suppression circuitry
n Thermal shutdown protection circuitry
Applications
n Portable and Desktop Computers
n Multimedia Monitors
n Portable Radios, PDAs, and Portable TVs
or See NS Package MXA28A for Exposed-DAP TSSOP
(typ)
configurable
O
into 3Ω (LM4835LQ, LM4835MTE)
into 4Ω (LM4835LQ, LM4835MTE)
into 8Ω (LM4835)
at 1% THD+N
Order Number LM4835MT or LM4835MTE
See NS Package MTC28 for TSSOP
TSSOP Package
Top View
10013902
February 2003
www.national.com
0.7µA (typ)
2.2W (typ)
2.0W (typ)
1.1W (typ)
1.0%

Related parts for LM4835MT/NOPB

LM4835MT/NOPB Summary of contents

Page 1

... Connection Diagrams LLP Package Top View Order Number LM4835LQ See NS Package LQA028AA for Exposed-DAP LLP Boomer ® registered trademark of NationalSemiconductor Corporation. © 2003 National Semiconductor Corporation Key Specifications THD+N O into 3Ω (LM4835LQ, LM4835MTE) n into 4Ω (LM4835LQ, LM4835MTE) n into 8Ω ...

Page 2

Block Diagram www.national.com FIGURE 1. LM4835 Block Diagram 2 10013901 ...

Page 3

... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation ESD Susceptibility (Note 14) ESD Susceptibility (Note 15) Junction Temperature Soldering Information Small Outline Package Vapor Phase (60 sec ...

Page 4

Electrical Characteristics for Single-Ended Mode Operation (Notes 8, 12) The following specifications apply for V Symbol Parameter SNR Signal to Noise Ratio X Channel Separation talk Electrical Characteristics for Bridged Mode Operation (Notes 8, 12) The following specifications apply for ...

Page 5

Typical Application Truth Table for Logic Inputs Mute Mode Note 18: If system beep is detected on the Beep In pin (pin 11), the system beep will be passed through ...

Page 6

Typical Performance Characteristics MTE Specific Characteristics LM4835MTE THD+N vs Output Power LM4835MTE THD+N vs Output Power LM4835MTE Power Dissipation vs Output Power www.national.com 10013970 10013972 10013965 6 LM4835MTE THD+N vs Frequency 10013971 LM4835MTE THD+N vs Frequency 10013973 LM4835MTE (Note 19) ...

Page 7

Typical Performance Characteristics MTE Specific Characteristics Note 19: These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions: 2 500LFPM + 2in : The part is soldered to a 2in 2 2in on ...

Page 8

Typical Performance Characteristics Non-MTE Specific Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Frequency www.national.com (Continued) THD+N vs Frequency 10013914 THD+N vs Frequency 10013916 THD+N vs Frequency 10013918 8 10013915 10013917 10013919 ...

Page 9

Typical Performance Characteristics Non-MTE Specific Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power (Continued) 10013920 THD+N vs Output Power 10013922 THD+N vs Output Power 10013925 9 THD+N vs Frequency 10013921 10013924 10013926 www.national.com ...

Page 10

Typical Performance Characteristics Non-MTE Specific Characteristics THD+N vs Output Power THD+N vs Output Power THD+N vs Output Power www.national.com (Continued) THD+N vs Output Power 10013927 THD+N vs Output Power 10013929 THD+N vs Output Power 10013931 10 10013928 10013930 10013932 ...

Page 11

Typical Performance Characteristics Non-MTE Specific Characteristics THD+N vs Output Power THD+N vs Output Voltage Docking Station Pins (Continued) THD+N vs Output Power 10013933 THD+N vs Output Voltage Docking Station Pins 10013959 11 10013934 10013960 www.national.com ...

Page 12

Typical Performance Characteristics Output Power vs Load Resistance Output Power vs Load Resistance Dropout Voltage www.national.com 10013962 10013907 10013953 12 Output Power vs Load Resistance 10013906 Power Supply Rejection Ratio 10013938 Output Power vs Load Resistance 10013908 ...

Page 13

Typical Performance Characteristics Noise Floor Volume Control Characteristics Power Dissipation vs Output Power (Continued) 10013941 10013910 10013952 13 Noise Floor 10013942 Power Dissipation vs Output Power 10013951 External Gain/ Bass Boost Characteristics 10013961 www.national.com ...

Page 14

Typical Performance Characteristics Power Derating Curve Crosstalk Output Power vs Supply Voltage www.national.com (Continued) 10013963 10013950 10013956 14 Crosstalk 10013949 Output Power vs Supply voltage 10013954 Supply Current vs Supply Voltage 10013909 ...

Page 15

Application Information EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS The LM4835’s exposed-DAP (die attach paddle) packages (MTE and LQ) provide a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat ...

Page 16

Application Information However, a direct consequence of the increased power de- livered to the load by a bridge amplifier is higher internal power dissipation for the same conditions. The LM4835 has two operational amplifiers per channel. The maximum internal power ...

Page 17

Application Information the pop is directly proportional to the input capacitor’s size. Higher value capacitors need more time to reach a quiescent DC voltage (usually V /2) when charged with a fixed cur- DD rent. The amplifier’s output charges the ...

Page 18

Application Information tected on pin 11, the bridge output amplifiers are enabled. The beep signal is amplified and applied to the load con- nected to the output amplifiers. A valid beep signal will be applied to the load even when ...

Page 19

Application Information HP-IN FUNCTION Applying a voltage between 4V and V HP-IN headphone control pin turns off Amp2A and Amp2B, muting a bridged-connected load. Quiescent current con- sumption is reduced when the this single-ended mode. Figure 4 ...

Page 20

Application Information stereo channels, and the step size is small enough to reach a desired volume that is not too loud or too soft. Since gain accuracy is not critical, there will be volume variation from part-to-part even with the ...

Page 21

Application Information FIGURE 6. Recommended LQ PC Board Layout: FIGURE 7. Recommended LQ PC Board Layout: (Continued) Component-Side Silkscreen Component-Side Layout 21 10013977 10013978 www.national.com ...

Page 22

Application Information www.national.com (Continued) FIGURE 8. Recommended LQ PC Board Layout: Upper Inner-Layer Layout FIGURE 9. Recommended LQ PC Board Layout: Lower Inner-Layer Layout 22 10013979 10013980 ...

Page 23

Application Information FIGURE 10. Recommended LQ PC Board Layout: (Continued) Bottom-Side Layout 23 10013981 www.national.com ...

Page 24

LM4835 MDC MWC Stereo 2W Audio Power Amplifier with DC Volume Control and Selectable Gain DIE/WAFER CHARACTERISTICS Fabrication Attributes Physical Die Identification Die Step Physical Attributes Wafer Diameter Dise Size (Drawn) Thickness Min Pitch Special Assembly Requirements: Note: Actual die ...

Page 25

LM4835 MDC MWC Stereo 2W Audio Power Amplifier with DC Volume Control and Selectable Gain (Continued) GND 15 Left Out + 16 VDD 17 Left Out - 18 Left Gain 2 19 Left Gain 1 20 GND 21 HP Sense ...

Page 26

Physical Dimensions NS Package Number LQA028A For Exposed-DAP LLP www.national.com inches (millimeters) unless otherwise noted LLP Package Order Number LM4835LQ 26 ...

Page 27

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NS Package Number MXA28A for Exposed-DAP TSSOP TSSOP Package Order Number LM4835MT NS Package Number MTC28 for TSSOP Exposed-DAP TSSOP Package Order Number LM4835MTE 27 www.national.com ...

Page 28

... NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant ...

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