mrf7s18170h Freescale Semiconductor, Inc, mrf7s18170h Datasheet

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mrf7s18170h

Manufacturer Part Number
mrf7s18170h
Description
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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© Freescale Semiconductor, Inc., 2006. All rights reserved.
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N - Channel Enhancement - Mode Lateral MOSFETs
1880 MHz. Suitable for CDMA and multicarrier amplifier applications. To be
u s e d i n C l a s s A B a n d C l a s s C f o r P C N - P C S / c e l l u l a r r a d i o a n d W L L
applications.
• Typical Single - Carrier W - CDMA Performance: V
• Capable of Handling 5:1 VSWR, @ 32 Vdc, 1840 MHz, 170 Watts CW
• P
Features
• 100% PAR Tested for Guaranteed Output Power Capability
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Internally Matched for Ease of Use
• Integrated ESD Protection
• Greater Negative Gate - Source Voltage Range for Improved Class C
• Designed for Digital Predistortion Error Correction Systems
• RoHS Compliant
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Freescale Semiconductor
Technical Data
Table 1. Maximum Ratings
Table 2. Thermal Characteristics
Drain - Source Voltage
Gate - Source Voltage
Operating Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
Thermal Resistance, Junction to Case
Designed for CDMA base station applications with frequencies from 1805 to
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access the MTTF
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
1400 mA, P
64 DPCH with 50% Clipping, Channel Bandwidth = 3.84 MHz, Input Signal
PAR = 7.5 dB @ 0.01% Probability on CCDF.
Peak Tuned Output Power
Operation
Case Temperature 84°C, 170 W CW
Case Temperature 79°C, 50 W CW
out
Power Gain — 17.5 dB
Drain Efficiency — 31%
Device Output Signal PAR — 6.2 dB @ 0.01% Probability on CCDF
ACPR @ 5 MHz Offset — - 37 dBc in 3.84 MHz Channel Bandwidth
calculators by product.
Select Documentation/Application Notes - AN1955.
@ 1 dB Compression Point w 170 Watts CW
out
= 50 Watts Avg., Full Frequency Band, 3GPP Test Model 1,
(1,2)
Characteristic
Rating
DD
= 28 Volts, I
DQ
=
Symbol
Symbol
V
R
V
V
T
T
DSS
T
θJC
GS
DD
stg
C
J
Document Number: MRF7S18170H
MRF7S18170HR3 MRF7S18170HSR3
1805 - 1880 MHz, 50 W AVG., 28 V
MRF7S18170HSR3
MRF7S18170HR3
LATERAL N - CHANNEL
CASE 465B - 03, STYLE 1
CASE 465C - 02, STYLE 1
RF POWER MOSFETs
SINGLE W - CDMA
MRF7S18170HSR3
MRF7S18170HR3
- 65 to +150
Value
- 0.5, +65
- 6.0, +10
32, +0
Value
0.27
0.30
NI - 880S
150
225
NI - 880
(2,3)
Rev. 0, 10/2006
°C/W
Unit
Unit
Vdc
Vdc
Vdc
°C
°C
°C
1

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mrf7s18170h Summary of contents

Page 1

... Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2006. All rights reserved. RF Device Data Freescale Semiconductor Document Number: MRF7S18170H MRF7S18170HR3 MRF7S18170HSR3 1805 - 1880 MHz AVG Volts ...

Page 2

... Adjacent Channel Power Ratio Input Return Loss Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit GG GS(Q) schematic. 2. Part internally matched both on input and output. MRF7S18170HR3 MRF7S18170HSR3 2 = 25°C unless otherwise noted) C Symbol I DSS I DSS ...

Page 3

... Delay = 170 W CW, ΔΦ out ΔG ΔP1dB Min Typ Max = 1400 mA, 1805 - 1880 MHz Bandwidth — 25 — — 0.4 — — 2.5 — — 4.2 — — 15 — — 0.015 — — 0.01 — MRF7S18170HR3 MRF7S18170HSR3 Unit MHz dB ° ns ° dB/°C dBm/°C 3 ...

Page 4

... Z7 1.110″ x 1.360″ Microstrip Z8 0.480″ x 1.360″ Microstrip Z9 0.060″ x 1.098″ Microstrip Figure 1. MRF7S18170HR3 Test Circuit Schematic — 880 Table 5. MRF7S18170HR3 Test Circuit Component Designations and Values — 880 Part C1 0.8 pF Chip Capacitor C2, C8, C9 6.8 pF Chip Capacitors C3 100 pF Chip Capacitor ...

Page 5

... C18 C19 Figure 2. MRF7S18170HR3 Test Circuit Component Layout — 880 RF Device Data Freescale Semiconductor C20 C13 C10 C17 C11 C12 C9 C8 C15 C14 C6 C7 C16 C5 MRF7S18170H Rev. 4 MRF7S18170HR3 MRF7S18170HSR3 5 ...

Page 6

... Z7 1.110″ x 1.360″ Microstrip Z8 0.480″ x 1.360″ Microstrip Z9 0.060″ x 1.098″ Microstrip Figure 3. MRF7S18170HSR3 Test Circuit Schematic — 880S Table 6. MRF7S18170HSR3 Test Circuit Component Designations and Values — 880S Part C1 0.8 pF Chip Capacitor C2, C8, C9 6.8 pF Chip Capacitors C3 100 pF Chip Capacitor ...

Page 7

... C18 C19 Figure 4. MRF7S18170HSR3 Test Circuit Component Layout — 880S RF Device Data Freescale Semiconductor C20 C13 C10 C17 C11 C12 C9 C8 C15 C14 C6 C7 C16 C5 MRF7S18170H Rev. 4 MRF7S18170HR3 MRF7S18170HSR3 7 ...

Page 8

... Vdc 1835 MHz 1845 MHz DD Two−Tone Measurements, 10 MHz Tone Spacing OUTPUT POWER (WATTS) PEP out Figure 7. Two - Tone Power Gain versus Output Power MRF7S18170HR3 MRF7S18170HSR3 8 TYPICAL CHARACTERISTICS Vdc (Avg.), I = 1400 mA DD out DQ Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth, PAR = 7 ...

Page 9

... Figure 10. Intermodulation Distortion Products versus Tone Spacing Actual 25 20 105 120 −30_C 25_C T = −30_C C 85_C 25_C 85_C Vdc 1400 1840 MHz 10 100 P , OUTPUT POWER (WATTS) CW out versus CW Output Power MRF7S18170HR3 MRF7S18170HSR3 100 400 9 ...

Page 10

... W−CDMA. ACPR Measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. 0.001 PAR = 7 0.01% Probability on CCDF 0.0001 PEAK−TO−AVERAGE (dB) Figure 16. CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 50% Clipping, Single - Carrier Test Signal MRF7S18170HR3 MRF7S18170HSR3 10 TYPICAL CHARACTERISTICS 1400 1840 MHz ...

Page 11

... MHz W W 1760 1.93 - j6.00 1.13 - j2.65 1780 1.95 - j6.10 1.05 - j2.45 1800 1.99 - j6.18 0.97 - j2.29 1820 1.95 - j6.22 0.90 - j2.12 1840 1.85 - j6.30 0.85 - j2.00 1860 1.71 - j6.26 0.81 - j1.84 1880 1.55 - j6.25 0.75 - j1.70 1900 1.39 - j6.20 0.70 - j1.54 1920 1.23 - j6.15 0.67 - j1. Test circuit impedance as measured from source gate to ground Test circuit impedance as measured load from drain to ground. Input Device Under Matching Network Test Z Z source load Output Matching Network MRF7S18170HR3 MRF7S18170HSR3 11 ...

Page 12

... P , INPUT POWER (dBm) in NOTE: Measured in a Peak Tuned Load Pull Fixture Test Impedances per Compression Level Z source Ω 3dB 1.23 - j7.91 Figure 19. Pulsed CW Output Power versus Input Power MRF7S18170HR3 MRF7S18170HSR3 12 61 Ideal 60 59 P3dB = 54.65 dBm (290 P1dB = 54.05 dBm 56 (254 Actual ...

Page 13

... E 0.035 0.045 0.89 S (INSULATOR) F 0.003 0.006 0.08 H 0.057 0.067 1. 0.170 0.210 4.32 M 0.872 0.888 22.15 22.55 N 0.871 0.889 19.30 22.60 R 0.515 0.525 13.10 13.30 S 0.515 0.525 13.10 13.30 aaa 0.007 REF 0.178 REF F bbb 0.010 REF 0.254 REF ccc 0.015 REF 0.381 REF STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE MRF7S18170HR3 MRF7S18170HSR3 5.08 1.14 0.15 1.70 5.33 13 ...

Page 14

... AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins • EB212: Using Data Sheet Impedances for RF LDMOS Devices The following table summarizes revisions to this document. Revision Date • Initial Release of Data Sheet 0 Oct. 2006 MRF7S18170HR3 MRF7S18170HSR3 14 PRODUCT DOCUMENTATION REVISION HISTORY Description RF Device Data Freescale Semiconductor ...

Page 15

... Denver, Colorado 80217 1 - 800 - 441 - 2447 or 303 - 675 - 2140 Fax: 303 - 675 - 2150 LDCForFreescaleSemiconductor@hibbertgroup.com RF Device Data Document Number: MRF7S18170H Rev. 0, 10/2006 Freescale Semiconductor Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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