AD9261 Analog Devices, AD9261 Datasheet - Page 7

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AD9261

Manufacturer Part Number
AD9261
Description
16-Bit, 10 MHz Bandwidth, 30 MSPS to 160 MSPS Continuous Time Sigma-Delta ADC
Manufacturer
Analog Devices
Datasheet

Specifications of AD9261

Resolution (bits)
16bit
# Chan
1
Sample Rate
160MSPS
Interface
Par
Analog Input Type
Diff-Uni
Ain Range
2 V p-p
Adc Architecture
Sigma-Delta
Pkg Type
CSP
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DVDD to DGND
DRVDD to DGND
AGND to DGND
AVDD to DRVDD
CVDD to CGND
CGND to DGND
D0 to D15 to DGND
DCO to DGND
OR to DGND
PDWN to GND
PLLMULTx to DGND
SDIO to DGND
CSB to AGND
SCLK to AGND
VIN+, VIN− to AGND
CLK+, CLK− to CGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 Sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.5 V
−0.3 V to +2.0 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 7 of 28
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
48-Lead LFCSP (CP-48-1)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
ESD CAUTION
JA
.
JA
and θ
JC
are specified for a 4-layer board in still air.
θ
27.7
JA
θ
11.8
JB
θ
1.1
JC
AD9261
JA
Unit
°C/W
. In

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