TQM7M4022 TriQuint Semiconductor, TQM7M4022 Datasheet

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TQM7M4022

Manufacturer Part Number
TQM7M4022
Description
Manufacturer
TriQuint Semiconductor
Datasheet

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Part Number:
TQM7M4022
Manufacturer:
Triquint
Quantity:
1 400
Description:
Advanced quad-band, compact 3V power amplifier module
designed for mobile handset applications. The small size and
high performance is achieved with high-reliability InGaP HBT
technology. The module is fully integrated, providing a simple
50 Ohms interface on all input and output ports. No external
matching or bias components are required. Despite its very
compact size, the module has exceptional efficiency in all
bands. Band select and power control inputs on the module
are CMOS compatible.
Features:
Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13)
All specifications subject to change without notice
x Very compact size – 7x7x1.3mm³
x High efficiency – typical GSM850 53%,
x Positive supply voltage – 3.0 to 4.5 V.
x No reference voltage needed
x 50 : input and output impedances.
x GPRS class 12 compatible.
x CMOS band select and power control
x High-reliability InGaP technology.
x Ruggedness 10:1.
3V Quad-Band GSM850/900/DCS/PCS Power Amplifier Module
! Caution! ESD sensitive device.
GSM900 58%, DCS 50%, PCS 50%.
inputs.
7mm x 7mm LGA Package
Outline:
Dimensions in mm
Top view
Bottom view
Side view
TQM7M4022
( Preliminary data sheet)
2

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TQM7M4022 Summary of contents

Page 1

... High-reliability InGaP technology. x Ruggedness 10:1. ! Caution! ESD sensitive device. Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice TQM7M4022 ( Preliminary data sheet) 7mm x 7mm LGA Package Outline: Dimensions in mm Top view Bottom view ...

Page 2

... Current Input capacitance Rise time 4 Transmit Enable TX_EN on TX_EN off Current 5 Band Select High Low Current Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice Specifications Symbol Min Typ Max Unit V -0.5 6.0 V BATT I 2 ...

Page 3

... Power added efficiency 13 Power supply current 14 Output noise power, BW=100kHz 869 MHz... 894 MHz 15 Slope P /V OUT RAMP Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice =25° =50:; V =3.5V; BS=low; TX_EN=high BATT = V ...

Page 4

... Output noise power, BW=100kHz 925 MHz ... 935 MHz 935 MHz ... 960 MHz 15 Slope P /V OUT RAMP Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice =25° =50:; V =3.5V; BS=low; TX_EN=high BATT ...

Page 5

... Power added efficiency 12 Power supply current 13 Output noise power, BW=100kHz 1805 MHz ... 1880 MHz 14 Slope P /V OUT RAMP Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice =25° =50:; V =3.5V; BS=high; TX_EN=high BATT = V ...

Page 6

... Power added efficiency 12 Power supply current 13 Output noise power, BW=100kHz 1930 MHz ... 1990 MHz 14 Slope P /V OUT RAMP Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice =25° =50:; V =3.5V; BS=high; TX_EN=high BATT = V ...

Page 7

... Block Diagram GSM850 / 900 in VRAMP VBATT TX_EN BS DCS / PCS in 8. Pin Out Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice Logic Power Control GSM850 / 900 out VCC DCS / PCS out 8 ...

Page 8

... DCS / PCS out 11 GND 12 VCC 13 GND 14 GSM850 / 900 out 15, 16, GND 17 Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice TQM7M4022 Footprint Top View Function GSM850 / GSM900 RF input ...

Page 9

... Package Outline (all dimensions in mm): Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice 10 ...

Page 10

... Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice 11 ...

Page 11

... PITCH DISTANCE BETWEEN CAVITY TO PERFORATION LENGTH DIRECTION CENTERLINE CAVITY TO PERFORATION WIDTH DIRECTION COVER TAPE WIDTH CARRIER TAPE WIDTH Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice SYMBOL SIZE (in) SIZE (mm) D1 0.059 1.50 D0 0.059 1 ...

Page 12

... FLANGE DIAMETER THICKNESS SPACE BETWEEN FLANGE HUB OUTER DIAMETER ARBOR HOLE DIAMETER KEY SLIT WIDTH KEY SLIT DIAMETER Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice SYMBOL SIZE (in) SIZE (mm) A 12.992 330.0 W2 ...

Page 13

... Completed Tape and Reel Assembly Product label, Mfg Label and ESD label are placed on the flange opposite to the sprockets in the carrier tape Copyright © 2004 TriQuint Semiconductor Inc., All rights reserved (Rev 3.6 2004-08-13) All specifications subject to change without notice 14 ...

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