CXA1522P Sony, CXA1522P Datasheet
CXA1522P
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CXA1522P Summary of contents
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... PACKAGE MATERIAL LEAD TREATMENT DIP-16P-01 DIP016-P-0300 LEAD MATERIAL PACKAGE MASS Similar to MO-001-AE ITEM SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm −7− CXA1522P/M/N 0˚ to 15˚ EPOXY RESIN SOLDER PLATING COPPER ALLOY 1.0 g 0˚ to 15˚ EPOXY RESIN SOLDER PLATING COPPER ALLOY 1.0 g ...
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... M PACKAGE STRUCTURE PACKAGE MATERIAL SOP-16P-L01 LEAD TREATMENT SOP016-P-0300 LEAD MATERIAL PACKAGE MASS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm −8− CXA1522P/M/N + 0.4 1.85 – 0.15 0.15 + 0.2 0.1 – 0.05 + 0.1 0.2 – 0.05 EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.2g + 0.4 1.85 – 0.15 0.15 + 0.2 0.1 – 0.05 + 0.1 EPOXY RESIN SOLDER PLATING COPPER ALLOY ...
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... DETAIL B : PALLADIUM NOTE: Dimension "∗" does not include mold protrusion. PACKAGE STRUCTURE DETAIL A PACKAGE MATERIAL SSOP-16P-L01 LEAD TREATMENT P-SSOP16-4.4x5.0-0.65 LEAD MATERIAL PACKAGE MASS −9− CXA1522P/M/N + 0.2 0.1 EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g + 0.2 0.1 EPOXY RESIN PALLADIUM PLATING COPPER ALLOY ...