GS84018AGT-166 GSI Technology, GS84018AGT-166 Datasheet

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GS84018AGT-166

Manufacturer Part Number
GS84018AGT-166
Description
Manufacturer
GSI Technology
Datasheet
TQFP, BGA
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipelined
• Single Cycle Deselect (SCD) operation
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipelined mode
• Byte Write (BW) and/or Global Write (GW) operation
• Common data inputs and data outputs
• Clock control, registered, address, data, and control
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC standard 100-lead TQFP or 119-bump BGA
• RoHS-compliant 100-lead TQFP and 119-bump BGA
Functional Description
Applications
The GS84018/32/36A is a 4,718,592-bit (4,194,304-bit for
x32 version) high performance synchronous SRAM with a 2-
bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications ranging from DSP main store
to networking chip set support. The GS84018/32/36A is
available in a JEDEC standard 100-lead TQFP or 119-Bump
BGA package.
Controls
Addresses, data I/Os, chip enables (E
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Rev: 1.19 10/2007
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
operation
packages
packages available
1
, E
256K x 18, 128K x 32, 128K x 36
Through
Pipeline
3-1-1-1
2-1-1-1
2
Flow
, E
3
4Mb Sync Burst SRAMs
), address burst
tCycle
tCycle
t
I
t
I
KQ
DD
KQ
DD
Parameter Synopsis
1/31
335 mA
210 mA
5.5 ns
3.0 ns
–180
8 ns
9 ns
310 mA
190 mA
6.0 ns
3.5 ns
8.5 ns
10 ns
–166
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin/bump (pin 14 in the TQFP and
bump 5R in the BGA). Holding the FT mode pin/bump low
places the RAM in Flow Through mode, causing output data to
bypass the Data Output Register. Holding FT high places the
RAM in Pipelined mode, activating the rising-edge-triggered
Data Output Register.
SCD Pipelined Reads
The GS84018/32/36A is an SCD (Single Cycle Deselect)
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)
versions are also available. SCD SRAMs pipeline deselect
commands one stage less than read commands. SCD RAMs
begin turning off their outputs immediately after the deselect
command has been captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using byte write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS84018/32/36A operates on a 3.3 V power supply and
all inputs/outputs are 3.3 V- and 2.5 V-compatible. Separate
output power (V
from the internal circuit.
280 mA
165 mA
6.6 ns
3.8 ns
10 ns
12 ns
–150
GS84018/32/36AT/B-180/166/150/100
DDQ
190 mA
135 mA
4.5 ns
10 ns
12 ns
15 ns
–100
) pins are used to de-couple output noise
180 MHz–100 MHz
3.3 V and 2.5 V I/O
© 1999, GSI Technology
3.3 V V
DD

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GS84018AGT-166 Summary of contents

Page 1

... DD Flow 8 Through tCycle 2-1-1-1 I 210 mA 190 mA 165 mA DD 1/31 GS84018/32/36AT/B-180/166/150/100 180 MHz–100 MHz 3 3.3 V and 2.5 V I/O ) pins are used to de-couple output noise DDQ –100 10 ns 4.5 ns 190 135 mA © 1999, GSI Technology DD ...

Page 2

... DDQ DQP VDDQ VDD VDDQ VDDQ © 1999, GSI Technology ...

Page 3

... DDQ DDQ DDQ © 1999, GSI Technology ...

Page 4

... DDQ DDQ DDQ DQP 51 A © 1999, GSI Technology ...

Page 5

... Data I/O Pin; Byte B 9th Data I/O Pin; Byte C 9th Data I/O Pin; Byte D Sleep Mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply No Connect 5/31 © 1999, GSI Technology ...

Page 6

... GS84018/32/36AT/B-180/166/150/100 DDQ DQP DDQ DDQ DDQ DDQ © 1999, GSI Technology ...

Page 7

... DDQ DDQ DDQ DDQ DDQ © 1999, GSI Technology ...

Page 8

... DQP DDQ DDQ DDQ DQP DDQ © 1999, GSI Technology ...

Page 9

... Data I/O Pin; Byte B 9th Data I/O Pin; Byte C 9th Data I/O Pin; Byte D Sleep Mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply No Connect 9/31 © 1999, GSI Technology ...

Page 10

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS84018/32/36AT/B-180/166/150/100 GS84018/32/36A Block Diagram Counter Load Register D Q Register D Q Register D Q Register D Q Register D Q Register D Q Register 10/31 A Memory Array DQxn–DQxn © 1999, GSI Technology ...

Page 11

... Interleaved Burst Sequence 10 11 1st address 11 00 2nd address 00 01 3rd address 01 10 4th address Note: The burst counter wraps to initial state on the 5th clock. 11/31 GS84018/32/36AT/B-180/166/150/100 = I SB A[1:0] A[1:0] A[1:0] A[1: © 1999, GSI Technology ...

Page 12

... may be used in any combination with BW to write single or multiple bytes. D 12/31 GS84018/32/36AT/B-180/166/150/100 B B Notes © 1999, GSI Technology ...

Page 13

... © 1999, GSI Technology High-Z X High-Z X High ...

Page 14

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Simplified State Diagram X Deselect First Write Burst Write 14/31 GS84018/32/36AT/B-180/166/150/100 First Read Burst Read CR ) and Write ( and GW) control inputs © 1999, GSI Technology ...

Page 15

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Simplified State Diagram with G X Deselect First Write Burst Write 15/31 GS84018/32/36AT/B-180/166/150/100 First Read Burst Read CR © 1999, GSI Technology ...

Page 16

... V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. DDn 16/31 GS84018/32/36AT/B-180/166/150/100 Value –0.5 to 4.6 –0.5 to 4.6 –0 +0.5 (≤ 4.6 V max.) DDQ –0 +0.5 (≤ 4.6 V max.) DD +/–20 +/–20 1.5 –55 to 125 –55 to 125 Typ. Max. Unit 3.3 3.6 V 3.3 3.6 V 2.5 2.7 V © 1999, GSI Technology Unit Notes ...

Page 17

... V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. DDn Overshoot Measurement and Timing 17/31 Max. Unit Notes 0.3 V 1,3 DDQ 0 0.3 V 1,3 DDQ 0.3*V V 1,3 DD Max. Unit Notes ° ° 50% tKC © 1999, GSI Technology ...

Page 18

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Symbol Test conditions I/O OUT Conditions V – DDQ Fig. 1 Output Load 1 DQ 50Ω V DDQ/2 * Distributed Test Jig Capacitance 18/31 GS84018/32/36AT/B-180/166/150/100 Typ. Max. Unit 30pF © 1999, GSI Technology ...

Page 19

... GSI Technology Max 100 — — 0.4 V –40 Unit to 85°C 200 mA 145 ...

Page 20

... GSI Technology Unit ...

Page 21

... ADSC initiated read and E3 only sampled with ADSP and ADSC tS tOHZ tH Q(A) D(B) 21/31 GS84018/32/36AT/B-180/166/150/100 Read C+1 Read C+2 Read C+3 Cont Burst Read Burst Read Deselected with E1 E1 masks ADSP tKQ tLZ Q(C) Q(C+1) Q(C+2) Q(C+3) © 1999, GSI Technology Deselect tKQX tHZ ...

Page 22

... Flow Through Mode Timing Cont Write B Read C Read C+1 Read C+2 Read C+3 Read C tKL tKL tKC tKC Fixed High tS tH ADSC initiated read tKQ tOHZ tLZ D(B) Q(C) 22/31 GS84018/32/36AT/B-180/166/150/100 Cont Deselected with E1 Q(C+1) Q(C+2) Q(C+3) Q(C) © 1999, GSI Technology Deselect tHZ tKQX ...

Page 23

... Rev: 1.19 10/2007 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Sleep Mode Timing Diagram tKH tKH tKC tKC tKL tKL tZZS tZZH 23/31 GS84018/32/36AT/B-180/166/150/100 tZZR © 1999, GSI Technology ...

Page 24

... All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion. Rev: 1.19 10/2007 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS84018/32/36AT/B-180/166/150/100 θ 0.10 0.15 1.40 1.45 0.30 0.40 — 0.20 e 22.0 22.1 20.0 20.1 16.0 16.1 b 14.0 14.1 0.65 — 0.60 0.75 1.00 — 0.10 — 7° 24/ © 1999, GSI Technology ...

Page 25

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS84018/32/36AT/B-180/166/150/100 BOTTOM VIEW Ø0. Ø0. Ø0.60~0.90 (119x) Ø1.00(3x) REF 0.20(4x) 25/ 1.27 7.62 14±0.20 © 1999, GSI Technology ...

Page 26

... GS84036AT-180I 128K x 36 GS84036AT-166I 128K x 36 GS84036AT-150I 128K x 36 GS84036AT-100I 256K x 18 GS84018AGT-180 256K x 18 GS84018AGT-166 256K x 18 GS84018AGT-150 256K x 18 GS84018AGT-100 128K x 32 GS84032AGT-180 128K x 32 GS84032AGT-166 Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS84032AT-8T. ...

Page 27

... GS84032AGT-100 128K x 36 GS84036AGT-180 128K x 36 GS84036AGT-166 128K x 36 GS84036AGT-150 128K x 36 GS84036AGT-100 256K x 18 GS84018AGT-180I 256K x 18 GS84018AGT-166I 256K x 18 GS84018AGT-150I 256K x 18 GS84018AGT-100I 128K x 32 GS84032AGT-180I 128K x 32 GS84032AGT-166I 128K x 32 GS84032AGT-150I 128K x 32 GS84032AGT-100I 128K x 36 ...

Page 28

... GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings. Rev: 1.19 10/2007 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. ...

Page 29

... GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings. Rev: 1.19 10/2007 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. ...

Page 30

... Operating DD Content Currents table • Corrected incorrect package type in ordering information table Content • Removed 200 MHz references from entire datasheet Content • Updated format Content • Added 190 MHz speed bin 30/31 GS84018/32/36AT/B-180/166/150/100 © 1999, GSI Technology ...

Page 31

... BGA RoHS part, corrected incorrect temperature designator in ordering information table • Added note to TQFP pinouts (pg Content • Updated Power Supply Voltage Ranges table (pg. 16) • Updated Logic Level tables (pg. 17) • Removed 190 MHz speed bin Content 31/31 GS84018/32/36AT/B-180/166/150/100 © 1999, GSI Technology ...

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