AD5336 Analog Devices, AD5336 Datasheet - Page 4

• Manufacturer Part Number: AD5336
• Manufacturer: Analog Devices

Specifications of AD5336

• Resolution (bits): 10bit
• Dac Update Rate: 143kSPS
• Dac Settling Time: 7µs
• Max Pos Supply (v): +5.5V
• Single-supply: Yes
• Dac Type: Voltage Out
• Dac Input Format: Par

AD5334/AD5335/AD5336/AD5344
Model
AD5334BRU
AD5335BRU
AD5336BRU
AD5344BRU
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5334/AD5335/AD5336/AD5344 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(T
V
Digital Input Voltage to GND . . . . . . . . –0.3 V to V
Digital Output Voltage to GND . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . –0.3 V to V
V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP Package
DD
OUT
A
Power Dissipation . . . . . . . . . . . . . . . (T
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +105°C
θ
θ
θ
θ
= 25°C unless otherwise noted)
JA
JA
JC
JC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to GND . . . . . . . . . . . . . . . . . . . –0.3 V to V
Thermal Impedance (24-Lead TSSOP) . . . . . 128°C/W
Thermal Impedance (28-Lead TSSOP) . . . . . 97.9°C/W
Thermal Impedance (24-Lead TSSOP) . . . . . . 42°C/W
Thermal Impedance (28-Lead TSSOP) . . . . . . 14°C/W
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
J
max – T
DD
DD
DD
DD
A
)/θ
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
JA
Package Description
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
mW
–4–
Reflow Soldering
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/–0°C
Time at Peak Temperature . . . . . . . . . . . . .10 sec to 40 sec
WARNING!
ESD SENSITIVE DEVICE
Package Option
RU-24
RU-24
RU-28
RU-28
REV. 0