MT48LC4M16A2TG-75IT Micron Semiconductor Products, MT48LC4M16A2TG-75IT Datasheet

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MT48LC4M16A2TG-75IT

Manufacturer Part Number
MT48LC4M16A2TG-75IT
Description
SYNCHRONOUS DRAM
Manufacturer
Micron Semiconductor Products
Datasheet

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SYNCHRONOUS
DRAM
FEATURES
• PC66-, PC100- and PC133-compliant
• Fully synchronous; all signals registered on
• Internal pipelined operation; column address can
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, includes CONCURRENT AUTO
• Self Refresh Modes: standard and low power
• 64ms, 4,096-cycle refresh
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
OPTIONS
• Configurations
• WRITE Recovery (
• Plastic Package – OCPL
• Timing (Cycle Time)
• Self Refresh
• Operating Temperature Range
NOTE: 1. Refer to Micron Technical Note: TN-48-05.
64Mb: x4, x8, x16 SDRAM
64MSDRAM_D.p65 – Rev. D; Pub. 5/01
positive edge of system clock
be changed every clock cycle
PRECHARGE, and Auto Refresh Modes
t
54-pin TSOP II (400 mil)
10ns @ CL = 2 (PC100)
7.5ns @ CL = 3 (PC133)
7.5ns @ CL = 2 (PC133)
Standard
Low Power
Commercial (0°C to +70°C)
Extended (-40°C to +85°C)
WR = “2 CLK”
16 Meg x 4
8 Meg x 8
4 Meg x 16 (1 Meg x 16 x 4 banks)
2. Off-center parting line.
3. Consult Micron for availability.
4. Not recommended for new designs.
5. Shown for PC100 compatibility.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
MT48LC8M8A2TG-75
1
(4 Meg x 4
(2 Meg x 8
Part Number Example:
t
WR)
2
x 4 banks)
x 4 banks)
MARKING
16M4
None
None
4M16
8M8
-8E
-75
-7E
IT
TG
A2
L
3
3, 4,5
1
MT48LC16M4A2 – 4 Meg x 4 x 4 banks
MT48LC8M8A2 –
MT48LC4M16A2 – 1 Meg x 16 x 4 banks
For the latest data sheet, please refer to the Micron Web
site:
KEY TIMING PARAMETERS
* CL = CAS (READ) latency
GRADE
-8E
-8E
Note: The # symbol indicates signal is active LOW. A dash (–)
SPEED
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
DQ0
DQ1
-7E
x4
-7E
-75
-75
NC
NC
NC
NC
NC
NC
NC
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3, 4, 5
3, 4, 5
www.micron.com/datasheets
DQ0
DQ1
DQ2
DQ3
x8
NC
NC
NC
NC
NC
PIN ASSIGNMENT (Top View)
indicates x8 and x4 pin function is same as x16 pin function.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DQML
FREQUENCY
Micron Technology, Inc., reserves the right to change products or specifications without notice.
V
V
x16
CAS#
RAS#
VssQ
VssQ
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
WE#
DD
DD
BA0
BA1
A10
V
V
V
CS#
133 MHz
143 MHz
133 MHz
A0
A1
A2
A3
125 MHz
100 MHz
100 MHz
DD
DD
DD
CLOCK
Q
Q
4 Meg x 4 x 4 banks
16 Meg x 4
4 (BA0, BA1)
4K (A0-A11)
1K (A0-A9)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54-Pin TSOP
2 Meg x 8 x 4 banks
4K
CL = 2* CL = 3*
64Mb: x4, x8, x16
ACCESS TIME
5.4ns
6ns
6ns
2 Meg x 8 x 4 banks
4 (BA0, BA1)
4K (A0-A11)
512 (A0-A8)
8 Meg x 8
5.4ns
5.4ns
4K
6ns
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
©2001, Micron Technology, Inc.
SETUP
TIME
1.5ns
x16
Vss
DQ15
VssQ
DQ14
DQ13
V
DQ12
DQ11
VssQ
DQ10
DQ9
V
DQ8
Vss
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
Vss
1.5ns
1.5ns
1.5ns
SDRAM
1 Meg x 16 x 4 banks
2ns
2ns
DD
DD
Q
Q
4 Meg x 16
4 (BA0, BA1)
4K (A0-A11)
256 (A0-A7)
x8
-
DQ7
-
NC
DQ6
-
NC
DQ5
-
NC
DQ4
-
NC
-
-
DQM
-
-
-
-
-
-
-
-
-
-
-
4K
HOLD
TIME
0.8ns
0.8ns
0.8ns
0.8ns
1ns
1ns
-
NC
-
NC
DQ3
-
NC
NC
-
NC
DQ2
NC
-
-
DQM
-
-
-
-
-
-
-
-
-
-
-
x4
-

Related parts for MT48LC4M16A2TG-75IT

MT48LC4M16A2TG-75IT Summary of contents

Page 1

SYNCHRONOUS DRAM FEATURES • PC66-, PC100- and PC133-compliant • Fully synchronous; all signals registered on positive edge of system clock • Internal pipelined operation; column address can be changed every clock cycle • Internal banks for hiding row access/precharge • ...

Page 2

... SDRAM PART NUMBERS PART NUMBER ARCHITECTURE MT48LC16M4A2TG 16 Meg x 4 MT48LC8M8A2TG 8 Meg x 8 MT48LC4M16A2TG 4 Meg x 16 GENERAL DESCRIPTION ® The Micron 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory 67,108,864 bits internally configured as a quad- bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’ ...

Page 3

TABLE OF CONTENTS Functional Block Diagram –16 Meg x 4 ............... Functional Block Diagram – 8 Meg x 8 ............... Functional Block Diagram – 4 Meg x 16 ............. Pin Descriptions ...................................................... Functional Description ......................................... Initialization ...................................................... Register Definition ............................................ ...

Page 4

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH COUNTER MODE REGISTER 12 12 A0-A11, ADDRESS 14 BA0, BA1 REGISTER 10 64Mb: x4, x8, x16 SDRAM 64MSDRAM_D.p65 – Rev. D; Pub. 5/01 FUNCTIONAL BLOCK DIAGRAM 16 Meg x 4 SDRAM ...

Page 5

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH COUNTER MODE REGISTER 12 12 A0-A11, ADDRESS 14 BA0, BA1 REGISTER 9 64Mb: x4, x8, x16 SDRAM 64MSDRAM_D.p65 – Rev. D; Pub. 5/01 FUNCTIONAL BLOCK DIAGRAM 8 Meg x 8 SDRAM ...

Page 6

CKE CLK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH COUNTER MODE REGISTER 12 12 A0-A11, ADDRESS 14 BA0, BA1 REGISTER 8 64Mb: x4, x8, x16 SDRAM 64MSDRAM_D.p65 – Rev. D; Pub. 5/01 FUNCTIONAL BLOCK DIAGRAM 4 Meg x 16 SDRAM ...

Page 7

PIN DESCRIPTIONS PIN NUMBERS SYMBOL 38 CLK 37 CKE 19 CS# 16, 17, 18 WE#, CAS#, RAS# 39 x4, x8: DQM 15, 39 x16: DQML, DQMH 20, 21 BA0, BA1 23-26, 29-34, 22, 35 A0-A11 ...

Page 8

FUNCTIONAL DESCRIPTION In general, the 64Mb SDRAMs (4 Meg banks, 2 Meg banks and 1 Meg banks) are quad- bank DRAMs which operate at 3.3V and include a ...

Page 9

Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is deter- mined ...

Page 10

CAS Latency The CAS latency is the delay, in clock cycles, be- tween the registration of a READ command and the availability of the first piece of output data. The la- tency can be set to two or three clocks. ...

Page 11

Commands Truth Table 1 provides a quick reference of available commands. This is followed by a written de- scription of each command. Three additional Truth TRUTH TABLE 1 – COMMANDS AND DQM OPERATION (Note : 1) NAME (FUNCTION) COMMAND INHIBIT ...

Page 12

COMMAND INHIBIT The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, re- gardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected. NO OPERATION (NOP) The ...

Page 13

AUTO REFRESH AUTO REFRESH is used during normal operation of the SDRAM and is analagous to CAS#-BEFORE-RAS# (CBR) REFRESH in conventional DRAMs. This com- mand is nonpersistent must be issued each time a refresh is required. All active ...

Page 14

Operation BANK/ROW ACTIVATION Before any READ or WRITE commands can be is- sued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the AC- TIVE command, which selects both the bank ...

Page 15

READs READ bursts are initiated with a READ command, as shown in Figure 5. The starting column and bank addresses are pro- vided with the READ command, and auto precharge is either enabled or disabled for that burst access. If ...

Page 16

CAS latency minus one. This is shown in Figure 7 for CAS latencies of two and three; data element ...

Page 17

T0 CLK COMMAND READ BANK, ADDRESS COL CLK COMMAND READ BANK, ADDRESS COL n DQ NOTE: Each READ command may be to any bank. DQM is LOW. 64Mb: x4, x8, x16 SDRAM 64MSDRAM_D.p65 – Rev. D; Pub. ...

Page 18

Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixed- length READ burst may be immediately followed by data from a WRITE command (subject to bus turn- around limitations). The WRITE burst ...

Page 19

A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not acti- vated), and a full-page burst may be truncated with a PRECHARGE command to the same ...

Page 20

PRECHARGE command is that it requires that the com- mand and address buses be available at the appropri- ate time to issue the command; the advantage of the PRECHARGE command is that it can be used to trun- cate fixed-length ...

Page 21

WRITEs WRITE bursts are initiated with a WRITE command, as shown in Figure 13. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge ...

Page 22

Data for any WRITE burst may be truncated with a subsequent READ command, and data for a fixed- length WRITE burst may be immediately followed by a subsequent READ command. Once the READ com- mand is registered, the data inputs ...

Page 23

Fixed-length or full-page WRITE bursts can be trun- cated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coin- cident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM ...

Page 24

CLOCK SUSPEND The clock suspend mode occurs when a column ac- cess/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deacti- vated, “freezing” the synchronous logic. For each positive clock edge ...

Page 25

CONCURRENT AUTO PRECHARGE An access command (READ or WRITE) to another bank while an access command with auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT PRECHARGE. Micron SDRAMs support CONCURRENT AUTO PRECHARGE. Four ...

Page 26

WRITE with Auto Precharge 3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appear- ing CAS latency later. The PRECHARGE to bank ...

Page 27

TRUTH TABLE 2 – CKE (Notes: 1-4) CKE CKE CURRENT STATE n Power-Down Self Refresh Clock Suspend L H Power-Down Self Refresh Clock Suspend H L All Banks Idle All Banks Idle Reading or Writing H H ...

Page 28

TRUTH TABLE 3 – CURRENT STATE BANK n, COMMAND TO BANK n (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS#CAS# WE# Any Idle ...

Page 29

NOTE (continued): 5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an AUTO REFRESH command and ...

Page 30

TRUTH TABLE 4 – CURRENT STATE BANK n, COMMAND TO BANK m (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# WE# Any Idle Row L ...

Page 31

NOTE (continued): 4. AUTO REFRESH, SELF REFRESH and LOAD MODE REGISTER commands may only be issued when all banks are idle BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the ...

Page 32

ABSOLUTE MAXIMUM RATINGS* Voltage Supply DD DD Relative to V ............................................ -1V to +4.6V SS Voltage on Inputs I/O Pins Relative to V ............................................ -1V to +4.6V SS Operating Temperature, T (commercial) ...................................... ...

Page 33

CAPACITANCE (Note: 2; notes appear on page 35) PARAMETER Input Capacitance: CLK Input Capacitance: All other input-only pins Input/Output Capacitance: DQs ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Notes 11; notes appear on page 35); V ...

Page 34

AC FUNCTIONAL CHARACTERISTICS (Notes 11; notes appear on page 35) V PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM ...

Page 35

NOTES 1. All voltages referenced This parameter is sampled MHz 25°C; pin under test biased at 1.4V dependent on output loading and cycle rates. DD Specified ...

Page 36

INITIALIZE AND LOAD MODE REGISTER CLK ( ( ) ) t CKH t CKS ( ( ) ) CKE ( ( ) ) t CMS t CMH t CMS t CMH ( ( ) ) COMMAND ...

Page 37

CLK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE DQM / DQML, DQMH A0-A9, A11 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High-Z DQ Two clock cycles Precharge ...

Page 38

CLK t CKS t CKH CKE t CKS t CKH t CMS t CMH COMMAND READ NOP t CMS t CMH DQM / DQML, DQMH A0-A9, A11 COLUMN m ...

Page 39

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE NOP DQM / DQML, DQMH A0-A9, A11 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High Precharge ...

Page 40

T0 T1 CLK t CK CKE t CKS t CKH t CMS t CMH COMMAND PRECHARGE DQM/ DQML, DQMH A0-A9, A11 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK(S) High Precharge all active ...

Page 41

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 DISABLE AUTO PRECHARGE ...

Page 42

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ENABLE AUTO PRECHARGE ROW A10 ...

Page 43

SINGLE READ – WITHOUT AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 ...

Page 44

SINGLE READ – WITH AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11, A12 ROW ROW ...

Page 45

ALTERNATING BANK READ ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ENABLE AUTO PRECHARGE ROW ...

Page 46

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM / DQML, DQMH COLUMN m 2 A0-A9, A11 ROW ...

Page 47

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ENABLE AUTO PRECHARGE ROW A10 DISABLE AUTO PRECHARGE ...

Page 48

WRITE – WITHOUT AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 DISABLE ...

Page 49

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM / DQML, DQMH COLUMN m 2 A0-A9, A11 ROW ENABLE ...

Page 50

SINGLE WRITE – WITHOUT AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 ...

Page 51

SINGLE WRITE – WITH AUTO PRECHARGE CLK t CKS t CKH CKE t CMS t CMH NOP 3 COMMAND ACTIVE DQM / DQML, DQMH A0-A9, A11 ROW ...

Page 52

ALTERNATING BANK WRITE ACCESSES CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP t CMS DQM / DQML, DQMH COLUMN m 2 A0-A9, A11 ROW t ...

Page 53

CLK CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 ...

Page 54

CLK t CKS t CKH CKE t CMS t CMH COMMAND ACTIVE NOP DQM / DQML, DQMH A0-A9, A11 ROW ROW A10 BA0, BA1 ...

Page 55

TYP .45 .30 PIN #1 ID .75 (2X) 1.00 (2X) NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per ...

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