NL27WZ16DTT1

Manufacturer Part NumberNL27WZ16DTT1
DescriptionNL27WZ16DTT1Dual Buffer
ManufacturerON Semiconductor
NL27WZ16DTT1 datasheet
 


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CASE ISSUE L

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A
L
6
5
4
S
1
2
3
G
0.05 (0.002)
H
1.9
0.075
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NL27WZ16
PACKAGE DIMENSIONS
SOT23−6/TSOP−6/SC59−6
DT SUFFIX
CASE 318G−02
ISSUE L
B
D
M
J
C
K
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
0.95
0.037
1.0
0.039
SCALE 10:1
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6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
2.90
3.10
0.1142 0.1220
B
1.30
1.70
0.0512 0.0669
C
0.90
1.10
0.0354 0.0433
D
0.25
0.50
0.0098 0.0197
G
0.85
1.05
0.0335 0.0413
H
0.013
0.100
0.0005 0.0040
J
0.10
0.26
0.0040 0.0102
K
0.20
0.60
0.0079 0.0236
L
1.25
1.55
0.0493 0.0610
_
_
_
_
M
0
10
0
10
S
2.50
3.00
0.0985 0.1181
0.7
0.028
mm
inches
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NL27WZ16/D