ISP1107W Philips Semiconductors, ISP1107W Datasheet
ISP1107W
Related parts for ISP1107W
ISP1107W Summary of contents
Page 1
ISP1105/1106/1107 Advanced Universal Serial Bus transceivers Rev. 06 — 30 November 2001 1. General description The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully compliant with the Universal Serial Bus Specification Rev. 1.1 . They are ideal for ...
Page 2
... Type number Package Name Description [1] ISP1105W HBCC16 plastic, heatsink bottom chip carrier; 16 terminals; body 3 ISP1106W ISP1107W ISP1106DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm ISP1107DH [1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink). 4.1 Ordering options Table 2: Selection guide ...
Page 3
... Philips Semiconductors 5. Functional diagram (1) Use a 39 (2) Connect to D for low-speed operation. (3) Pin function depends on device type see (4) Only for ISP1105. Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107). 9397 750 08872 Product data 3 CC(I/O) REGULATOR SOFTCON OE SPEED (3) VMO/FSE0 (3) VPO/VO (4) MODE LEVEL ...
Page 4
... D 9 SUSPND VPO/VO VP VMO/FSE0 12 RCV V reg(3. Bottom view MBL303 The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107W. Fig 3. Pinning diagram HBCC16 (ISP1106 and ISP1107). V CC(5.0) V pu(3. reg(3.3) SOFTCON VMO/FSE0 RCV 4 13 VPO/VO ...
Page 5
... Philips Semiconductors 6.2 Pin description Table 3: Pin description [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 RCV SUSPND 5 5 MODE 6 [2] GND - CC(I/O) SPEED VPO/ VMO/FSE0 12 12 9397 750 08872 Product data Type ...
Page 6
... Philips Semiconductors Table 3: Pin description …continued [1] Symbol Pin ISP1105 ISP1106/7 HBCC16 HBCC16 reg(3. CC(5. pu(3.3) SOFTCON 16 16 [1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. [2] Down bonded to the exposed diepad. 7. Functional description 7.1 Function selection Table 4: SUSPND [1] ...
Page 7
... Philips Semiconductors 7.2 Operating functions Table 5: Table 6: Table 7: [ indicates the sharing mode (V [2] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is stable during the SE0 period. 7.3 Power supply configurations The ISP1105/1106/1107 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Normal mode — ...
Page 8
... Philips Semiconductors low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of V reg(3.3) Table 8: Pins V CC(5.0) V CC(I/O) V pu(3. (VP, VM) RCV Inputs (VO/VPO, FSE0/VMO, SPEED, MODE SOFTCON) [1] High impedance or driven LOW. ...
Page 9
... Philips Semiconductors Table 10: Input option Internal regulator Regulator bypass 8. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V regulated supply voltage reg(3. input voltage I I latch-up current latchup ...
Page 10
... Philips Semiconductors 9. Static characteristics Table 13: Static characteristics: supply pins V = 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter V regulated supply voltage reg(3.3) output I operating supply current CC I operating I/O supply current full-speed transmitting and receiving CC(I/O) I supply current during ...
Page 11
... Philips Semiconductors Table 14: Static characteristics: digital pins V = 1. CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input voltage IH Output levels V LOW-level output voltage OL V HIGH-level output voltage OH Leakage current I input leakage current LI Example 1.8 V 0.15 V CC(I/O) Input levels ...
Page 12
... Philips Semiconductors Table 15: Static characteristics: analog I/O pins ( 4 3 reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI V differential common mode CM voltage Single-ended receiver V LOW-level input voltage IL V HIGH-level input voltage IH V hysteresis voltage hys Output levels ...
Page 13
... Philips Semiconductors 10. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter Driver characteristics Full-speed mode (SPEED = HIGH) t rise time FR t fall time FF FRFM differential rise/fall time matching (t ...
Page 14
... Philips Semiconductors Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter Receiver timings (full-speed and low-speed mode) Differential receiver t propagation delay PLH(rcv RCV) PHL(rcv) Single-ended receiver t propagation delay ...
Page 15
... Philips Semiconductors 11. Test information for (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Fig 9. Load for enable and disable times. Fig 10. Load for VM, VP and RCV. Load capacitance: (1) Full-speed mode: connected low-speed mode: connected (2) Complies with USB 1.1. For USB 2.0 a resistor of 39 Fig 11 ...
Page 16
... Philips Semiconductors 12. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original dimensions UNIT 1 2 max. 0.10 0.7 0.33 0.33 mm 0.8 0.05 0.6 0.27 0.27 OUTLINE VERSION IEC SOT639-2 Fig 12. HBCC16 package outline. ...
Page 17
... Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.10 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
Page 18
... Philips Semiconductors 13. Packaging The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 100 mm. ...
Page 19
... Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fi ...
Page 20
... Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications ...
Page 21
... Philips Semiconductors 15. Additional soldering information 15.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures solderability, the Ni layer (5 m min.) prevents diffusion, and the Pd layer on top (0.5 m min.) ensures effective wire bonding. ...
Page 22
... Philips Semiconductors 16. Revision history Table 19: Revision history Rev Date CPCN Description 06 20011130 - Product data; sixth version. Supersedes ISP1105_1106_1107- Sept 2001 (9397 750 08643). Modifications: • Changed the HBCC16 package version from SOT639-1 to SOT639-2 in: – – – • Section 7.4 “Power supply input regulator is not used in single-ended mode and is shutdown.” ...
Page 23
... This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. ...
Page 24
... Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 7.1 Function selection 7.2 Operating functions 7.3 Power supply configurations . . . . . . . . . . . . . . . 7 7.4 Power supply input options . . . . . . . . . . . . . . . . 8 8 Limiting values Static characteristics ...