Thermal Specifications and Design Considerations
This section provides needed data for designing a thermal solution. The LV Intel Pentium
processor 512K uses micro flip-chip ball-grid-array packaging technology and has a junction
) specified at 100º C.
provides the thermal design power dissipation and maximum temperatures for the LV
processor 512K. Systems should design for the highest possible processor power,
even if a processor with a lower thermal dissipation is planned. A thermal solution should be
designed to ensure the junction temperature never exceeds these specifications.
Table 29. LV Intel Pentium
1. These values are specified at nominal Vcc
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL bus termination. The
maximum power for each of these components does not occur simultaneously.
In the event the processor drives the THERMTRIP# signal active during valid operation, both the
processor. Valid operation refers to the operating conditions where the THERMTRIP# signal is
guaranteed valid. The time required from THERMTRIP# asserted to V
is 5 seconds and THERMTRIP# asserted to V
Table 30. THERMTRIP# Time Requirement
NOTE: Once V
logic should ensure no “unsafe” power cycling occurs due to this deassertion.
Processor 512K Thermal Design Power
L2 Cache Size
Thermal Design Power
for the processor balls.
supplies to the processor must be turned off to prevent thermal runaway of the
rail at 1/2 nominal is 5 seconds.
1/2 Nominal V
1/2 Nominal V
supplies are turned off the THERMTRIP# signal will be deactivated. System
III Processor 512K
(Max, in W)
rail at 1/2 nominal
Time required for power drop