RJ80530KZ933512

Manufacturer Part NumberRJ80530KZ933512
DescriptionLow Voltage Pentium III Processor with 512 kB L2 Cache
ManufacturerIntel Corporation
RJ80530KZ933512 datasheet
 


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Page 46/74:

Mechanical Specifications

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®
®
LV Intel
Pentium
III Processor 512K
5.0

Mechanical Specifications

5.1
Surface Mount Micro-FCBGA Package
The LV Intel Pentium
processor 512K is available in a surface mount, 479-ball Micro-FCBGA package.
III
Mechanical specifications are shown in
package.
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Because the die-side
capacitors are electrically conductive, and only slightly shorter than the die height, care should be taken to avoid
placing the capacitors in contact with electrically conductive materials. Doing so may short the capacitors, and can
damage the device or render it inactive. Consider using an insulating material between the capacitors and the
thermal solution to prevent shorting the capacitor.
Table 25. Micro-FCBGA Package Mechanical Specifications
Symbol
A
Overall height, as delivered (1)
A2
Die height
b
Ball diameter
D
Package substrate length
E
Package substrate width
D1
Die length
E1
Die width
e
Ball pitch
N
Ball count
K
Keep-out outline from edge of package
K1
Keep-out outline at corner of package
K2
Capacitor keep-out height
S
Package edge to first ball center
--
Solder ball coplanarity
Pdie
Allowable pressure on the die for thermal solution
W
Package weight
NOTES:
1. All dimensions are subject to change.
2. Overall height as delivered. Values were based on design specifications and tolerances. Final height after
surface mount depends on OEM motherboard design and SMT process.
Note: All dimensions are in millimeters. Values shown are for reference only.
46
Table
25.
Figure 22
through
Figure 25
Parameter
illustrate different views of the
Min
Max
Unit
2.27
2.77
mm
0.854
mm
0.78
mm
34.9
35.1
mm
34.9
35.1
mm
11.18
mm
7.19
mm
1.27
mm
479
each
5
mm
7
mm
0.7
mm
1.625
mm
0.2
mm
689
kPa
4.5
g
Datasheet