NQ5000P Intel Corporation, NQ5000P Datasheet

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NQ5000P

Manufacturer Part Number
NQ5000P
Description
5000P Memory Controller Hub (MCH)
Manufacturer
Intel Corporation
Datasheet

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Dual-Core Intel® Xeon®
Processor 5000 Series
Datasheet
May 2006
Document Number: 313079-001

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NQ5000P Summary of contents

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet May 2006 Document Number: 313079-001 ...

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... Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Intel Xeon, Intel SpeedStep, Intel NetBurst, Intel Architecture, Intel Virtualization Technology, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. ...

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Contents 1 Introduction................................................................................................................. 9 1.1 Terminology ..................................................................................................... 11 1.2 State of Data .................................................................................................... 12 1.3 References ....................................................................................................... 12 2 Electrical Specifications ............................................................................................... 15 2.1 Front Side Bus and GTLREF ................................................................................ 15 2.2 Power and Ground Lands.................................................................................... 15 2.3 Decoupling Guidelines ...

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Tcontrol and Fan Speed Reduction ............................................................79 6.2.7 Thermal Diode........................................................................................79 7 Features ....................................................................................................................83 7.1 Power-On Configuration Options ..........................................................................83 7.2 Clock Control and Low Power States .....................................................................83 7.2.1 Normal State .........................................................................................84 7.2.2 HALT or Enhanced Powerdown States ........................................................84 7.2.3 Stop-Grant State ...

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Boxed Dual-Core Intel Xeon Processor 5000 Series 1U Passive/2U Active Combination Heat Sink (With Removable Fan) ............................. 89 8-2 Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink .................. 90 8-3 2U Passive Dual-Core Intel Xeon Processor ...

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Power-On Configuration Option Lands...................................................................83 8-1 PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution................ 100 8-2 Fan Specifications for 4-pin Active CEK Thermal Solution....................................... 100 8-3 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution........................ 100 ...

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Revision History Revision 001 Initial release Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Description Date May 2006 7 ...

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Features Dual-Core processor Available at 3.73 GHz processor speed Includes 16-KB Level 1 data cache per core (2 x 16-KB) Includes 12-KB Level 1 trace cache per core (2 x 12-KB) 2-MB Advanced Transfer Cache per core (2 x 2-MB, ...

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Introduction 1 Introduction The Dual-Core Intel processor (DP) servers and workstations. The Dual-Core Intel Xeon Processor 5000 series are 64-bit server/workstation processors utilizing two physical Intel NetBurst microarchitecture cores in one package. The Dual-Core Intel Xeon Processor 5000 series include ...

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For further information on Execute Disable Bit functionality see eng/149308.htm. The Dual-Core Intel Xeon Processor 5000 series support Intel Technology, virtualization within the processor. Intel Virtualization Technology is a ...

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Introduction 1.1 Terminology A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the asserted state when driven to a low level. For example, when RESET# is low, a reset has been ...

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Thermal Design Power – Processor thermal solutions should be designed to meet this target the highest expected sustainable power while running known power intensive real applications. TDP is not the maximum power that the processor can dissipate. ...

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Introduction ® Dual-Core Intel Xeon EPS12V Power Supply Design Guide: A Server system Infrastructure (SSI) Specification for Entry Chassis Power Supplies Entry-Level Electronics-Bay Specifications: A Server System Infrastructure (SSI) Specification for Entry Pedestal Servers and Workstations Dual-Core Intel® Xeon® Processor ...

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Introduction ...

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Electrical Specifications 2 Electrical Specifications 2.1 Front Side Bus and GTLREF Most Dual-Core Intel Xeon Processor 5000 series FSB signals use Assisted Gunning Transceiver Logic (AGTL+) signaling technology. This technology provides improved noise margins and reduced ringing through low voltage ...

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Decoupling Guidelines Due to its large number of transistors and high internal clock speeds, the Dual-Core Intel Xeon Processor 5000 series are capable of generating large average current swings between low and full power states. This may cause voltages ...

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Electrical Specifications The processor core frequency is configured during reset by using values stored internally during manufacturing. The stored value sets the highest bus fraction at which the particular processor can operate. If lower speeds are desired, the appropriate ratio ...

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Phase Lock Loop (PLL) and Filter V and V are power sources required by the PLL clock generators on the Dual- CCA CCIOPLL Core Intel Xeon Processor 5000 series. Since these PLLs are analog in nature, they require low ...

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Electrical Specifications 2.5 Voltage Identification (VID) The Voltage Identification (VID) specification for the Dual-Core Intel Xeon Processor 5000 series set by the VID signals is the reference VR output voltage to be delivered to the processor Vcc pins. VID signals ...

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Table 2-3. Voltage Identification Definition (Sheet VID4 VID3 VID2 VID1 VID0 VID5 ...

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Electrical Specifications Note: 1. The MS_ID[1:0] signals are provided to indicate the Market Segment for the processor and may be used for future processor compatibility or for keying. System management software may utilize these signals to identify the processor installed. ...

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With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals whose timings are specified with respect to rising edge of BCLK0 (ADS#, HIT#, HITM#, ...

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Electrical Specifications Table 2-7 outlines the signals which include on-die termination (R signals are also included. Table 2-7. Signal Description Table Signals with R A[35:3]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BINIT#, BNR#, BPRI#, COMP[7:4], D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DP[3:0]#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, ...

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Similar considerations must be made for TCK, TMS, and TRST#. Two copies of each signal may be ...

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Electrical Specifications Notes: 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied. 2. Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in Excessive overshoot or undershoot on any ...

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Table 2-10. Voltage and Current Specifications (Sheet Symbol I I CC_RESET CC_RESET Processor 5000 series with multiple VID (1066 MHz CC_RESET CC_RESET Processor 5063 (MV) with multiple VID I Steady-state FSB Termination TT Current I ...

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Electrical Specifications 11. Minimum VCC and maximum ICC are specified at the maximum processor case temperature (TCASE) shown in Table 6-1. 12. This specification refers to the total reduction of the load line due to VID transitions below the specified ...

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Figure 2-3. Dual-Core Intel ® ® Intel Xeon Processor 5063 (MV) Load Current versus Time Notes: 1. Processor or Voltage Regulator thermal protection circuitry should not trip for load currents greater than I . CC_TDC 2. Not 100% tested. ...

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Electrical Specifications Table 2-11. V Static and Transient Tolerance (Sheet ( 100 105 110 115 120 125 130 135 140 145 150 Notes: 1. The V and V CC_MIN overshoot ...

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Refer to Table 2-11 4. The load lines specify voltage limits at the die measured at the VCC_DIE_SENSE and VSS_DIE_SENSE lands and at the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands. Voltage regulation feedback for voltage regulator circuits must also be taken ...

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Electrical Specifications Table 2-14. PWRGOOD Input and TAP Signal Group DC Specifications (Sheet Symbol Parameter I Input Leakage Current LI I Output Leakage Current LO R Buffer On Resistance ON Notes: 1. Unless otherwise noted, all specifications ...

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VID). These specifications apply to the processor die voltage as measured across the VCC_DIE_SENSE and VSS_DIE_SENSE lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands. Table 2-17. V Overshoot Specifications CC Symbol V Magnitude of V OS_MAX ...

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Mechanical Specifications 3 Mechanical Specifications The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The package consists of a processor core mounted ...

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Figure 3-2. Processor Package Drawing (Sheet Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal/Mechanical Design Guidelines. 34 Mechanical Specifications Dual-Core Intel® ...

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Mechanical Specifications Figure 3-3. Processor Package Drawing (Sheet Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 35 ...

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Figure 3-4. Processor Package Drawing (Sheet Mechanical Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Mechanical Specifications 3.2 Processor Component Keepout Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted ...

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R is defined as the radial distance from the center of the LGA771 socket ball array to the center of heatsink load reaction point closest to the socket. 11. Applies to populated sockets in fully populated and partially populated ...

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Mechanical Specifications 3.8 Processor Markings Figure 3-5 and Figure 3-6 aids in the identification of the Dual-Core Intel Xeon Processor 5000 series. Figure 3-5. Dual-Core Intel Xeon Processor 5000 Series Top-side Markings GROUP1LINE1 GROUP1LINE2 GROUP1LINE3 GROUP1LINE4 GROUP1LINE5 Figure 3-6. Dual-Core ...

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Processor Land Coordinates Figure 3-7 and Figure 3-8 coordinates, respectively. The coordinates are referred to throughout the document to identify processor lands. Figure 3-7. Processor Land Coordinates, Top View ...

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Mechanical Specifications Figure 3-8. Processor Land Coordinates, Bottom View Address / Common Clock / Async Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Mechanical Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Land Listing 4 Land Listing 4.1 Dual-Core Intel Xeon Processor 5000 Series Land Assignments This section provides sorted land list in all processor lands ordered alphabetically by land name. processor lands ordered by land number. 4.1.1 Land Listing by Land ...

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Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type D02# A4 Source Sync D03# C6 Source Sync D04# A5 Source Sync D05# B6 Source Sync D06# B7 Source Sync D07# A7 ...

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Land Listing Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type IGNNE# N2 ASync GTL+ INIT# P3 ASync GTL+ LINT0 K1 ASync GTL+ LINT1 L1 ASync GTL+ LL_ID0 V2 Power/Other LL_ID1 ...

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Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VCC AC8 Power/Other VCC AD23 Power/Other VCC AD24 Power/Other VCC AD25 Power/Other VCC AD26 Power/Other VCC AD27 Power/Other VCC AD28 Power/Other VCC ...

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Land Listing Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VCC AL19 Power/Other VCC AL21 Power/Other VCC AL22 Power/Other VCC AL25 Power/Other VCC AL26 Power/Other VCC AL29 Power/Other VCC AL30 ...

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Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VCC T29 Power/Other VCC T30 Power/Other VCC T8 Power/Other VCC U23 Power/Other VCC U24 Power/Other VCC U25 Power/Other VCC U26 Power/Other VCC ...

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Land Listing Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VSS AF10 Power/Other VSS AF13 Power/Other VSS AF16 Power/Other VSS AF17 Power/Other VSS AF20 Power/Other VSS AF23 Power/Other VSS AF24 ...

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Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VSS B1 Power/Other VSS B11 Power/Other VSS B14 Power/Other VSS B17 Power/Other VSS B20 Power/Other VSS B24 Power/Other VSS B5 Power/Other VSS ...

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Land Listing Table 4-1. Land Listing by Land Name (Sheet Land Signal Buffer Land Name No. Type VSS P25 Power/Other VSS P26 Power/Other VSS P27 Power/Other VTT B26 Power/Other VTT B27 Power/Other VTT B28 Power/Other VTT B29 ...

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Land Listing by Land Number Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type A10 D08# Source Sync A11 D09# Source Sync A12 VSS Power/Other A13 COMP0 Power/Other A14 D50# ...

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Land Listing Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type AD7 VSS Power/Other AD8 VCC Power/Other AE1 TCK TAP AE10 VSS Power/Other AE11 VCC Power/Other AE12 VCC Power/Other AE13 VSS ...

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Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type AG9 VCC Power/Other AH1 VSS Power/Other AH10 VSS Power/Other AH11 VCC Power/Other AH12 VCC Power/Other AH13 VSS Power/Other AH14 VCC Power/Other AH15 ...

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Land Listing Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type AL1 THERMDA Power/Other AL10 VSS Power/Other AL11 VCC Power/Other AL12 VCC Power/Other AL13 VSS Power/Other AL14 VCC Power/Other AL15 VCC ...

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Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type B14 VSS Power/Other B15 D53# Source Sync B16 D55# Source Sync B17 VSS Power/Other B18 D57# Source Sync B19 D60# Source Sync ...

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Land Listing Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type E15 D33# Source Sync E16 D34# Source Sync E17 VSS Power/Other E18 D39# Source Sync E19 D40# Source Sync E2 ...

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Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type H16 DP2# Common Clk H17 VSS Power/Other H18 VSS Power/Other H19 VSS Power/Other H2 GTLREF_ADD_C1 Power/Other H20 VSS Power/Other H21 VSS Power/Other ...

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Land Listing Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type M27 VCC Power/Other M28 VCC Power/Other M29 VCC Power/Other M3 STPCLK# ASync GTL+ M30 VCC Power/Other M4 A07# Source Sync ...

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Table 4-2. Land Listing by Land Number (Sheet Land Signal Buffer Land Name No. Type V2 LL_ID0 Power/Other V23 VSS Power/Other Y6 A19# Source Sync Y7 VSS Power/Other Y8 VCC Power/Other 60 Land Direction Land Name No. ...

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Signal Definitions 5 Signal Definitions 5.1 Signal Definitions Table 5-1. Signal Definitions (Sheet Name Type A[35:3]# I/O A[35:3]# (Address) define the address phase, these signals transmit the address of a transaction. In sub- ...

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Table 5-1. Signal Definitions (Sheet Name Type BINIT# I/O BINIT# (Bus Initialization) may be observed and driven by all processor FSB agents and if used, must connect the appropriate pins of all such agents. If the BINIT# ...

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Signal Definitions Table 5-1. Signal Definitions (Sheet Name Type D[63:0]# I/O D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the processor FSB agents, and must connect the appropriate pins on all ...

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Table 5-1. Signal Definitions (Sheet Name Type DSTBN[3:0]# I/O Data strobe used to latch in D[63:0]#. D[15:0]#, DBI0# D[31:16]#, DBI1# D[47:32]#, DBI2# D[63:48]#, DBI3# DSTBP[3:0]# I/O Data strobe used to latch in D[63:0]#. D[15:0]#, DBI0# D[31:16]#, DBI1# ...

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Signal Definitions Table 5-1. Signal Definitions (Sheet Name Type IGNNE# I IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute noncontrol floating-point instructions. If IGNNE# is deasserted, ...

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Table 5-1. Signal Definitions (Sheet Name Type PWRGOOD I PWRGOOD (Power Good input. The processor requires this signal clean indication that all processor clocks and power supplies are stable and within their ...

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Signal Definitions Table 5-1. Signal Definitions (Sheet Name Type TESTHI[11:0] I TESTHI[11:0] must be connected processor operation. Refer to THERMDA Other Thermal Diode Anode. THERMDA connects to processor core 0, THERMDA2 connects to processor ...

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Table 5-1. Signal Definitions (Sheet Name Type V P The FSB termination voltage input pins. Refer to TT VTT_OUT O The VTT_OUT signals are included in order to provide a local V require termination to V VTTPWRGD ...

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Thermal Specifications 6 Thermal Specifications 6.1 Package Thermal Specifications The Dual-Core Intel Xeon Processor 5000 series require a thermal solution to maintain temperatures within its operating limits. Any attempt to operate the processor outside these operating limits may result in ...

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Figure 6-2; Table 6-3 (that is, 1U form factor). Because of the reduced cooling capability represented by this thermal solution, the probability of TCC activation and performance loss is increased. Additionally, utilization of a thermal solution that does not meet ...

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Thermal Specifications Figure 6-1. Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profiles A and B TCASE_M thermal solution design point. In actuality, units will not significantly TCASE_M thermal solution design point. In ...

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Table 6-3. Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile B Table Power (W) P_profile_min =22 Table 6-4. Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal ...

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Thermal Specifications Figure 6-2. Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles TCASE_M thermal solution design point. In actuality, units w ill not significantly exceed TCASE_M thermal solution design point. In actuality, ...

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Table 6-6. Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table Power (W) P_profile_min =29 Table 6-7. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications Core Frequency Design Power ...

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Thermal Specifications Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Notes: 1. Thermal Profile is representative of a volumetrically constrained platform. Please ...

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T temperature measurements should be made. For detailed guidelines on CASE temperature measurement methodology, refer to the Dual-Core Intel Processor 5000 Series Thermal/Mechanical Design Guidelines. Figure 6-4. Case Temperature (T Note: Figure is not to scale and is for reference ...

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Thermal Specifications 6.2 Processor Thermal Features 6.2.1 Thermal Monitor The Thermal Monitor (TM1) feature helps control the processor temperature by activating the Thermal Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power ...

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On-Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On- Demand mode. 6.2.3 PROCHOT# Signal An external signal, ...

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Thermal Specifications 6.2.6 Tcontrol and Fan Speed Reduction Tcontrol is a temperature specification based on a temperature reading from the thermal diode. The value for Tcontrol will be calibrated in manufacturing and configured for each processor. The Tcontrol value is ...

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This trim value (Tdiode_Offset) will be programmed into the new diode correction MSR and then added to the Tdiode_Base value can be used to correct temperatures read ...

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Thermal Specifications Table 6-10. Thermal Diode Interface Land Name THERMDA THERMDC THERMDA2 THERMDC2 . Table 6-11. Thermal Diode Parameters using Transistor Model Symbol Parameter I Forward Bias Current FW I Emitter Current E n Transistor Ideality Q Beta R Series ...

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Thermal Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Features 7 Features 7.1 Power-On Configuration Options Several configuration options can be configured by hardware. The Dual-Core Intel Xeon Processor 5000 series samples its hardware configuration at reset, on the active-to- inactive transition of RESET#. For specifics on these options, ...

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Stop Grant SBC on the bus before allowing the processor to be transitioned into one of the lower processor power states. Refer to the applicable chipset specification for more ...

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Features The Enhanced HALT state must be enabled by way of the BIOS for the processor to remain within its specifications. The Enhanced HALT state requires support for dynamic VID transitions in the platform. Figure 7-1. Stop Clock State Machine ...

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RESET# will cause the processor to immediately initialize itself, but the processor will stay in Stop-Grant state. A transition back to the Normal state will occur with the de- assertion of the STPCLK# signal. A transition to the Grant Snoop ...

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Features Note: Not all Dual-Core Intel Xeon Processor 5000 series are capable of supporting Enhanced Intel SpeedStep Technology. More details on which processor frequencies will support this feature will be provided in future releases of the Dual-Core Intel 5000 Series ...

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Features ...

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Boxed Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel boxed processors are intended for system integrators who build systems from components available through distribution channels. The Dual-Core Intel Processor 5000 series will be offered as an Intel boxed processor. ...

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Figure 8-2. Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink Figure 8-3. 2U Passive Dual-Core Intel Xeon Processor 5000 Series Thermal Solution (Exploded View) Heat sink Heat sink screws screws Motherboard Motherboard and and processor processor Notes: ...

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Boxed Processor Specifications 8.2.1 Boxed Processor Heat Sink Dimensions (CEK) The boxed processor will be shipped with an unattached thermal solution. Clearance is required around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space requirements and ...

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Figure 8-4. Top Side Board Keep-Out Zones (Part 1) 92 Boxed Processor Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Boxed Processor Specifications Figure 8-5. Top Side Board Keep-Out Zones (Part 2) Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 93 ...

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Figure 8-6. Bottom Side Board Keep-Out Zones 94 Boxed Processor Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Boxed Processor Specifications Figure 8-7. Board Mounting Hole Keep-Out Zones Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 95 ...

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Figure 8-8. Volumetric Height Keep-Ins 96 Boxed Processor Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Boxed Processor Specifications Figure 8-9. 4-Pin Fan Cable Connector (For Active CEK Heat Sink) Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 97 ...

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Figure 8-10. 4-Pin Base Board Fan Header (For Active CEK Heat Sink) 98 Boxed Processor Specifications Dual-Core Intel® Xeon® Processor 5000 Series Datasheet ...

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Boxed Processor Specifications 8.2.2 Boxed Processor Heat Sink Weight 8.2.2.1 Thermal Solution Weight The 1U passive/2U active combination heat sink solution and the 2U passive heat sink solution will not exceed a mass of 1050 grams. Note that this is ...

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The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation the baseboard ...

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Boxed Processor Specifications 8.3.2.1 1U Passive/2U Active Combination Heat Sink Solution (1U Rack Passive) In the 1U configuration it is assumed that a chassis duct will be implemented to provide sufficient airflow to pass through the heat sink fins. Currently ...

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The other items listed in shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by baseboard vendors) • Heat sink standoffs (supplied by chassis vendors) 102 Figure 8-3 that are required to compete this ...

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Debug Tools Specifications 9 Debug Tools Specifications Please refer to the eXtended Debug Port: Debug Port Design Guide for UP and DP Platforms and the appropriate platform design guidelines for information regarding debug tool specifications. 9.1 Debug Port System Requirements ...

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Mechanical Considerations The LAI is installed between the processor socket and the processor. The LAI plugs into the socket, while the processor plugs into a socket on the LAI. Cabling that is part of the LAI egresses the system ...

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